Stabilization of Poly(fluoroalkoxyphosphazene) (PFAP) Elastomer against Thermal Degradation

1978 ◽  
pp. 293-308 ◽  
Author(s):  
G. S. KYKER ◽  
J. K. VALAITIS
Keyword(s):  
Thermal Degradation

THERMAL DEGRADATION OF CERMET SOLAR SELECTIVE ABSORBERS

1981 ◽  
Vol 42 (C1) ◽  
pp. C1-301-C1-307
Author(s):  
I. T. Ritchie ◽  
J. Spitz
Keyword(s):  
Thermal Degradation

Aging processes of cement stone during thermal degradation and their control

2020 ◽  
pp. 155-161
Author(s):  
Sh.M. Rakhimbayev ◽  
◽  
T.V. Anikanova ◽  
I.M. Kolesnikov ◽  
◽  
...  
Keyword(s):  
Thermal Degradation ◽  
Cement Stone

Investigation of b-cyclodextrin peroxides’ thermal degradation by pyrolysis mass spectrometry

2016 ◽  
Vol 38 (4) ◽  
pp. 302-306
Author(s):  
V.V. Boyko ◽  
◽  
O.A. Radchenko ◽  
S.V. Riabov ◽  
S.I. Sinelnikov ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Thermal Degradation ◽  
Pyrolysis Mass Spectrometry

Thermal Degradation Analysis of Fluorocarbon Thin Films prepared by an r.f. Sputtering with Poly (tetrafluoroethylene) Target

2013 ◽  
Vol 56 (4) ◽  
pp. 133-135
Author(s):  
Yuki IKEDA ◽  
Satoru IWAMORI ◽  
Hiroyuki MATSUMOTO ◽  
Kiyoshi YOSHINO ◽  
Itsuo NISHIYAMA ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Degradation ◽  
Degradation Analysis

Dielectric Breakdown in Printed Circuit Boards at Elevated Temperatures

1996 ◽  
Author(s):  
P. Singh ◽  
G.T. Galyon ◽  
J. Obrzut ◽  
W.A. Alpaugh
Keyword(s):  
Experimental Data ◽  
Thermal Degradation ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Elevated Temperatures ◽  
Dielectric Breakdown ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Data Matching

Abstract A time delayed dielectric breakdown in printed circuit boards, operating at temperatures below the epoxy resin insulation thermo-electrical limits, is reported. The safe temperature-voltage operating regime was estimated and related to the glass-rubber transition (To) of printed circuit board dielectric. The TG was measured using DSC and compared with that determined from electrical conductivity of the laminate in the glassy and rubbery state. A failure model was developed and fitted to the experimental data matching a localized thermal degradation of the dielectric and time dependency. The model is based on localized heating of an insulation resistance defect that under certain voltage bias can exceed the TG, thus, initiating thermal degradation of the resin. The model agrees well with the experimental data and indicates that the failure rate and truncation time beyond which the probability of failure becomes insignificant, decreases with increasing glass-rubber transition temperature.

Synthesis, Characterization and Thermal Degradation of Some New 3,5-dimethyl Pyrazole Derivatives

2017 ◽  
Vol 68 (2) ◽  
pp. 317-322
Author(s):  
Anca Mihaela Mocanu ◽  
Constantin Luca ◽  
Alina Costina Luca
Keyword(s):  
Thermal Degradation ◽  
Degradation Mechanism ◽  
New Products ◽  
Analysis Data ◽  
Biological Properties ◽  
Elemental Analysis Data ◽  
Ftir Analysis ◽  
Spectral Measurements ◽  
Chemical Structures ◽  
And Storage

The purpose of this research is to synthetize, characterize and thermal degradation of new heterolytic derivates with potential biological properties. The derivates synthesis was done by obtaining new molecules with pyralozone structure which combine two pharmacophore entities: the amidosulfonyl-R1,R2 phenoxyacetil with the 3,5-dimethyl pyrazole which can have potential biological properties. The synthesis stages of the new products are presented as well as the elemental analysis data and IR, 1H-NMR spectral measurements made for elucidating the chemical structures and thermostability study which makes evident the temperature range proper for their use and storage. The obtained results were indicative of a good correlation of the structure with the thermal stability as estimated by means of the initial degradation temperatures as well as with the degradation mechanism by means of the TG-FTIR analysis.

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