Dichlorosilylene: A High Temperature Transient Species to an Indispensable Building Block

2012 ◽  
Vol 46 (2) ◽  
pp. 444-456 ◽  
Author(s):  
Rajendra S. Ghadwal ◽  
Ramachandran Azhakar ◽  
Herbert W. Roesky
Keyword(s):  
High Temperature ◽  
Building Block ◽  
Transient Species ◽  
Temperature Transient

Longitudinal deformation study of pressure tube of Indian PHWR under high temperature transient

2021 ◽  
Vol 155 ◽  
pp. 108160
Author(s):  
Ankit R. Singh ◽  
Andallib Tariq ◽  
Pradeep K. Sahoo ◽  
Prasanna Majumdar ◽  
Deb Mukhopadhyay
Keyword(s):  
High Temperature ◽  
Pressure Tube ◽  
Longitudinal Deformation ◽  
Temperature Transient

Oxidation of Zirconium During a High-Temperature Transient

2009 ◽  
pp. 134-134-16 ◽  
Author(s):  
A Sawatzky ◽  
GA Ledoux ◽  
S Jones
Keyword(s):  
High Temperature ◽  
Temperature Transient

A System On Chip (SOC) ASIC chipset for Aerospace and Energy Exploration Applications

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000278-000284 ◽  
Author(s):  
Bhal Tulpule ◽  
Bruce Ohme ◽  
Mark Larson ◽  
Al Behbahani ◽  
John Gerety ◽  
...  
Keyword(s):  
Control System ◽  
High Temperature ◽  
Building Block ◽  
Complex Function ◽  
Wind Farms ◽  
Power Source ◽  
System On Chip ◽  
Hole Drilling ◽  
Sensors And Actuators ◽  
On Chip

This paper describes the design, key features and applications of a System On Chip (SOC) ASIC (Application Specific Integrated Circuit) chipset which was developed by Embedded Systems LLC as a part of the Smart Node based distributed control system architecture under an Air Force SBIR (Small Business Innovative Research) program {4}. The analog part of the SOC chipset has been implemented by Honeywell International under a subcontract using their high temperature SOI (Silicon On Insulator) Process. The complete chipset is expected to be available in early 2015. The key feature of the SOC chipset is that it is a reconfigurable and scalable building block that can be used to interface with most typical aerospace control system sensors and actuators. The SOC chipset captures all of the necessary functions required to power and interface with sensors such as RTD (Resistance Temperature Detectors), Strain Gauges (SG), Thermo Couples (TC) and transducers for measuring mass flow, speed, position or angle. The SOC chipset also contains all of the pre- and post-processing functions to convert electrical signals into digital words and send them on a data bus under the control of a host microprocessor. Finally, the SOC chipset contains PWM (Pulse Width Modulation) circuitry required to interface with external drives for actuators, motors, shutoff Valves etc. The SOC chipset can be powered from a Mil-Std-704F compliant power source or a conditioned DC power source. The chipset can be combined with other devices, such as memory, processor and A to D Converter to implement a high temperature capable Smart Node for localized management of sensors and actuators as a part of a distributed architecture or used as a scalable building block in a more complex function such as a FADEC (Full Authority Digital Engine Control). It is believed that the versatility of the SOC chipset makes it a well suited, affordable, scalable building block for not only aerospace controls but also for diverse applications such as down-hole drilling, energy exploration, wind farms etc. where high temperature electronics and /or high level of miniaturization is required.

A Current-Controlled PCB Integrated MEMS Tilt Mirror

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 000588-000608
Author(s):  
Robert N. Dean ◽  
Colin B. Stevens ◽  
John J. Tatarchuk
Keyword(s):  
Control System ◽  
High Temperature ◽  
Air Force ◽  
Building Block ◽  
Beam Steering ◽  
Complex Function ◽  
Power Source ◽  
Sensors And Actuators ◽  
Key Features ◽  
Sbir Program

Introduction: MEMS Tilt Mirror - a miniature planar micro-mirror that can experience a 1-D or 2-D tilt in response to a control signal. Commonly used technologies- electrostatic, piezoelectric, electrothermal bimorph. Applications - laser beam steering, interferometers, dynamic signal analyzers, opticcal cross-connect switches. This paper describes the design, key features and applications of a System On Chip (SOC) ASIC (Application Specific Integrated Circuit) that has been developed under an Air Force SBIR program. The SOC device has been implemented by Honeywell International using their High Temperature SOI (Silicon On Insulator) Process. The objective of the Air Force SBIR program {1} was to investigate the potential for use of available High Temperature SOI technology devices for aerospace propulsion control system applications. Several prototype designs implemented by Embedded Systems LLC (ES-LLC) using available SOI devices identified significant limitations in the performance capability and level of integration. The diversity of propulsion system interfacing requirements demanded generic solutions so that they could be deployed in multiple applications without changes. The available devices were also not affordable due to the limited size of the market for this technology. It was therefore decided to develop a generic, reconfigurable SOC chipset {2} that could be implemented using Honeywell's HT200 Family of ASIC Gate Arrays. The paper will describe the architecture and key features of the SOC chipset solution which can be reconfigured to interface with most typical aerospace control system sensors and actuators. The SOC chipset captures all of the necessary functions required to interface with sensors such as RTD (resistance Temperature Detectors), Strain Gauges (SG) and thermocouples (TC), mass flow, speed and LVDT (Linear Variable Differential Transducer) position. The excitation circuitry required to power these interfaces is embedded in the chipset and can be reconfigured as required. The SOC chipset also contains all of the pre- and post-processing functions to convert electrical signals into digital words and send them on a data bus under the control of a host microprocessor. The SOC chipset can be powered from a Mil-Std 704F compliant power source or a conditioned DC power source. The SOC chipset when combined with other external devices can be implemented as a “Smart Node” for localized management of sensors and actuators as a part of a distributed architecture or used as a scalable building block in a more complex function such as a FADEC (Full Authority Digital Engine Control). The SOC chipset thus completes the set of all High Temperature SOI Integrated circuits required for implementation of typical Smart Nodes. It is believed that the versatility of the SOC chipset makes it a well suited, affordable, scalable building block for not only aerospace controls but also for diverse applications such as down-hole drilling, energy exploration, wind farms etc. where high temperature electronics is required.

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