scholarly journals Fabrication of Smooth Patterned Structures of Refractory Metals, Semiconductors, and Oxides via Template Stripping

2013 ◽  
Vol 5 (19) ◽  
pp. 9701-9708 ◽  
Author(s):  
Jong Hyuk Park ◽  
Prashant Nagpal ◽  
Kevin M. McPeak ◽  
Nathan C. Lindquist ◽  
Sang-Hyun Oh ◽  
...  
Keyword(s):  
Refractory Metals ◽  
Patterned Structures ◽  
Template Stripping

Hybrid Micro-Optical Sensors via Sol-Gel Soft Lithography

2000 ◽  
Vol 628 ◽  
Author(s):  
Mark A. Clarner ◽  
Michael J. Lochhead
Keyword(s):  
Optical Sensors ◽  
Soft Lithography ◽  
Sol Gel ◽  
Silica Gels ◽  
Ph Sensing ◽  
Ambient Conditions ◽  
Sensor Applications ◽  
Patterned Structures ◽  
Biological Functionality ◽  
Indicator Dyes

ABSTRACTOrganically modified silica gels and dye-doped silica gels have been patterned into micrometer-scale structures on a substrate using micro molding in capillaries (MIMIC). This approach is from a class of elastomeric stamping and molding techniques collectively known as soft lithography. Soft lithography and sol-gel processing share attractive features in that they are relatively benign processes performed at ambient conditions, which makes both techniques compatible with a wide variety of organic molecules, molecular assemblies, and biomolecules. The combination of sol-gel and soft lithography, therefore, holds enormous promise as a tool for microfabrication of materials with optical, chemical, or biological functionality that are not readily patterned with conventional methods. This paper describes our investigation of micro-patterned organic-inorganic hybrid materials containing indicator dyes for microfluidic sensor applications. Reversible colorimetric pH sensing via entrapped reagents is demonstrated in a prototype microfluidic sensor element. Patterned structures range from one to tens of micrometers in cross-section and are up to centimeters in length. Fundamental chemical processing issues associated with mold filling, cracking and sensor stability are discussed.

Segregation of Refractory Metals at Grain Boundaries in High-Temperature Alloys

2020 ◽  
Vol 2020 (11) ◽  
pp. 1292-1299
Author(s):  
I. M. Razumovskii ◽  
V. I. Razumovskiy ◽  
I. A. Logachev ◽  
A. O. Rodin ◽  
M. I. Razumovsky
Keyword(s):  
High Temperature ◽  
Grain Boundaries ◽  
Refractory Metals ◽  
High Temperature Alloys

scholarly journals Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1721
Author(s):  
Mario Mora ◽  
Hippolyte Amaveda ◽  
Luis Porta-Velilla ◽  
Germán F. de la Fuente ◽  
Elena Martínez ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Bonding Strength ◽  
Copper Surface ◽  
Heat Sinks ◽  
Electrical Insulation ◽  
Cryogenic Temperatures ◽  
Shear Tests ◽  
Patterned Structures ◽  
Different Temperatures ◽  
Mechanical Tensile

The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryogenic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this study, with the latter also providing the required electrical insulation. The copper surface was irradiated with laser to induce micro- and nano-patterned structures that result in an improvement of the adhesion between the epoxy and the copper. Thus, copper-to-copper bonding strength was characterized by means of mechanical tensile shear tests. The effect of the laser processing on the thermal conductivity properties of the Cu/epoxy/Cu joint at different temperatures, from 10 to 300 K, is also reported. Using adequate laser parameters, it is possible to obtain high bonding strength values limited by cohesive epoxy fracture, together with good thermal conductivity at ambient and cryogenic temperatures.

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