A Tough Reversible Biomimetic Transparent Adhesive Tape with Pressure-Sensitive and Wet-Cleaning Properties

ACS Nano ◽  
2021 ◽  
Author(s):  
Ming Li ◽  
Weijun Li ◽  
Qingwen Guan ◽  
Xiaoli Dai ◽  
Jing Lv ◽  
...  
Keyword(s):  
Adhesive Tape ◽  
Pressure Sensitive

Enhancement of Skin Permeation of a Hydrophilic Drug from Acryl-Based Pressure-Sensitive Adhesive Tape

2021 ◽  
Author(s):  
Takamasa Suzuki ◽  
Tomohiro Aoki ◽  
Masato Saito ◽  
Ichiro Hijikuro ◽  
Shoko Itakura ◽  
...  
Keyword(s):  
Skin Permeation ◽  
Adhesive Tape ◽  
Pressure Sensitive Adhesive ◽  
Pressure Sensitive ◽  
Hydrophilic Drug

scholarly journals Mechanics of an adhesive tape in a zero degree peel test: effect of large deformation and material nonlinearity

Soft Matter ◽  
2018 ◽  
Vol 14 (47) ◽  
pp. 9681-9692 ◽  
Author(s):  
Chung-Yuen Hui ◽  
Zezhou Liu ◽  
Helen Minsky ◽  
Costantino Creton ◽  
Matteo Ciccotti
Keyword(s):  
Large Deformation ◽  
Peel Test ◽  
Adhesive Layer ◽  
Material Nonlinearity ◽  
Adhesive Tape ◽  
Pressure Sensitive Adhesive ◽  
Pressure Sensitive ◽  
Zero Degree ◽  
The Common ◽  
Backing Layer

The common pressure sensitive adhesive (PSA) tape is a composite consisting of a stiff backing layer and a soft adhesive layer.

Study on Resistance Increase Trends and Recovery Characteristics of YBCO Thin-film Wire According to Insulation Layer

2010 ◽  
Vol 1254 ◽  
Author(s):  
Ho Ik Du ◽  
Byoung Sung Han ◽  
Yong Jin Kim ◽  
Dong Hyeok Lee ◽  
Sang Seob Song
Keyword(s):  
Thin Film ◽  
Phase Changes ◽  
Superior Performance ◽  
Adhesive Tape ◽  
Ybco Thin Film ◽  
Pressure Sensitive Adhesive ◽  
Critical Temperatures ◽  
Resistance Increase ◽  
Pressure Sensitive ◽  
Change Characteristics

AbstractTo apply the superconducting wire to power machines, it is necessary to conduct research on the characteristics of wire phase changes in connection with insulating layers. In this study, according to the presence or absence of insulating layers in the wire, and to the thickness of such layers, the wire's resistance increase trends and the characteristics of its recovery from quenching were examined by current-applied cycle at the temperatures of 90 K, 180 K and 250 K. Towards this end, YBCO thin-film wires that have the same critical temperatures and that have copper and stainless-steel stabilizing layers were prepared. One level and three and five levels of superior-performance polyimide pressure-sensitive adhesive tape was attached to the wires at a very low temperature. The eight prepared test samples were wound around the linear frames, then the wire's voltage and current created owing to the phase change characteristics were measured at each prescribed temperature, using the four-point probe method. Further, near the examination temperatures of 90 K, 180 K and 250 K the wire's resistance and recovery characteristics were examined by cycle.

Effect of Cohesive Zone Size on Peeling of Heterogeneous Adhesive Tape

2018 ◽  
Vol 85 (12) ◽  
Author(s):  
L. Avellar ◽  
T. Reese ◽  
K. Bhattacharya ◽  
G. Ravichandran
Keyword(s):  
Numerical Simulation ◽  
Cohesive Zone ◽  
Elastic Stiffness ◽  
Adhesive Tape ◽  
Zone Size ◽  
Force Enhancement ◽  
Rigid Substrate ◽  
Pressure Sensitive Adhesive ◽  
Pressure Sensitive ◽  
Peel Force

The interaction between the cohesive zone and the elastic stiffness heterogeneity in the peeling of an adhesive tape from a rigid substrate is examined experimentally and with finite element simulations. It is established in the literature that elastic stiffness heterogeneities can greatly enhance the force required to peel a tape without changing the properties of the interface. However, much of these concern brittle materials where the cohesive zone is limited in size. This paper reports the results of peeling experiments performed on pressure-sensitive adhesive tapes with both an elastic stiffness heterogeneity and a substantial cohesive zone. These experiments show muted enhancement in the peeling force and suggest that the cohesive zone acts to smooth out the effect of the discontinuity at the edge of the elastic stiffness heterogeneities, suppressing their effect on peel force enhancement. This mechanism is examined through numerical simulation which confirms that the peel force enhancement depends on the strength of the adhesive and the size of the cohesive zone.

scholarly journals Some Problems on Pressure Sensitive Adhesive Tape Used in Cross Cut Test

2006 ◽  
Vol 42 (4) ◽  
pp. 138-145 ◽  
Author(s):  
Yoshinobu NAKAMURA ◽  
FUJITA FUJITA ◽  
Manabu ADACHI ◽  
Yuta TACHIBANA ◽  
Takeo IIDA ◽  
...  
Keyword(s):  
Adhesive Tape ◽  
Pressure Sensitive Adhesive ◽  
Pressure Sensitive

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

2017 ◽  
Author(s):  
Naoya Saiki ◽  
Yuichiro Komasu ◽  
Kazuto Aizawa ◽  
Jun Maeda
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Speed ◽  
Adhesive Layer ◽  
Adhesive Tape ◽  
Pressure Sensitive Adhesive ◽  
Element Analysis ◽  
Uv Curable ◽  
Pressure Sensitive ◽  
Peeling Process

In this study, the peeling process of UV-curable pressure sensitive adhesive tape from bump wafer is investigated through the use of finite element analysis, observation of high speed video, and actual wafer back-grinding process testing. In our experiment, a large deformation of adhesive is observed at the edge of bottom of bump, appearing on the side of the bump opposite tape-peeling direction when observed with high speed microscope video. The largely deformed adhesive creates a string shaped elongation. The adhesive residue is caused by the fracture of the adhesive string. We investigated how to generate the adhesive string in the tape-peeling process through the use of finite element analysis. In this analysis, a cohesive element is introduced into the adhesive layer. The analytical result shows the adhesive string at the same position of experiment and the stress distribution is different between the string part and the other area of adhesive. The influence of peeling angle and bump size is also investigated by the same finite element model. As a result, higher peeling angle and smaller bump sizes shows a shorter adhesive string, which lowers the risk of adhesive residue.

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