Low Dielectric Constant Polyimide Hybrid Films Prepared by in Situ Blow-Balloon Method

2019 ◽  
Vol 1 (8) ◽  
pp. 2189-2196 ◽  
Author(s):  
Zhao Chen ◽  
Dandan Zhu ◽  
Faqin Tong ◽  
Xuemin Lu ◽  
Qinghua Lu
Keyword(s):  
Dielectric Constant ◽  
Low Dielectric Constant ◽  
Hybrid Films ◽  
Low Dielectric

Stress Development in Low Dielectric Constant Silica Films During Drying and Heating Process

1999 ◽  
Vol 594 ◽  
Author(s):  
Mengcheng Lu ◽  
C. Jeffrey Brinker
Keyword(s):  
Dielectric Constant ◽  
Tensile Stress ◽  
Sol Gel ◽  
Low Dielectric Constant ◽  
Heating Process ◽  
Residual Tensile Stress ◽  
Silica Films ◽  
Stress Development ◽  
Low Dielectric

AbstractLow dielectric constant silica films are made using a surfactant templated sol-gel process (K∼2.5) or an ambient temperature and pressure aerogel process (K∼1.5). This paper will present the in-situ measurement and analysis of stress development during the making of these films, from the onset of drying till the end of heating. The drying stress is measured by a cantilever beam technique; the thermal stress is measured by monitoring the wafer curvature using a laser deflection method. During the course of drying, the surfactant templated films experience a low drying stress due to the influence of the surfactant on surface tension and extent of siloxane condensation. The aerogel films first develop a biaxial tensile stress due to solidification and initial drying. At the final stage of drying where the drying stress vanishes, dilation of the film recreates the porosity of the wet gel state, reducing the residual stress to zero. For the surfactant templated films, very small residual tensile stress remains after the heat treatment is finished (∼30MPa). Aerogel film has almost no measurable stress developed in the calcination process. In situ spectroscopic ellipsometry analysis during drying and heating, and TGA/DTA are all used to help understand the stress development.

High-performance fluorinated polyimide/pure silica zeolite nanocrystal hybrid films with a low dielectric constant

RSC Advances ◽  
2015 ◽  
Vol 5 (93) ◽  
pp. 76476-76482 ◽  
Author(s):  
Zhenxun Huang ◽  
Shumei Liu ◽  
Yanchao Yuan ◽  
Jianqing Zhao
Keyword(s):  
Dielectric Constant ◽  
High Performance ◽  
Low Dielectric Constant ◽  
Hybrid Films ◽  
Low Dielectric ◽  
Simple Strategy ◽  
Pure Silica ◽  
Fluorinated Polyimide ◽  
Enhanced Properties

A simple strategy for preparing the low-κ FPI hybrids with enhanced properties.

Study on the Dielectric Properties of Hybrid and Porous Polyimide-Silica Films

2008 ◽  
Vol 47-50 ◽  
pp. 973-976 ◽  
Author(s):  
Yi He Zhang ◽  
Qing Song Su ◽  
Li Yu ◽  
Hong Zheng ◽  
Hai Tao Huang ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Sol Gel ◽  
Silica Particles ◽  
Low Dielectric Constant ◽  
Hybrid Films ◽  
Porous Films ◽  
Silica Films ◽  
Low Dielectric ◽  
Dimethyl Acetamide ◽  
Sol Gel Process

A sol-gel process was used to prepare polyimide-silica hybrid films from the polyimide precursors and TEOS in N,N- dimethyl acetamide, then the hybrid film was treated with hydrofluoric acid to remove the dispersed silica particles, leaving pores with diameters between 80nm to 1µm, depending on the size of silica particles. The structure and dielectric constant of the hybrid and porous films were characterized by FTIR,SEM. The porous films displayed relatively low dielectric constant compared to the hybrid polyimide-silica films.

scholarly journals In-Situ Repair Plasma-Induced Damage and Cap Dielectric Barrier for Porous Low-Dielectric-Constant Materials by HMDS Plasma Treatment

Coatings ◽  
2021 ◽  
Vol 11 (3) ◽  
pp. 314
Author(s):  
Chih-Yen Lee ◽  
Chi-Yang Yan ◽  
Yi-Lung Cheng
Keyword(s):  
Dielectric Constant ◽  
Plasma Treatment ◽  
Metal Ion ◽  
Treatment Time ◽  
Advanced Technology ◽  
Low Dielectric Constant ◽  
Plasma Damage ◽  
Low Dielectric ◽  
Low K

Plasma damage and metal ion penetration are critical issues for porous low-dielectric-constant (low-k) materials used in the back-end-of-line interconnects. This study proposed a novel process with in-situ repairing plasma-induced damage and capping a barrier for porous low-k materials by Hexamethyldisilazane (HDMS) plasma treatment. For a plasma-damaged porous low-k material, its surface hydrophilic state was transformed to hydrophobic state by HDMS plasma treatment, revealing that damage was repaired. Simultaneously, a dielectric film was capped onto the porous low-k material, and displayed better barrier capability against Cu migration. Additionally, the breakdown reliability of the stacked dielectric was enhanced by the means of HDMS plasma treatment. The optimized HDMS plasma treatment time was found to be 10 s. Therefore, this proposed HDMS plasma treatment processing is a promising technique for highly applicable low-k material used for advanced technology nodes.

scholarly journals Polyimide/mica hybrid films with low coefficient of thermal expansion and low dielectric constant

e-Polymers ◽  
2019 ◽  
Vol 19 (1) ◽  
pp. 181-189 ◽  
Author(s):  
Wei Zhao ◽  
Yong Xu ◽  
Chaoran Song ◽  
Jian Chen ◽  
Xiaohong Liu
Keyword(s):  
Dielectric Constant ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Low Dielectric Constant ◽  
Gravimetric Analysis ◽  
Condensation Polymerization ◽  
Hybrid Films ◽  
Low Dielectric ◽  
Infrared Spectrometer ◽  
Polyimide Matrix

AbstractPolyimide (PI)/mica hybrid films were successfully prepared by in situ condensation polymerization method, in which the mica particles were modified by coupling agent γ-aminopropyltriethoxy silane (APTS) to strengthen the interaction between the mica particles and PI matrix. The morphology, structure, thermal and mechanical properties as well as dielectric properties of PI films were systematically studied via Scanning electron microscope (SEM), Fourier transform infrared spectrometer (FT-IR spectrometer), Thermal gravimetric analysis (TGA), tensile experiments, Thermal mechanical analyzer (TMA), impedance analyzer, etc. The results indicated that the mica particles were dispersed homogeneously in PI matrix, leading to an improvement of the mechanical property, thermal stability and hydrophobicity. It was novel to notice that hybrid films exhibited low coefficient of thermal expansion (CTE) and low dielectric constant simultaneously. The CTE and dielectric constant of hybrid film dropped to 25.36 ppm/k and 2.42 respectively, in the presence of 10 wt% mica into polyimide matrix.

Design and preparation of poly(aryl ether ketone)/phosphotungstic acid hybrid films with low dielectric constant

2013 ◽  
Vol 129 (6) ◽  
pp. 3219-3225 ◽  
Author(s):  
Zhi Geng ◽  
Shuling Zhang ◽  
Jianxin Mu ◽  
Xu Jiang ◽  
Pengfei Huo ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Phosphotungstic Acid ◽  
Low Dielectric Constant ◽  
Aryl Ether ◽  
Hybrid Films ◽  
Low Dielectric ◽  
Aryl Ether Ketone ◽  
Ether Ketone
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