scholarly journals Effect of a Dwell Stage in the Cure Cycle on the Interphase Formation in a Poly(ether imide)/High Tg Epoxy System

2021 ◽  
Author(s):  
Ujala Farooq ◽  
Sönke Heuer ◽  
Julie Teuwen ◽  
Clemens Dransfeld
Keyword(s):  
Epoxy System ◽  
Cure Cycle

scholarly journals Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment

Crystals ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 733
Author(s):  
Lu Liu ◽  
Songbai Xue ◽  
Ruiyang Ni ◽  
Peng Zhang ◽  
Jie Wu
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Composite Solder ◽  
Solder Joints ◽  
Solder Paste ◽  
Epoxy System ◽  
Mechanical Reinforcement ◽  
Microstructure Observation ◽  
Temperature And Humidity ◽  
Thermosetting Epoxy

In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 °C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from −40 °C to 125 °C for 1000 cycles were investigated. Compared to the Sn–Bi solder joint, the TSEP Sn–Bi solder joints had increased reliability. The microstructure observation shows that the epoxy resin curing process did not affect the transformation of the microstructure. The shear force of the TSEP Sn–Bi solder joints after 1000 cycles of thermal cycling test was 1.23–1.35 times higher than the Sn–Bi solder joint and after 1000 h of temperature and humidity tests was 1.14–1.27 times higher than the Sn–Bi solder joint. The fracture analysis indicated that the cured cover layer could still have a mechanical reinforcement to the TSEP Sn–Bi solder joints after these reliability tests.

scholarly journals Uniaxially aligned electrospun fibers for advanced nanocomposites based on a model PVOH-epoxy system

2016 ◽  
Vol 81 ◽  
pp. 214-221 ◽  
Author(s):  
Samaneh Karimi ◽  
Mark P. Staiger ◽  
Neil Buunk ◽  
Alison Fessard ◽  
Nick Tucker
Keyword(s):  
Electrospun Fibers ◽  
Epoxy System

EFFECTS OF STOICHIOMETRY ON PROPERTIES OF DGEBF/DETDA EPOXY USING MOLECULAR DYNAMICS

2021 ◽  
Author(s):  
SAGAR PATIL ◽  
MICHAEL OLAYA ◽  
PRATHAMESH DESHPANDE ◽  
MARIANNA MAIARÙ ◽  
GREGORY ODEGARD
Keyword(s):  
Mechanical Properties ◽  
Molecular Dynamics ◽  
Molecular Modeling ◽  
Bulk Modulus ◽  
Mass Density ◽  
Strong Dependence ◽  
Crosslinking Density ◽  
Mechanical Deformation ◽  
Epoxy System ◽  
Reactive Interface

This article details the molecular modeling of full and off-stoichiometry models of the DGEBF/DETDA epoxy system using Molecular Dynamics to predict the mechanical properties as a function of the crosslinking density. The Reactive Interface Force Field (IFF-R) is implemented in this work to simulate mechanical deformation. The “fix bond/react” command in LAMMPS is used to simulate crosslinking between epoxy monomers. The results show that the predicted mass density, volumetric shrinkage, and bulk modulus have a strong dependence on the stoichiometry of the epoxy.

A repairable anhydride-epoxy system with high mechanical properties inspired by vitrimers

Polymer ◽  
2018 ◽  
Vol 159 ◽  
pp. 162-168 ◽  
Author(s):  
Yang Yang ◽  
Guirong Peng ◽  
Shu Wu ◽  
Wenguang Hao
Keyword(s):  
Mechanical Properties ◽  
Epoxy System

Cure mechanism and thermal properties of the phthalide-containing bismaleimide/epoxy system

2013 ◽  
Vol 559 ◽  
pp. 52-58 ◽  
Author(s):  
Xuhai Xiong ◽  
Ping Chen ◽  
Rong Ren ◽  
Fang Lu ◽  
Qi Yu
Keyword(s):  
Thermal Properties ◽  
Epoxy System ◽  
Cure Mechanism

Toughening of a trifunctional epoxy system Part III. Kinetic and morphological study of the thermoplastic modified cure process

Polymer ◽  
2000 ◽  
Vol 41 (9) ◽  
pp. 3425-3436 ◽  
Author(s):  
R.J. Varley ◽  
J.H. Hodgkin ◽  
D.G. Hawthorne ◽  
G.P. Simon ◽  
D. McCulloch
Keyword(s):  
Morphological Study ◽  
Epoxy System ◽  
Cure Process ◽  
System Part
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