Highly in-Plane Thermally Conductive Composite Films from Hexagonal Boron Nitride Microplatelets Assembled with Graphene Oxide

2017 ◽  
Vol 1 (1) ◽  
pp. 94-100 ◽  
Author(s):  
Ziming Shen ◽  
Jiachun Feng
Keyword(s):  
Graphene Oxide ◽  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Conductive Composite ◽  
Thermally Conductive

Thermally conductive composite films of hexagonal boron nitride and polyimide with affinity-enhanced interfaces

2010 ◽  
Vol 20 (14) ◽  
pp. 2749 ◽  
Author(s):  
Kimiyasu Sato ◽  
Hitomi Horibe ◽  
Takashi Shirai ◽  
Yuji Hotta ◽  
Hiromi Nakano ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Conductive Composite ◽  
Thermally Conductive

scholarly journals Three-Dimensional Heterostructured Reduced Graphene Oxide-Hexagonal Boron Nitride-Stacking Material for Silicone Thermal Grease with Enhanced Thermally Conductive Properties

Nanomaterials ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 938 ◽  
Author(s):  
Weijie Liang ◽  
Xin Ge ◽  
Jianfang Ge ◽  
Tiehu Li ◽  
Tingkai Zhao ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Boron Nitride ◽  
Reduced Graphene Oxide ◽  
Hexagonal Boron Nitride ◽  
Three Dimensional ◽  
Thermal Interface Materials ◽  
Reduced Graphene ◽  
Thermally Conductive ◽  
Thermal Grease ◽  
Conductive Properties

The thermally conductive properties of silicone thermal grease enhanced by hexagonal boron nitride (hBN) nanosheets as a filler are relevant to the field of lightweight polymer-based thermal interface materials. However, the enhancements are restricted by the amount of hBN nanosheets added, owing to a dramatic increase in the viscosity of silicone thermal grease. To this end, a rational structural design of the filler is needed to ensure the viable development of the composite material. Using reduced graphene oxide (RGO) as substrate, three-dimensional (3D) heterostructured reduced graphene oxide-hexagonal boron nitride (RGO-hBN)-stacking material was constructed by self-assembly of hBN nanosheets on the surface of RGO with the assistance of binder for silicone thermal grease. Compared with hBN nanosheets, 3D RGO-hBN more effectively improves the thermally conductive properties of silicone thermal grease, which is attributed to the introduction of graphene and its phonon-matching structural characteristics. RGO-hBN/silicone thermal grease with lower viscosity exhibits higher thermal conductivity, lower thermal resistance and better thermal management capability than those of hBN/silicone thermal grease at the same filler content. It is feasible to develop polymer-based thermal interface materials with good thermal transport performance for heat removal of modern electronics utilising graphene-supported hBN as the filler at low loading levels.

Dielectric, thermally conductive, and heat-resistant polyimide composite film filled with silver nanoparticle-modified hexagonal boron nitride

2020 ◽  
Vol 32 (10) ◽  
pp. 1181-1190 ◽  
Author(s):  
Ruiyi Li ◽  
Xiuwei Lv ◽  
Juan Yu ◽  
Xiaodong Wang ◽  
Pei Huang
Keyword(s):  
Boron Nitride ◽  
In Situ Polymerization ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Resistance Index ◽  
Low Dielectric ◽  
Modified Method ◽  
Ag Particles ◽  
Thermal Imidization ◽  
Thermally Conductive

In this study, silver–polydopamine–hexagonal boron nitride (h-BN@Ag) particles were prepared using mussel chemistry and reducibility of catechol. The modified method was simple and eco-friendly. In addition, we prepared h-BN@Ag/polyimide (PI) composite films via in situ polymerization, the scraper method, and thermal imidization. Owing to the good dispersion of the h-BN@Ag filler particles in the PI matrix and the bridging role of the Ag nanoparticles, the thermal conductivities of the h-BN@Ag/PI composite films were higher than that of the pure PI film. The thermal conductivity of the h-BN@Ag/PI film with the filler content of 10 wt% was 0.382 W (m·K)−1, which was 108% higher than that of pure PI films (0.184 W (m·K) −1). Furthermore, the composite films presented extremely low dielectric permittivity and loss tangent. Moreover, the heat resistance index of the composite films (304.6°C) was higher than that of pure PI (294.3°C). Thus, h-BN@Ag/PI composite films could be promising electronic packaging materials.

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

2019 ◽  
Vol 2019 (NOR) ◽  
pp. 000001-00005
Author(s):  
Ya Liu ◽  
Nan Wang ◽  
Lilei Ye ◽  
Abdelhafid Zehri ◽  
Andreas Nylander ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
High Thermal Conductivity ◽  
Thermally Conductive ◽  
Promising Solution ◽  
Mechanical Pressing ◽  
Insulating Properties

Abstract Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400 - 800 W m−1 K−1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m−1 K−1 and 0.485 W m−1 K−1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.

scholarly journals Robust Biomimetic Nacreous Aramid Nanofiber Composite Films with Ultrahigh Thermal Conductivity by Introducing Graphene Oxide and Edge-Hydroxylated Boron Nitride Nanosheet

Nanomaterials ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 2544
Author(s):  
Cenkai Xu ◽  
Chengmei Wei ◽  
Qihan Li ◽  
Zihan Li ◽  
Zongxi Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Boron Nitride ◽  
Composite Film ◽  
Performance Enhancement ◽  
Composite Films ◽  
Dielectric Materials ◽  
Boron Nitride Nanosheet ◽  
Brick And Mortar ◽  
Thermally Conductive

Dielectric materials with excellent thermally conductive and mechanical properties can enable disruptive performance enhancement in the areas of advanced electronics and high-power devices. However, simultaneously achieving high thermal conductivity and mechanical strength for a single material remains a challenge. Herein, we report a new strategy for preparing mechanically strong and thermally conductive composite films by combining aramid nanofibers (ANFs) with graphene oxide (GO) and edge-hydroxylated boron nitride nanosheet (BNNS-OH) via a vacuum-assisted filtration and hot-pressing technique. The obtained ANF/GO/BNNS film exhibits an ultrahigh in-plane thermal conductivity of 33.4 Wm−1K−1 at the loading of 10 wt.% GO and 50 wt.% BNNS-OH, which is 2080% higher than that of pure ANF film. The exceptional thermal conductivity results from the biomimetic nacreous “brick-and-mortar” layered structure of the composite film, in which favorable contacting and overlapping between the BNNS-OH and GO is generated, resulting in tightly packed thermal conduction networks. In addition, an outstanding tensile strength of 93.3 MPa is achieved for the composite film, owing to the special biomimetic nacreous structure as well as the strong π−π interactions and extensive hydrogen bonding between the GO and ANFs framework. Meanwhile, the obtained composite film displays excellent thermostability (Td = 555 °C, Tg > 400 °C) and electrical insulation (4.2 × 1014 Ω·cm). We believe that these findings shed some light on the design and fabrication of multifunctional materials for thermal management applications.

scholarly journals Hot pressing-induced alignment of hexagonal boron nitride in SEBS elastomer for superior thermally conductive composites

RSC Advances ◽  
2018 ◽  
Vol 8 (45) ◽  
pp. 25835-25845 ◽  
Author(s):  
Cuiping Yu ◽  
Wenbin Gong ◽  
Jun Zhang ◽  
Weibang Lv ◽  
Wei Tian ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Dimensional Stability ◽  
Hot Pressing ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Conductive Composites ◽  
Thermally Conductive

Orientational hBN/SEBS composite films embued with superior thermal conductivity and improved dimensional stability were prepared by hot-pressing treatment.

scholarly journals Boron nitride nanoplatelets as two-dimensional thermal fillers in epoxy composites: new scenarios at very low filler loadings

2020 ◽  
Vol 40 (10) ◽  
pp. 859-867
Author(s):  
Yao Shi ◽  
Genlian Lin ◽  
Xi-Fei Ma ◽  
Xiao Huang ◽  
Jing Zhao ◽  
...  
Keyword(s):  
Graphene Oxide ◽  
Boron Nitride ◽  
Filler Content ◽  
Hexagonal Boron Nitride ◽  
Filler Loading ◽  
Epoxy Composites ◽  
General Phenomenon ◽  
Sudden Drop ◽  
Reduced Graphene ◽  
Thermal Conducting

AbstractHexagonal boron nitride (h-BN) nanoplatelets (0.6 μm in diameter and 100 nm in thickness) are introduced into epoxy resin to improve the polymer’s thermal conducting ability. As expected, the thermal conductivities (TCs) of the composites, especially the in-plane TCs, are significantly increased. The in-plane TC of the epoxy composites can reach 1.67 W/mK at only 0.53 wt% loading, indicating h-BN nanopletelets are very effective thermal fillers. However, after carefully studied the correlation of the TC improvement and filler content, a sudden drop of the TC around 0.53 wt% filler loading is observed. Such an unexpected decrease in TC has never been reported and is also found to be consistent with the Tg changes versus filler content. Similar trend is also observed in other 2-D nanofillers, such as graphene oxide, reduced graphene oxide, which may indicate it is a general phenomenon for 2-D nanofillers. SEM results suggest that such sudden drop in TC might be coming from the enrichment of these 2-D nanofillers in localized areas due to their tendency to form more ordered phase above certain concentrations.

Highly thermally conductive hexagonal boron nitride/alumina composite made from commercial hexagonal boron nitride

2016 ◽  
Vol 100 (2) ◽  
pp. 515-519 ◽  
Author(s):  
Ching-cheh Hung ◽  
Janet Hurst ◽  
Diana Santiago ◽  
Maricela Lizcano ◽  
Marisabel Kelly
Keyword(s):  
Boron Nitride ◽  
Hexagonal Boron Nitride ◽  
Thermally Conductive ◽  
Alumina Composite
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