Electroluminescence from Alq3-Containing Electron-Beam Resists for Light-Emitting Organic Nanometer-Scale Devices

2020 ◽  
Vol 3 (12) ◽  
pp. 11688-11694
Author(s):  
Anri Nakajima ◽  
Hiroki Sakurai ◽  
Shuhei Abe
1995 ◽  
Vol 380 ◽  
Author(s):  
S. P. Duttagupta ◽  
C. Peng ◽  
L. Tsybeskov ◽  
P. M. Fauchet

ABSTRACTWe have investigated several methods to form submicron-size porous silicon regions. Porous silicon can emit light from the violet to past 1.5 μm with high photoluminescence efficiency at room temperature. It is composed of a high density of nanometer-scale crystalline silicon wires or dots. To integrate light-emitting porous silicon (LEPSi) LEDs with conventional Si microelectronics, it is necessary to produce miniature LEPSi regions adjacent to fully protected crystalline silicon regions. These techniques can be divided into two groups. In the first group formation of LEPSi is prevented during electrochemistry. Using optical and electron beam lithography, and a trilayer process with silicon nitride or amorphization by ion-implantation, we have made LEPSi patterns as small as 100 nm. In the second group, the formation of LEPSi during electrochemistry is enhanced by ion-milling or reactive ion-etching which we have found to help the pore nucleation. We have used a variety of mapping techniques, such as photoluminescence, atomic force and electron beam microscopies, to characterize the sharpness of the interface between the porous silicon and crystalline silicon regions.


2010 ◽  
Vol 211 (13) ◽  
pp. 1402-1407 ◽  
Author(s):  
Evelin Fisslthaler ◽  
Meltem Sezen ◽  
Harald Plank ◽  
Alexander Blümel ◽  
Stefan Sax ◽  
...  

2006 ◽  
Vol 12 (S02) ◽  
pp. 1514-1515 ◽  
Author(s):  
CM Parish ◽  
CL Progl ◽  
ME Salmon ◽  
PE Russell

Extended abstract of a paper presented at Microscopy and Microanalysis 2006 in Chicago, Illinois, USA, July 30 – August 3, 2005


Nano Letters ◽  
2005 ◽  
Vol 5 (7) ◽  
pp. 1303-1307 ◽  
Author(s):  
Willem F. van Dorp ◽  
Bob van Someren ◽  
Cornelis W. Hagen ◽  
Pieter Kruit ◽  
Peter A. Crozier

1998 ◽  
Vol 37 (Part 1, No. 12B) ◽  
pp. 6788-6791 ◽  
Author(s):  
Kenji Yamazaki ◽  
Akira Fujiwara ◽  
Yasuo Takahashi ◽  
Hideo Namatsu ◽  
Kenji Kurihara

Nanomaterials ◽  
2019 ◽  
Vol 9 (11) ◽  
pp. 1634 ◽  
Author(s):  
Zhao ◽  
Hu ◽  
Lei ◽  
Wan ◽  
Gong ◽  
...  

High-quality and crack-free aluminum nitride (AlN) film on sapphire substrate is the foundation for high-efficiency aluminum gallium nitride (AlGaN)-based deep ultraviolet light-emitting diodes (DUV LEDs). We reported the growth of high-quality and crack-free AlN film on sapphire substrate with a nanometer-scale-thick AlN nucleation layer (NL). Three kinds of nanometer-scale-thick AlN NLs, including in situ low-temperature AlN (LT-AlN) NL, oxygen-undoped ex situ sputtered AlN NL, and oxygen-doped ex situ sputtered AlN NL, were prepared for epitaxial growth of AlN films on sapphire substrates. The influence of nanoscale AlN NL thickness on the optical transmittance, strain state, surface morphology, and threading dislocation (TD) density of the grown AlN film on sapphire substrate were carefully investigated. The average optical transmittance of AlN film on sapphire substrate with oxygen-doped sputtered AlN NL was higher than that of AlN films on sapphire substrates with LT-AlN NL and oxygen-undoped sputtered AlN NL in the 200–270 nm wavelength region. However, the AlN film on sapphire substrate with oxygen-undoped sputtered AlN NL had the lowest TD density among AlN films on sapphire substrates. The AlN film on sapphire substrate with the optimum thickness of sputtered AlN NL showed weak tensile stress, a crack-free surface, and low TD density. Furthermore, a 270-nm AlGaN-based DUV LED was grown on the high-quality and crack-free AlN film. We believe that our results offer a promising and practical route for obtaining high-quality and crack-free AlN film for DUV LED.


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