Liquid Metal Covered with Thermoplastic Conductive Composites for High Electrical Stability and Negligible Electromechanical Coupling at Large Strains

2019 ◽  
Vol 11 (29) ◽  
pp. 26204-26212 ◽  
Author(s):  
Heejung Roh ◽  
Sunghwan Cho ◽  
Gilwoon Lee ◽  
Sungmin Moon ◽  
Minsik Kong ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Electromechanical Coupling ◽  
Large Strains ◽  
Electrical Stability ◽  
Conductive Composites

Network topologies dictate electromechanical coupling in liquid metal–elastomer composites

Soft Matter ◽  
2020 ◽  
Vol 16 (38) ◽  
pp. 8818-8825
Author(s):  
Navid Zolfaghari ◽  
Pratik Khandagale ◽  
Michael J. Ford ◽  
Kaushik Dayal ◽  
Carmel Majidi
Keyword(s):  
Liquid Metal ◽  
Computational Modeling ◽  
Electrical Resistance ◽  
Electromechanical Coupling ◽  
Large Strains ◽  
Network Topologies ◽  
Elastomer Composites ◽  
Metal Droplets

Conductive traces of elastomer embedded with liquid metal droplets exhibit little change in electrical resistance when stretched to large strains. Computational modeling is performed to better understand this remarkable piezoresistive property.

scholarly journals Liquid Metal-Based Devices: Material Properties, Fabrication and Functionalities

Nanomaterials ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 3400
Author(s):  
Jian Dong ◽  
Yuanyuan Zhu ◽  
Zhifu Liu ◽  
Meng Wang
Keyword(s):  
Liquid Metal ◽  
Material Properties ◽  
Flow Characteristics ◽  
Strain Sensors ◽  
Electrical Stability ◽  
Nonlinear Materials ◽  
Capillary Method ◽  
Communication Device ◽  
Fluid Properties ◽  
Manufacturing Techniques

This paper reviews the material properties, fabrication and functionalities of liquid metal-based devices. In modern wireless communication technology, adaptability and versatility have become attractive features of any communication device. Compared with traditional conductors such as copper, the flow characteristics and lack of elastic limit of conductive fluids make them ideal alternatives for applications such as flexible circuits, soft electronic devices, wearable stretch sensors, and reconfigurable antennas. These fluid properties also allow for innovative manufacturing techniques such as 3-D printing, injecting or spraying conductive fluids on rigid/flexible substrates. Compared with traditional high-frequency switching methods, liquid metal (LM) can easily use micropumps or an electrochemically controlled capillary method to achieve reconfigurability of the device. The movement of LM over a large physical dimension enhances the reconfigurable state of the antenna, without depending on nonlinear materials or mechanisms. When LM is applied to wearable devices and sensors such as electronic skins (e-skins) and strain sensors, it consistently exhibits mechanical fatigue resistance and can maintain good electrical stability under a certain degree of stretching. When LM is used in microwave devices and paired with elastic linings such as polydimethylsiloxane (PDMS), the shape and size of the devices can be changed according to actual needs to meet the requirements of flexibility and a multistate frequency band. In this work, we discuss the material properties, fabrication and functionalities of LM.

scholarly journals Universal synthesis of conductive liquid network in polymers enabling elastic printed circuit board technology

2021 ◽  
Author(s):  
Jiheong Kang ◽  
Wonbeom Lee ◽  
Hyunjun Kim ◽  
Inho Kang ◽  
Hongjun Park ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Acoustic Field ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
System Level ◽  
Large Strains ◽  
Stretchable Electronics ◽  
Electronic Components ◽  
Conductive Liquid ◽  
Printed Circuit

Abstract Stretchable electronics are considered next-generation electronic devices in a broad range of emerging fields, including soft robotics1,2, biomedical devices3,4, human-machine interfaces5,6, and virtual or augmented reality devices7,8. A stretchable printed circuit board (S-PCB) is a basic conductive framework for the facile assembly of system-level stretchable electronics with various electronic components. Since an S-PCB is responsible for electrical communications between numerous electronic components, the conductive lines in S-PCB should strictly satisfy the following features: (i) metallic conductivity, (ii) constant electrical resistance during dynamic stretching, and (iii) tough interface bonding with various components9. Despite recent significant advances in intrinsically stretchable conductors10,11,12, they cannot simultaneously satisfy the above stringent requirements. Here, we present a new concept of conductive liquid network-based elastic conductors. These conductors are based on unprecedented liquid metal particles assembled network (LMPNet) and an elastomer. The unique assembled network structure and reconfigurable nature of the LMPNet conductor enabled high conductivity, high stretchability, tough adhesion, and imperceptible resistance changes under large strains, which enabled the first elastic-PCB (E-PCB) technology. We synthesized LMPNet through an acoustic field-driven cavitation event in the solid state. When an acoustic field is applied, liquid metal nanoparticles (LMPnano) are remarkably generated from original LMPs and assemble into a highly conductive particle network (LMPNet). Finally, we demonstrated a multi-layered E-PCB, in which various electronic components were integrated with tough adhesion to form a highly stretchable health monitoring system. Since our synthesis of LMPNet is universal, we could synthesize LMPNet in various polymers, including hydrogel, self-healing elastomer and photoresist and add new functions to LMPNet.

The mensuration of interfaces

1992 ◽  
Vol 50 (1) ◽  
pp. 216-217
Author(s):  
W.M. Stobbs
Keyword(s):  
Electron Microscopy ◽  
50Th Anniversary ◽  
Numerical Data ◽  
Industrial Applications ◽  
Dynamical Theory ◽  
Large Strains ◽  
Reasonable Approach ◽  
Lattice Resolution ◽  
Analogue To Digital ◽  
The Way

I do not have access to the abstracts of the first meeting of EMSA but at this, the 50th Anniversary meeting of the Electron Microscopy Society of America, I have an excuse to consider the historical origins of the approaches we take to the use of electron microscopy for the characterisation of materials. I have myself been actively involved in the use of TEM for the characterisation of heterogeneities for little more than half of that period. My own view is that it was between the 3rd International Meeting at London, and the 1956 Stockholm meeting, the first of the European series , that the foundations of the approaches we now take to the characterisation of a material using the TEM were laid down. (This was 10 years before I took dynamical theory to be etched in stone.) It was at the 1956 meeting that Menter showed lattice resolution images of sodium faujasite and Hirsch, Home and Whelan showed images of dislocations in the XlVth session on “metallography and other industrial applications”. I have always incidentally been delighted by the way the latter authors misinterpreted astonishingly clear thickness fringes in a beaten (”) foil of Al as being contrast due to “large strains”, an error which they corrected with admirable rapidity as the theory developed. At the London meeting the research described covered a broad range of approaches, including many that are only now being rediscovered as worth further effort: however such is the power of “the image” to persuade that the above two papers set trends which influence, perhaps too strongly, the approaches we take now. Menter was clear that the way the planes in his image tended to be curved was associated with the imaging conditions rather than with lattice strains, and yet it now seems to be common practice to assume that the dots in an “atomic resolution image” can faithfully represent the variations in atomic spacing at a localised defect. Even when the more reasonable approach is taken of matching the image details with a computed simulation for an assumed model, the non-uniqueness of the interpreted fit seems to be rather rarely appreciated. Hirsch et al., on the other hand, made a point of using their images to get numerical data on characteristics of the specimen they examined, such as its dislocation density, which would not be expected to be influenced by uncertainties in the contrast. Nonetheless the trends were set with microscope manufacturers producing higher and higher resolution microscopes, while the blind faith of the users in the image produced as being a near directly interpretable representation of reality seems to have increased rather than been generally questioned. But if we want to test structural models we need numbers and it is the analogue to digital conversion of the information in the image which is required.

Transition alpha structure in beta-isomorphous Nb-Hf alloys

1987 ◽  
Vol 45 ◽  
pp. 232-233
Author(s):  
R.W. Carpenter ◽  
Changhai Li ◽  
David J. Smith
Keyword(s):  
Solid Solution ◽  
Solution Phase ◽  
Miscibility Gap ◽  
Large Strains ◽  
Solid Solution Phase ◽  
Two Phase ◽  
Diffuse Intensity ◽  
Metastable Form ◽  
The Matrix ◽  
Equilibrium Morphology

Binary Nb-Hf alloys exhibit a wide bcc solid solution phase field at temperatures above the Hfα→ß transition (2023K) and a two phase bcc+hcp field at lower temperatures. The β solvus exhibits a small slope above about 1500K, suggesting the possible existence of a miscibility gap. An earlier investigation showed that two morphological forms of precipitate occur during the bcc→hcp transformation. The equilibrium morphology is rod-type with axes along <113> bcc. The crystallographic habit of the rod precipitate follows the Burgers relations: {110}||{0001}, <112> || <1010>. The earlier metastable form, transition α, occurs as thin discs with {100} habit. The {100} discs induce large strains in the matrix. Selected area diffraction examination of regions ∼2 microns in diameter containing many disc precipitates showed that, a diffuse intensity distribution whose symmetry resembled the distribution of equilibrium α Bragg spots was associated with the disc precipitate.

Linear growth of instabilities on a liquid metal under normal electric field

1993 ◽  
Vol 3 (8) ◽  
pp. 1201-1225 ◽  
Author(s):  
G. N�ron de Surgy ◽  
J.-P. Chabrerie ◽  
O. Denoux ◽  
J.-E. Wesfreid
Keyword(s):  
Liquid Metal ◽  
Electric Field ◽  
Linear Growth ◽  
Normal Electric Field
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