Fabrication of a Bilayer Structure of Cu and Polyimide To Realize Circuit Microminiaturization and High Interfacial Adhesion in Flexible Electronic Devices

2018 ◽  
Vol 10 (51) ◽  
pp. 44589-44602 ◽  
Author(s):  
Yugo Kubo ◽  
Hirokazu Tanaka ◽  
Yoshihiro Saito ◽  
Akira Mizoguchi
Keyword(s):  
Interfacial Adhesion ◽  
Electronic Devices ◽  
Bilayer Structure ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

scholarly journals Transfer Printing and its Applications in Flexible Electronic Devices

Nanomaterials ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 283 ◽  
Author(s):  
Honglei Zhou ◽  
Weiyang Qin ◽  
Qingmin Yu ◽  
Huanyu Cheng ◽  
Xudong Yu ◽  
...  
Keyword(s):  
Interfacial Adhesion ◽  
Electronic Devices ◽  
Digital Camera ◽  
Electronic Systems ◽  
Transfer Printing ◽  
Flexible Display ◽  
The Past ◽  
Flexible Electronic ◽  
Monitoring Devices ◽  
Flexible Electronic Devices

Flexible electronic systems have received increasing attention in the past few decades because of their wide-ranging applications that include the flexible display, eyelike digital camera, skin electronics, and intelligent surgical gloves, among many other health monitoring devices. As one of the most widely used technologies to integrate rigid functional devices with elastomeric substrates for the manufacturing of flexible electronic devices, transfer printing technology has been extensively studied. Though primarily relying on reversible interfacial adhesion, a variety of advanced transfer printing methods have been proposed and demonstrated. In this review, we first summarize the characteristics of a few representative methods of transfer printing. Next, we will introduce successful demonstrations of each method in flexible electronic devices. Moreover, the potential challenges and future development opportunities for transfer printing will then be briefly discussed.

scholarly journals Nanoscale Analysis of Surface Bending Strain in Film Substrates for Preventing Fracture in Flexible Electronic Devices

2021 ◽  
pp. 2001662
Author(s):  
Ryo Taguchi ◽  
Norihisa Akamatsu ◽  
Kohei Kuwahara ◽  
Kayoko Tokumitsu ◽  
Yoshiaki Kobayashi ◽  
...  
Keyword(s):  
Electronic Devices ◽  
Bending Strain ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

Highly transparent, all-oxide, heteroepitaxy ferroelectric thin film for flexible electronic devices

2018 ◽  
Vol 458 ◽  
pp. 540-545 ◽  
Author(s):  
Chuanlai Ren ◽  
Congbing Tan ◽  
Lunjun Gong ◽  
Mingkai Tang ◽  
Min Liao ◽  
...  
Keyword(s):  
Thin Film ◽  
Electronic Devices ◽  
Ferroelectric Thin Film ◽  
Flexible Electronic ◽  
Flexible Electronic Devices
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