Dual-Modified Compact Layer and Superficial Ti Doping for Reinforced Structural Integrity and Thermal Stability of Ni-Rich Cathodes

2021 ◽  
Author(s):  
Wen Yang ◽  
Chang-Jiang Bai ◽  
Wei Xiang ◽  
Yang Song ◽  
Chun-Liu Xu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Structural Integrity ◽  
Compact Layer ◽  
Ti Doping ◽  
Thermal Stability Of

Structural integrity and thermal stability of TiN/CoSi2 used as local interconnect in a self-aligned CoSi2 process

1991 ◽  
Vol 52 (1-2) ◽  
pp. 59-69 ◽  
Author(s):  
Rama I. Hegde ◽  
Robert E. Jones ◽  
Vidya S. Kaushik ◽  
Philip J. Tobin
Keyword(s):  
Thermal Stability ◽  
Structural Integrity ◽  
Thermal Stability Of

Peculiarities of Structure and Texture of High-Strength Cu-Nb Composites

2014 ◽  
Vol 1 ◽  
pp. 201-218 ◽  
Author(s):  
E.N. Popova ◽  
Vladimir V. Popov
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Amorphous State ◽  
High Strength ◽  
Fiber Texture ◽  
Evolution Of Structure ◽  
Ti Doping ◽  
Thermal Stability Of

The evolution of structure of high-strength heavily deformed Cu-Nb composites processed by two different methods (melt-and-deform and bundle-and-deform) is briefly reviewed based on the authors’ (with their coauthors) original studies and the available publications. Specific features of their texture are considered. In particular, it is demonstrated that the ribbon-like Nb filaments possess not only the sharp fiber texture but the limited texture with components characteristic of cold-drawn Nb. The semi-coherent and amorphous state of Cu/Nb interfaces is discussed. The thermal stability of single-core and multi-core wires is considered. The effect of Zr and Ti doping on the structure and mechanical properties is demonstrated.

Influence of Ti doping on the band gap and thermal stability of ultrathin GeOx films

2021 ◽  
Author(s):  
Yang Yong-Cheng ◽  
Yi-He Tsai ◽  
Pratyay Amrit ◽  
Ting-Yu Chen ◽  
Hui-Ting Liu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Band Gap ◽  
Ti Doping ◽  
Thermal Stability Of

scholarly journals Structure, Morphology and Thermal Stability of Porous Carbon Nanofibers Loaded with Cobalt Nanoparticles

2011 ◽  
Vol 6 (4) ◽  
pp. 155892501100600
Author(s):  
Dawei Gao ◽  
Hui Qiao ◽  
Qingqing Wang ◽  
Yibing Cai ◽  
Qufu Wei
Keyword(s):  
Thermal Stability ◽  
Carbon Nanofibers ◽  
Porous Carbon ◽  
Composite Nanofibers ◽  
Structural Integrity ◽  
Cobalt Nanoparticles ◽  
Structure Morphology ◽  
Bet Analysis ◽  
Fibrous Morphology ◽  
Thermal Stability Of

Porous carbon/cobalt (C/Co) composite nanofibers with diameters of 200–300 nm were prepared by electrospinning and subsequent carbonization processes. Two polymer solutions of polyacrylonitrile (PAN), polyvinyl pyrrolidone (PVP), and Co (CH3COOH) 2 (Co (OAc) 2) were used as C/Co composite nanofiber precursors. The study revealed that C/Co composite nanofibers were successfully prepared and cobalt particles with diameters of 20–30 nm were uniformly scattered in the carbon nanofibers. It was also observed that clear fibrous morphology with grainlike particles and good structural integrity were still maintained after calcination. The TGA analysis indicated the improved thermal stability properties of the composite nanofibers. The Brunauer-Emmett-Teller (BET) analysis indicated that C/Co composites nanofibers with meso-pores possessed larger specific surface area than that of carbon nanofibers.

Thermally Stable Two-Dimensional Photonic Crystal for Selective Emitters

2013 ◽  
Vol 1497 ◽  
Author(s):  
Heon J. Lee ◽  
Stephen P. Bathurst ◽  
Sang-Gook Kim
Keyword(s):  
Thermal Stability ◽  
Photonic Crystal ◽  
Structural Integrity ◽  
Electrical Energy ◽  
Crystallization Surface ◽  
Thermal Emitters ◽  
Spectral Control ◽  
Experimental Validations ◽  
Selective Emitters ◽  
Thermal Stability Of

ABSTRACTA fundamental challenge in solar-thermal-electrical energy conversion is the thermal stability of materials and devices at high operational temperatures. This study focuses on the thermal stability of selective emitters for solar thermophotovoltaic (STPV) systems to enhance the conversion efficiency. 2-D photonic crystals are periodic micro/nano-scale structures that are designed to affect the motion of photons at certain wavelengths. The structured patterns, however, lose their structural integrity at high temperature, which disrupts the tight tolerances required for spectral control of the thermal emitters. Through analytical studies and experimental observations, the four major mechanisms of thermal degradation of 2-D photonic crystal are identified: oxidation, grain growth and re-crystallization, surface diffusion, and evaporation and re-condensation. In this work, the design of a flat surface photonic crystal (FSPC) is proposed and experimental validations are performed.

scholarly journals Structure and Thermal Stability of wtRop and RM6 Proteins through All-Atom Molecular Dynamics Simulations and Experiments

2021 ◽  
Vol 22 (11) ◽  
pp. 5931
Author(s):  
Maria Arnittali ◽  
Anastassia N. Rissanou ◽  
Maria Amprazi ◽  
Michael Kokkinidis ◽  
Vagelis Harmandaris
Keyword(s):  
Molecular Dynamics ◽  
Thermal Stability ◽  
Structural Integrity ◽  
Md Simulations ◽  
Effect Of Temperature ◽  
Key Factors ◽  
Loop Region ◽  
Dynamics Simulations ◽  
Experimental Findings ◽  
Thermal Stability Of

In the current work we study, via molecular simulations and experiments, the folding and stability of proteins from the tertiary motif of 4-α-helical bundles, a recurrent motif consisting of four amphipathic α-helices packed in a parallel or antiparallel fashion. The focus is on the role of the loop region in the structure and the properties of the wild-type Rop (wtRop) and RM6 proteins, exploring the key factors which can affect them, through all-atom molecular dynamics (MD) simulations and supporting by experimental findings. A detailed investigation of structural and conformational properties of wtRop and its RM6 loopless mutation is presented, which display different physical characteristics even in their native states. Then, the thermal stability of both proteins is explored showing RM6 as more thermostable than wtRop through all studied measures. Deviations from native structures are detected mostly in tails and loop regions and most flexible residues are indicated. Decrease of hydrogen bonds with the increase of temperature is observed, as well as reduction of hydrophobic contacts in both proteins. Experimental data from circular dichroism spectroscopy (CD), are also presented, highlighting the effect of temperature on the structural integrity of wtRop and RM6. The central goal of this study is to explore on the atomic level how a protein mutation can cause major changes in its physical properties, like its structural stability.

Thermal and Fade Aspects of a Non Asbestos Semi Metallic Disc Brake Pad Formulation with Two Different Resins

2012 ◽  
Vol 622-623 ◽  
pp. 1559-1563
Author(s):  
M.A. Sai Balaji ◽  
K. Kalaichelvan
Keyword(s):  
Thermal Stability ◽  
Friction And Wear ◽  
Phenolic Resin ◽  
Structural Integrity ◽  
Friction Material ◽  
Performance Criteria ◽  
Brake Pad ◽  
Friction Materials ◽  
Brake Pads ◽  
Thermal Stability Of

The formulation of a brake pad requires the optimization of multiple performance criteria. To achieve a stable and adequate friction (µ), the brake pad materials should have low fade and higher recovery characteristics coupled with less wear and noise. Among the properties mentioned, resistance to fade is very difficult to achieve. The type and amount of resin in the friction material is very critical for structural integrity of the composites. The binder should not deteriorate under any diverse conditions. The thermal stability of friction materials and its capacity to bind its ingredients collectively under diverse conditions depend upon the quality and proportion of resin. The current work evaluates the fade and recovery behaviour of developed friction composites from two different resins which are traditional straight phenolic resin and the alkyl benzene modified phenolic resin. Two brake pads with these different resins were fabricated as per Industrial Standard. TGA is carried between 150 – 4000 C as this zone of temperature is very critical which accounts for the weight loss (Thermal degradation). Friction and wear studies were carried out on a friction coefficient test rig as per SAE J661a standard. The results showed that the fade and wear of the friction materials were closely related to the thermal decomposition of the binder resin and durability of the contact plateaus, which were produced by the compaction of wear debris around hard ingredients on the rubbing surface. It was clearly observed that the friction materials with modified resin showed significant reduction in fade %. Friction materials made with higher thermal stability showed resistance to fade. However wear didn’t show much noticeable changes.

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

Thermal stability of Al-Cu-Fe icosahedral alloys

1991 ◽  
Vol 1 (12) ◽  
pp. 1823-1836 ◽  
Author(s):  
M. Bessière ◽  
A. Quivy ◽  
S. Lefebvre ◽  
J. Devaud-Rzepski ◽  
Y. Calvayrac
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of
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