Efficient and Facile Method of Preparing Superamphiphobic Surfaces on Cu Substrates

2021 ◽  
Author(s):  
Jiyuan Zhu ◽  
Kaijin Liao
Keyword(s):  
Cu Substrates

Extraordinary dendrite-free Li deposition on highly uniform facet wrinkled Cu substrates in carbonate electrolytes

Nano Energy ◽  
2020 ◽  
pp. 105736
Author(s):  
Ju Ye Kim ◽  
Oh B. Chae ◽  
Mihye Wu ◽  
Eunsoo Lim ◽  
Gukbo Kim ◽  
...  
Keyword(s):  
Cu Substrates ◽  
Highly Uniform

scholarly journals Effect of Plating Current Density on the Ball-On-Disc Wear of Sn-Plated Ni Coatings on Cu Foils

Coatings ◽  
2021 ◽  
Vol 11 (1) ◽  
pp. 56
Author(s):  
Ashutosh Sharma ◽  
Byungmin Ahn
Keyword(s):  
Current Density ◽  
Wear Loss ◽  
Wear Properties ◽  
Friction Behavior ◽  
Track Geometry ◽  
Cu Substrates ◽  
Current Densities ◽  
The Impact ◽  
Sliding Distance ◽  
Ball On Disc

Metallic and alloyed coatings are used widely in several decorative and technology-based applications. In this work, we selected Sn coatings plated on Cu substrates for joining applications. We employed two different plating baths for the fabrication of Sn and Ni coatings: acidic stannous sulfate for Sn and Watts bath for Ni layer. The plating current densities were varied from 100–500 mA/cm2. Further, the wear and friction behavior of the coatings were studied using a ball-on-disc apparatus under dry sliding conditions. The impact of current density was studied on the morphology, wear, and coefficient of friction (COF) of the resultant coatings. The wear experiments were done at various loads from 2–10 N. The sliding distance was fixed to 7 m. The wear loss was quantified in terms of the volume of the track geometry (width and depth of the tracks). The results indicate that current density has an important role in tailoring the composition and morphology of coatings, which affects the wear properties. At higher loads (8–10 N), Sn coatings on Ni/Cu had higher volume loss with a stable COF due to a mixed adhesive and oxidative type of wear mechanism.

Slow surface diffusion on Cu substrates in Li metal batteries

2021 ◽  
Author(s):  
Ingeborg Treu Røe ◽  
Sondre K. Schnell
Keyword(s):  
Crystal Structure ◽  
Energy Density ◽  
High Energy ◽  
High Energy Density ◽  
Lithium Metal ◽  
Metal Anode ◽  
Lithium Metal Batteries ◽  
Lithium Metal Anode ◽  
Slow Surface ◽  
Cu Substrates

Dendrite growth on the lithium metal anode still obstructs a widespread commercialization of high energy density lithium metal batteries. In this work, we investigate how the crystal structure of the...

Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates

2021 ◽  
Author(s):  
Jacopo Pascucci ◽  
Fosca Conti ◽  
Sri Krishna Bhogaraju ◽  
Raffaella Signorini ◽  
E. Liu ◽  
...  
Keyword(s):  
Cu Substrates

Hybrid Metallic Coatings on Polymer-Based Composites

2021 ◽  
Author(s):  
Panteha Fallah ◽  
Stephen Yue ◽  
André McDonald
Keyword(s):  
Cold Spraying ◽  
Deposition Efficiency ◽  
Major Effect ◽  
Fiber Reinforced Polymers ◽  
Carbon Fiber Reinforced Polymers ◽  
Reinforced Polymers ◽  
Particle Layer ◽  
Cu Substrates ◽  
Relative Hardness ◽  
Cu Interlayer

Abstract A previous study showed that Cu can be cold sprayed onto carbon fiber-reinforced polymers (CFRPs) if a Cu interlayer is deposited prior to low-pressure cold spraying. In this present study, Cu was cold sprayed onto CFRP substrates that were coated with either Sn (cold spray) or Ni electroplating. Two layers of Cu powder were also cold sprayed onto a Cu-plated CFRP substrate to investigate the effect of a second particle layer on impacting particles. Test results showed that the relative hardness between the particle and substrate has a major effect on deformability, impact mode, and deposition efficiency (DE), which explains why Cu could not be cold sprayed onto Sn or Ni interlayers and why the deposition efficiency of Cu-on-Cu substrates is lower than that of one pass spraying. In summary, the results suggest that Cu can be successfully cold sprayed at low pressures onto electroplated Cu due to their similarity in hardness.

Electrostatic powder impact deposition (EPID) of Ge on Si and Cu substrates, microstructure and morphology study

2000 ◽  
Vol 33 (10) ◽  
pp. 1155-1160
Author(s):  
H G Svavarsson ◽  
S Olafsson ◽  
N Hellgren ◽  
U Helmersson
Keyword(s):  
Morphology Study ◽  
Cu Substrates
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