Spindle-Shaped Surface Microstructure Inspired by Directional Water Collection Biosystems to Enhance Interfacial Wetting and Bonding Strength

2021 ◽  
Vol 13 (11) ◽  
pp. 13760-13770
Author(s):  
Hailang Wan ◽  
Junying Min ◽  
Blair E. Carlson ◽  
Jianping Lin ◽  
Chengcheng Sun
Keyword(s):  
Bonding Strength ◽  
Surface Microstructure ◽  
Shaped Surface ◽  
Water Collection

Influence of surface microstructure on bonding strength of modified polypropylene/aluminum alloy direct adhesion

2019 ◽  
Vol 489 ◽  
pp. 392-402 ◽  
Author(s):  
Jing Chen ◽  
Kunpeng Du ◽  
Xiumin Chen ◽  
Youbing Li ◽  
Jin Huang ◽  
...  
Keyword(s):  
Aluminum Alloy ◽  
Bonding Strength ◽  
Surface Microstructure

Effect of the surface microstructure ablated by femtosecond laser on the bonding strength of EBCs for SiC/SiC composites

2018 ◽  
Vol 424 ◽  
pp. 137-144 ◽  
Author(s):  
Zhaoyang Zhai ◽  
Wenjun Wang ◽  
Xuesong Mei ◽  
Ming Li ◽  
Jianlei Cui ◽  
...  
Keyword(s):  
Femtosecond Laser ◽  
Bonding Strength ◽  
Surface Microstructure ◽  
Sic Composites

Effects of surface microstructure and molding parameters on injection bonding strength of polyphenylenesulphide-aluminum alloy

2020 ◽  
Vol 10 (5) ◽  
pp. 640-647
Author(s):  
Zhenyu Xu ◽  
Ning Li
Keyword(s):  
Aluminum Alloy ◽  
Injection Molding ◽  
Bonding Strength ◽  
Direct Injection ◽  
Processing Parameters ◽  
Surface Microstructure ◽  
Injection Molding Process ◽  
Molding Process ◽  
Orthogonal Test Design ◽  
Highly Correlated

The direct injection molding process of PPS-aluminum alloy composite parts under vacuum condition was conducted and the processing parameters were optimized through the numerical simulation and orthogonal test design. The effect of surface microstructure of the aluminum alloy splines and injection molding processing parameters on the bonding strength of the composite parts were discussed. The results show that the bonding strength of the composite parts increases with not only the increase in the diameter and quantity of the microscopic pores and also the surface roughness of the aluminum alloy splines. The bonding strength can also been improved under a higher vacuum. The bonding strength is highly correlated to the micromechanical interlocking structure formed by the PPS embedding into the rough surface of the aluminum alloy splines.

Preparation of Backthinned Ceramic Specimens

1985 ◽  
Vol 43 ◽  
pp. 182-183
Author(s):  
A. T. Fisher ◽  
P. Angelini
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Vacuum System ◽  
Back Surface ◽  
Surface Microstructure ◽  
Ion Milling ◽  
Near Surface ◽  
Depth Profiles ◽  
Analytical Electron ◽  
Ion Implanted

Analytical electron microscopy (AEM) of the near surface microstructure of ion implanted ceramics can provide much information about these materials. Backthinning of specimens results in relatively large thin areas for analysis of precipitates, voids, dislocations, depth profiles of implanted species and other features. One of the most critical stages in the backthinning process is the ion milling procedure. Material sputtered during ion milling can redeposit on the back surface thereby contaminating the specimen with impurities such as Fe, Cr, Ni, Mo, Si, etc. These impurities may originate from the specimen, specimen platform and clamping plates, vacuum system, and other components. The contamination may take the form of discrete particles or continuous films [Fig. 1] and compromises many of the compositional and microstructural analyses. A method is being developed to protect the implanted surface by coating it with NaCl prior to backthinning. Impurities which deposit on the continuous NaCl film during ion milling are removed by immersing the specimen in water and floating the contaminants from the specimen as the salt dissolves.

The effect of air-particle abrasion and a zirconia primer application on resin cement bonding strength to zirconia

2019 ◽  
Vol 68 (2) ◽  
Author(s):  
Alana M. Dantas ◽  
Fernanda Campos ◽  
Sarina M. Pereira ◽  
Elis J. dos Santos ◽  
Laudenice L. Pereira ◽  
...  
Keyword(s):  
Bonding Strength ◽  
Resin Cement

Surface Microstructure Evolution Upon Silicidation of Ni(Pt) and the Different Responses to Metal Etch

2013 ◽  
Author(s):  
Wentao Qin ◽  
Dorai Iyer ◽  
Jim Morgan ◽  
Carroll Casteel ◽  
Robert Watkins ◽  
...  
Keyword(s):  
Thin Film ◽  
Oxide Film ◽  
Microstructure Evolution ◽  
Depth Profiling ◽  
Surface Microstructure ◽  
The Difference ◽  
Surface Microstructures ◽  
Pt Films

Abstract Ni(5 at.%Pt ) films were silicided at a temperature below 400 °C and at 550 °C. The two silicidation temperatures had produced different responses to the subsequent metal etch. Catastrophic removal of the silicide was seen with the low silicidation temperature, while the desired etch selectivity was achieved with the high silicidation temperature. The surface microstructures developed were characterized with TEM and Auger depth profiling. The data correlate with both silicidation temperatures and ultimately the difference in the response to the metal etch. With the high silicidation temperature, there existed a thin Si-oxide film that was close to the surface and embedded with particles which contain metals. This thin film is expected to contribute significantly to the desired etch selectivity. The formation of this layer is interpreted thermodynamically.

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