Bioinspired Manufacturing of Aerogels with Precisely Manipulated Surface Microstructure through Controlled Local Temperature Gradients

2021 ◽  
Author(s):  
Halil Tetik ◽  
Dan Feng ◽  
Samuel W. Oxandale ◽  
Guang Yang ◽  
Keren Zhao ◽  
...  
Keyword(s):  
Temperature Gradients ◽  
Local Temperature ◽  
Surface Microstructure

Relation between local temperature gradients and the direction of heat flow in quantum driven systems

2012 ◽  
Vol 407 (16) ◽  
pp. 3172-3174 ◽  
Author(s):  
Alvaro Caso ◽  
Liliana Arrachea ◽  
Gustavo S. Lozano
Keyword(s):  
Heat Flow ◽  
Temperature Gradients ◽  
Local Temperature ◽  
Driven Systems

Pulsated flow regime in fractures: a possible explanation of local temperature gradients in hydrothermal systems

Geothermics ◽  
1990 ◽  
Vol 19 (4) ◽  
pp. 329-339 ◽  
Author(s):  
Pierre-Olivier Grimaud ◽  
Gérard Touchard ◽  
Daniel Beaufort ◽  
Alain Meunier
Keyword(s):  
Flow Regime ◽  
Hydrothermal Systems ◽  
Temperature Gradients ◽  
Local Temperature

scholarly journals The use of ultrasonic cavitation for near-surface structuring of robust and low-cost AlNi catalysts for hydrogen production

2015 ◽  
Vol 17 (5) ◽  
pp. 2745-2749 ◽  
Author(s):  
P. V. Cherepanov ◽  
I. Melnyk ◽  
E. V. Skorb ◽  
P. Fratzl ◽  
E. Zolotoyabko ◽  
...  
Keyword(s):  
Hydrogen Production ◽  
Shock Waves ◽  
Low Cost ◽  
Ultrasonic Cavitation ◽  
Temperature Gradients ◽  
Local Temperature ◽  
Near Surface ◽  
Surface Structuring ◽  
Interparticle Collisions

Ultrasonically induced shock waves stimulate intensive interparticle collisions in suspensions and create large local temperature gradients in AlNi particles.

Preparation of Backthinned Ceramic Specimens

1985 ◽  
Vol 43 ◽  
pp. 182-183
Author(s):  
A. T. Fisher ◽  
P. Angelini
Keyword(s):  
Electron Microscopy ◽  
Analytical Electron Microscopy ◽  
Vacuum System ◽  
Back Surface ◽  
Surface Microstructure ◽  
Ion Milling ◽  
Near Surface ◽  
Depth Profiles ◽  
Analytical Electron ◽  
Ion Implanted

Analytical electron microscopy (AEM) of the near surface microstructure of ion implanted ceramics can provide much information about these materials. Backthinning of specimens results in relatively large thin areas for analysis of precipitates, voids, dislocations, depth profiles of implanted species and other features. One of the most critical stages in the backthinning process is the ion milling procedure. Material sputtered during ion milling can redeposit on the back surface thereby contaminating the specimen with impurities such as Fe, Cr, Ni, Mo, Si, etc. These impurities may originate from the specimen, specimen platform and clamping plates, vacuum system, and other components. The contamination may take the form of discrete particles or continuous films [Fig. 1] and compromises many of the compositional and microstructural analyses. A method is being developed to protect the implanted surface by coating it with NaCl prior to backthinning. Impurities which deposit on the continuous NaCl film during ion milling are removed by immersing the specimen in water and floating the contaminants from the specimen as the salt dissolves.

Surface Microstructure Evolution Upon Silicidation of Ni(Pt) and the Different Responses to Metal Etch

2013 ◽  
Author(s):  
Wentao Qin ◽  
Dorai Iyer ◽  
Jim Morgan ◽  
Carroll Casteel ◽  
Robert Watkins ◽  
...  
Keyword(s):  
Thin Film ◽  
Oxide Film ◽  
Microstructure Evolution ◽  
Depth Profiling ◽  
Surface Microstructure ◽  
The Difference ◽  
Surface Microstructures ◽  
Pt Films

Abstract Ni(5 at.%Pt ) films were silicided at a temperature below 400 °C and at 550 °C. The two silicidation temperatures had produced different responses to the subsequent metal etch. Catastrophic removal of the silicide was seen with the low silicidation temperature, while the desired etch selectivity was achieved with the high silicidation temperature. The surface microstructures developed were characterized with TEM and Auger depth profiling. The data correlate with both silicidation temperatures and ultimately the difference in the response to the metal etch. With the high silicidation temperature, there existed a thin Si-oxide film that was close to the surface and embedded with particles which contain metals. This thin film is expected to contribute significantly to the desired etch selectivity. The formation of this layer is interpreted thermodynamically.

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