Highly Thermally Conductive and Superior Electrical Insulation Polymer Composites via In Situ Thermal Expansion of Expanded Graphite and In Situ Oxidation of Aluminum Nanoflakes

2020 ◽  
Author(s):  
Shuangqiao Yang ◽  
Qi Wang ◽  
Bianying Wen
Keyword(s):  
Thermal Expansion ◽  
Polymer Composites ◽  
Expanded Graphite ◽  
Electrical Insulation ◽  
In Situ Oxidation ◽  
Thermally Conductive

In Situ Alloying of Thermally Conductive Polymer Composites by Combining Liquid and Solid Metal Microadditives

2018 ◽  
Vol 10 (2) ◽  
pp. 2083-2092 ◽  
Author(s):  
Matthew I. Ralphs ◽  
Nicholas Kemme ◽  
Prathamesh B. Vartak ◽  
Emil Joseph ◽  
Sujal Tipnis ◽  
...  
Keyword(s):  
Polymer Composites ◽  
Conductive Polymer ◽  
Solid Metal ◽  
Conductive Polymer Composites ◽  
Thermally Conductive

scholarly journals Highly thermally conductive and electrically insulating polymer nanocomposites with boron nitride nanosheet/ionic liquid complexes

RSC Advances ◽  
2017 ◽  
Vol 7 (58) ◽  
pp. 36450-36459 ◽  
Author(s):  
Takuya Morishita ◽  
Naoko Takahashi
Keyword(s):  
Ionic Liquid ◽  
Boron Nitride ◽  
Polymer Composites ◽  
Polymer Nanocomposites ◽  
Electrical Insulation ◽  
Significant Enhancement ◽  
Boron Nitride Nanosheet ◽  
Thermally Conductive ◽  
Thermal Conductivities

Boron nitride nanosheet (BNNS)/ionic liquid (IL)/polymer composites show significant enhancement of through-plane and in-plane thermal conductivities and electrical insulation.

scholarly journals A Review of Polymer Composites Based on Carbon Fillers for Thermal Management Applications: Design, Preparation, and Properties

Polymers ◽  
2021 ◽  
Vol 13 (8) ◽  
pp. 1312
Author(s):  
Yeon Ju Kwon ◽  
Jung Bin Park ◽  
Young-Pyo Jeon ◽  
Jin-Yong Hong ◽  
Ho Seok Park ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Management ◽  
Polymer Composite ◽  
Management System ◽  
Electronic Devices ◽  
Electrical Insulation ◽  
Thermal Management System ◽  
Thermally Conductive ◽  
Carbon Fillers

With the development of microelectronic devices having miniaturized and integrated electronic components, an efficient thermal management system with lightweight materials, which have outstanding thermal conductivity and processability, is becoming increasingly important. Recently, the use of polymer-based thermal management systems has attracted much interest due to the intrinsic excellent properties of the polymer, such as the high flexibility, low cost, electrical insulation, and excellent processability. However, most polymers possess low thermal conductivity, which limits the thermal management applications of them. To address the low thermal conduction of the polymer materials, many kinds of thermally conductive fillers have been studied, and the carbon-based polymer composite is regarded as one of the most promising materials for the thermal management of the electric and electronic devices. In addition, the next generation electronic devices require composite materials with various additional functions such as flexibility, low density, electrical insulation, and oriented heat conduction, as well as ultrahigh thermal conductivity. In this review, we introduce the latest papers on thermally conductive polymer composites based on carbon fillers with sophisticated structures to meet the above requirements. The topic of this review paper consists of the following four contents. First, we introduce the design of a continuous three-dimensional network structure of carbon fillers to reduce the thermal resistance between the filler–matrix interface and individual filler particles. Second, we discuss various methods of suppressing the electrical conductivity of carbon fillers in order to manufacture the polymer composites that meet both the electrical insulation and thermal conductivity. Third, we describe a strategy for the vertical alignment of carbon fillers to improve the through-plane thermal conductivity of the polymer composite. Finally, we briefly mention the durability of the thermal conductivity performance of the carbon-based composites. This review presents key technologies for a thermal management system of next-generation electronic devices.

scholarly journals Thermally Conductive Shape Memory Polymer Composites Filled with Boron Nitride for Heat Management in Electrical Insulation

Polymers ◽  
2021 ◽  
Vol 13 (13) ◽  
pp. 2191
Author(s):  
Andrzej Rybak ◽  
Lukasz Malinowski ◽  
Agnieszka Adamus-Wlodarczyk ◽  
Piotr Ulanski
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Shape Memory ◽  
Polymer Composites ◽  
Heat Dissipation ◽  
Shape Memory Polymer ◽  
Electrical Insulation ◽  
Heat Management ◽  
Crosslinked Polymer ◽  
Thermally Conductive

The evaluation of a possible application of functional shrinkable materials in thermally conductive electrical insulation elements was investigated. The effectiveness of an electron beam and gamma radiation on the crosslinking of a selected high density polyethylene grade was analyzed, both qualitatively and quantitatively. The crosslinked polymer composites filled with ceramic particles were successfully fabricated and tested. On the basis of the performed investigation, it was concluded that the selected filler, namely a boron nitride powder, is suitable for the preparation of the crosslinked polymer composites with enhanced thermal conductivity. The shape memory effect was fully observed in the crosslinked samples with a recovery factor reaching nearly 99%. There was no significant influence of the crosslinking, stretching, and recovery of the polymer composite during shape memory phenomenon on the value of thermal conductivity. The proposed boron nitride filled polyethylene composite subjected to crosslinking is a promising candidate for fabrication of thermally shrinkable material with enhanced heat dissipation functionality for application as electrically insulating components.

Characterizations of expanded graphite/polymer composites prepared by in situ polymerization

Carbon ◽  
2004 ◽  
Vol 42 (14) ◽  
pp. 2839-2847 ◽  
Author(s):  
Genhua Zheng ◽  
Jingshen Wu ◽  
Wenping Wang ◽  
Caiyuan Pan
Keyword(s):  
Polymer Composites ◽  
In Situ Polymerization ◽  
Expanded Graphite

Technology Status Review In Situ Oxidation

1999 ◽  
Author(s):  
VIRGINIA UNIV CHARLOTTESVILLE
Keyword(s):  
In Situ Oxidation

scholarly journals Phase Transition and Coefficients of Thermal Expansion in Al2−xInxW3O12 (0.2 ≤ x ≤ 1)

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 4021
Author(s):  
Andrés Esteban Cerón Cerón Cortés ◽  
Anja Dosen ◽  
Victoria L. Blair ◽  
Michel B. Johnson ◽  
Mary Anne White ◽  
...  
Keyword(s):  
Phase Transition ◽  
Thermal Expansion ◽  
Thermal Shock ◽  
Monoclinic Phase ◽  
Ceramic Materials ◽  
Precipitation Method ◽  
Scanning Calorimetry ◽  
Orthorhombic Crystal ◽  
Co Precipitation

Materials from theA2M3O12 family are known for their extensive chemical versatility while preserving the polyhedral-corner-shared orthorhombic crystal system, as well as for their consequent unusual thermal expansion, varying from negative and near-zero to slightly positive. The rarest are near-zero thermal expansion materials, which are of paramount importance in thermal shock resistance applications. Ceramic materials with chemistry Al2−xInxW3O12 (x = 0.2–1.0) were synthesized using a modified reverse-strike co-precipitation method and prepared into solid specimens using traditional ceramic sintering. The resulting materials were characterized by X-ray powder diffraction (ambient and in situ high temperatures), differential scanning calorimetry and dilatometry to delineate thermal expansion, phase transitions and crystal structures. It was found that the x = 0.2 composition had the lowest thermal expansion, 1.88 × 10−6 K−1, which was still higher than the end member Al2W3O12 for the chemical series. Furthermore, the AlInW3O12 was monoclinic phase at room temperature and transformed to the orthorhombic form at ca. 200 °C, in contrast with previous reports. Interestingly, the x = 0.2, x = 0.4 and x = 0.7 materials did not exhibit the expected orthorhombic-to-monoclinic phase transition as observed for the other compositions, and hence did not follow the expected Vegard-like relationship associated with the electronegativity rule. Overall, compositions within the Al2−xInxW3O12 family should not be considered candidates for high thermal shock applications that would require near-zero thermal expansion properties.

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