scholarly journals On the Correlation between Light-Induced Degradation and Minority Carrier Traps in Boron-Doped Czochralski Silicon

2021 ◽  
Vol 13 (5) ◽  
pp. 6140-6146
Author(s):  
Saman Jafari ◽  
Yan Zhu ◽  
Fiacre Rougieux ◽  
Joyce Ann T. De Guzman ◽  
Vladimir P. Markevich ◽  
...  
2001 ◽  
Vol 90 (5) ◽  
pp. 2397-2404 ◽  
Author(s):  
S. W. Glunz ◽  
S. Rein ◽  
J. Y. Lee ◽  
W. Warta

Author(s):  
Abigail Rose Meyer ◽  
Craig P Taylor ◽  
Michael Venuti ◽  
Serena Eley ◽  
Vincenzo LaSalvia ◽  
...  

Boron-doped Czochralski (Cz) Si is the most commonly used semiconductor in the fabrication of solar cells. The minority carrier lifetime in boron-doped Cz Si decreases upon light exposure due to...


2009 ◽  
Vol 156-158 ◽  
pp. 101-106 ◽  
Author(s):  
Douglas M. Jordan ◽  
Kanad Mallik ◽  
Robert J. Falster ◽  
Peter R. Wilshaw

The concept of fully encapsulated, semi-insulating silicon (SI-Si), Czochralski-silicon-on-insulator (CZ-SOI) substrates for silicon microwave devices is presented. Experimental results show that, using gold as a compensating impurity, a Si resistivity of order 400 kΩcm can be achieved at room temperature using lightly phosphorus doped substrates. This compares favourably with the maximum of ~180kΩcm previously achieved using lightly boron doped wafers and is due to a small asymmetry of the position of the two gold energy levels introduced into the band gap. Measurements of the temperature dependence of the resistivity of the semi-insulating material show that a resistivity ~5kΩcm can be achieved at 100°C. Thus the substrates are suitable for microwave devices working at normal operating temperatures and should allow Si to be used for much higher frequency microwave applications than currently possible.


1995 ◽  
Vol 378 ◽  
Author(s):  
Subhash M. Joshi ◽  
Ylrich M. GÖsele ◽  
Teh Y. Tan

AbstractGettering is widely used for fabricating integrated circuits using Si substrates, and has great potential for solar cell fabrications as well. Recently available solar cell efficiency studies have shown the benefits of the wafer backside Al, attributable to effects of gettering, a wafer backside field, and passivation of grain boundaries and dislocations. In this paper, we report experimental results which showed unambiguously that Czochralski Si wafer bulk minority carrier diffusion lengths can be significantly improved due to gettering of impurities by wafer backside Al, which also provided a protection from environmental contamination.


2019 ◽  
Vol 33 (11) ◽  
pp. 121-132 ◽  
Author(s):  
John D. Murphy ◽  
Karsten Bothe ◽  
Massimiliano Olmo ◽  
Vladimir V. Voronkov ◽  
Robert J. Falster

2019 ◽  
Vol 9 (3) ◽  
pp. 652-659 ◽  
Author(s):  
Yan Zhu ◽  
Mattias Klaus Juhl ◽  
Gianluca Coletti ◽  
Ziv Hameiri

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