Oriented LiMn2O4 Particle Fracture from Delithiation-Driven Surface Stress

2020 ◽  
Vol 12 (43) ◽  
pp. 49182-49191
Author(s):  
Robert E. Warburton ◽  
Fernando C. Castro ◽  
Siddharth Deshpande ◽  
Kenneth E. Madsen ◽  
Kimberly L. Bassett ◽  
...  
Keyword(s):  
Surface Stress ◽  
Particle Fracture

Propagation and Reflection of Plane Waves in a Rotating Magneto-Elastic Fibre-Reinforced Semi Space with Surface Stress

2020 ◽  
Vol 22 (4) ◽  
pp. 939-958
Author(s):  
Indrajit Roy ◽  
D. P. Acharya ◽  
Sourav Acharya
Keyword(s):  
Surface Stress ◽  
Incident Angle ◽  
Plane Waves ◽  
Three Dimensional ◽  
Elastic Fibre ◽  
Amplitude Ratios ◽  
Governing Equations ◽  
Rotation Surface ◽  
Wave Velocities ◽  
Magnetic Field Rotation

AbstractThe present paper investigates the propagation of quasi longitudinal (qLD) and quasi transverse (qTD) waves in a magneto elastic fibre-reinforced rotating semi-infinite medium. Reflections of waves from the flat boundary with surface stress have been studied in details. The governing equations have been used to obtain the polynomial characteristic equation from which qLD and qTD wave velocities are found. It is observed that both the wave velocities depend upon the incident angle. After imposing the appropriate boundary conditions including surface stress the resultant amplitude ratios for the total displacements have been obtained. Numerically simulated results have been depicted graphically by displaying two and three dimensional graphs to highlight the influence of magnetic field, rotation, surface stress and fibre-reinforcing nature of the material medium on the propagation and reflection of plane waves.

Whisker Formation in Copper Electroplating

2011 ◽  
Author(s):  
Theresa Han ◽  
Eunin Cho ◽  
Jinwoo Heo ◽  
Seoung Jae Lee
Keyword(s):  
Copper Sulfate ◽  
Surface Stress ◽  
Whisker Formation ◽  
Printed Wiring Boards ◽  
Copper Electroplating ◽  
Cu Electroplating ◽  
Solution Surface ◽  
Dry Film

Abstract In the manufacture of Printed Wiring Boards (PWB), unwelcome structures, such as nodules and whiskers can be formed during copper electroplating with copper sulfate. Copper (Cu) whiskers with lengths of up to a few hundred micrometers can lead to electrical shorts between layers or patterns. In this paper, we document factors that can affect the growth of Cu whiskers; decomposition of additives in the Cu electroplating solution, surface stress, acidic cleaner, and the ingredients of a dry film. Contaminants from outside of the electroplating bath and the ingredients of the dry film were shown as key components in the formation of Cu whiskers.

Effect of size dependent surface stress on bending of ultrathin nanofilms

2020 ◽  
Vol 13 (11) ◽  
pp. 115004
Author(s):  
Yehejong Saqier ◽  
Guohong Yun ◽  
Bai Narsu
Keyword(s):  
Surface Stress ◽  
Size Dependent

scholarly journals Ab initio study of surface stress response to charging

2007 ◽  
Vol 78 (1) ◽  
pp. 13001 ◽  
Author(s):  
Y Umeno ◽  
C Elsässer ◽  
B Meyer ◽  
P Gumbsch ◽  
M Nothacker ◽  
...  
Keyword(s):  
Stress Response ◽  
Ab Initio ◽  
Surface Stress ◽  
Ab Initio Study

Surface stress of nano-crystals

2021 ◽  
pp. 125091
Author(s):  
Siu-Wai Chan ◽  
Wenxuan Wang
Keyword(s):  
Surface Stress

scholarly journals Turbulent oscillating channel flow subjected to a free-surface stress

2010 ◽  
Vol 22 (9) ◽  
pp. 095101 ◽  
Author(s):  
W. Kramer ◽  
H. J. H. Clercx ◽  
V. Armenio
Keyword(s):  
Free Surface ◽  
Channel Flow ◽  
Surface Stress
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