Alumina-Coated Cu@Reduced Graphene Oxide Microspheres as Enhanced Antioxidative and Electrically Insulating Fillers for Thermal Interface Materials with High Thermal Conductivity

2019 ◽  
Vol 1 (7) ◽  
pp. 1330-1335 ◽  
Author(s):  
Huangqing Ye ◽  
Haoran Wen ◽  
Jiahui Chen ◽  
Pengli Zhu ◽  
Matthew M. F. Yuen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Reduced Graphene Oxide ◽  
High Thermal Conductivity ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Reduced Graphene ◽  
Interface Materials

scholarly journals Globular Flower-Like Reduced Graphene Oxide Design for Enhancing Thermally Conductive Properties of Silicone-Based Spherical Alumina Composites

Nanomaterials ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 544
Author(s):  
Weijie Liang ◽  
Tiehu Li ◽  
Xiaocong Zhou ◽  
Xin Ge ◽  
Xunjun Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Reduced Graphene Oxide ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Reduced Graphene ◽  
The Matrix ◽  
Thermally Conductive ◽  
Interface Materials ◽  
Spherical Alumina

The enhancement of thermally conductive performances for lightweight thermal interface materials is a long-term effort. The superb micro-structures of the thermal conductivity enhancer have an important impact on increasing thermal conductivity and decreasing thermal resistance. Here, globular flower-like reduced graphene oxide (GFRGO) is designed by the self-assembly of reduced graphene oxide (RGO) sheets, under the assistance of a binder via the spray-assisted method for silicone-based spherical alumina (S-Al2O3) composites. When the total filler content is fixed at 84 wt%, silicone-based S-Al2O3 composites with 1 wt% of GFRGO exhibit a much more significant increase in thermal conductivity, reduction in thermal resistance and reinforcement in thermal management capability than that of without graphene. Meanwhile, GFRGO is obviously superior to that of their RGO counterparts. Compared with RGO sheets, GFRGO spheres which are well-distributed between the S-Al2O3 fillers and well-dispersed in the matrix can build three-dimensional and isotropic thermally conductive networks more effectively with S-Al2O3 in the matrix, and this minimizes the thermal boundary resistance among components, owning to its structural characteristics. As with RGO, the introduction of GFRGO is helpful when decreasing the density of silicone-based S-Al2O3 composites. These attractive results suggest that the strategy opens new opportunities for fabricating practical, high-performance and light-weight filler-type thermal interface materials.

Development of a Compliant Nanothermal Interface Material

2011 ◽  
Author(s):  
David Shaddock ◽  
Stanton Weaver ◽  
Ioannis Chasiotis ◽  
Binoy Shah ◽  
Dalong Zhong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Stresses ◽  
Performance Testing ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bondline Thickness ◽  
Interface Materials

The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented.

scholarly journals Active thermal interface graphene nanocomposites for thermal control of electronic and power devices

2022 ◽  
Vol 2150 (1) ◽  
pp. 012008
Author(s):  
D D Babenko ◽  
A S Dmitriev ◽  
I A Mikhailova
Keyword(s):  
Thermal Conductivity ◽  
Calculated Data ◽  
Thermal Control ◽  
High Thermal Conductivity ◽  
Thermal Interface Materials ◽  
Power Devices ◽  
Thermal Interface ◽  
Graphene Nanocomposites ◽  
Nanoporous Graphene ◽  
Interface Materials

Abstract New experimental and calculated data are presented for active thermal interface materials, in which heat is removed not only due to high thermal conductivity, but also due to the evaporation of liquids, for example, water, inside a nanoporous graphene structure. It is shown that such active thermal interfaces may be new systems of active thermal control.

Superior electromagnetic interference shielding 3D graphene nanoplatelets/reduced graphene oxide foam/epoxy nanocomposites with high thermal conductivity

2019 ◽  
Vol 7 (9) ◽  
pp. 2725-2733 ◽  
Author(s):  
Chaobo Liang ◽  
Hua Qiu ◽  
Yangyang Han ◽  
Hongbo Gu ◽  
Ping Song ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Reduced Graphene Oxide ◽  
Electromagnetic Interference ◽  
Graphene Nanoplatelets ◽  
High Thermal Conductivity ◽  
Electromagnetic Interference Shielding ◽  
3D Graphene ◽  
Epoxy Nanocomposite ◽  
Reduced Graphene

A 3D graphene nanoplatelets/reduced graphene oxide foam/epoxy nanocomposite exhibits superior electromagnetic interference shielding and excellent thermal conductivity.

Graphene Encapsulating Boron Nitride Electrostatic Assemblies for Fabrication of Polymer Composites with High Thermal Conductivity

2016 ◽  
Vol 25 (6) ◽  
pp. 096369351602500 ◽  
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Boron Nitride ◽  
Polymer Composites ◽  
Reduced Graphene Oxide ◽  
Epoxy Resins ◽  
Thermal Reduction ◽  
High Thermal Conductivity ◽  
Reduced Graphene ◽  
Significant Attention

In the recent years, significant attention has been focused in insulating electronic encapsulation materials with high thermal conductivity. We fabricated reduced graphene oxide (RGO) encapsulated h-BN hybrids (h-BN@RGO) from the thermal reduction of electrostatically assembled h-BN@GO hybrids. It is found that the addition of h-BN@RGO fillers enhances the thermal conductivity of epoxy resins while preserving the electrical insulation. The thermal conductivity achieve 3.45 W.m−1.K−1, by adding 40 wt% h-BN@RGO, which is enhanced by 1643% compared with that of neat epoxy.

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

2003 ◽  
Author(s):  
Vadim Gektin ◽  
Sai Ankireddi ◽  
Jim Jones ◽  
Stan Pecavar ◽  
Paul Hundt
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Performance ◽  
Electronic Cooling ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Contact ◽  
Interface Materials ◽  
Bulk Thermal Conductivity

Thermal Interface Materials (TIMs) are used as thermally conducting media to carry away the heat dissipated by an energy source (e.g. active circuitry on a silicon die). Thermal properties of these interface materials, specified on vendor datasheets, are obtained under conditions that rarely, if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances are, and, hence, how much each influences the cooling strategy. In view of these issues, there exists a need for these materials/interfaces to be characterized experimentally through a series of controlled tests before starting on a thermal design. In this study we present one such characterization for a candidate thermal interface material used in an electronic cooling application. In a controlled test environment, package junction-to-case, Rjc, resistance measurements were obtained for various bondline thicknesses (BLTs) of an interface material over a range of die sizes. These measurements were then curve-fitted to obtain numerical models for the measured thermal resistance for a given die size. Based on the BLT and the associated thermal resistance, the bulk thermal conductivity of the TIM and the interface contact resistance were determined, using the approach described in the paper. The results of this study permit sensitivity analyses of BLT and its effect on thermal performance for future applications, and provide the ability to extrapolate the results obtained for the given die size to a different die size. The suggested methodology presents a readily adaptable approach for the characterization of TIMs and interface/contact resistances in the industry.

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