scholarly journals High-Temperature Specific Contact Resistance of Iron Disilicide Soldered to Molybdenum by Field’s Metal

2021 ◽  
Vol 3 (2) ◽  
pp. 890-897
Author(s):  
Antoine Micallef ◽  
Christian Stiewe ◽  
Gregor Oppitz ◽  
Eckhard Müller
Keyword(s):  
High Temperature ◽  
Contact Resistance ◽  
Specific Contact Resistance ◽  
Iron Disilicide ◽  
Specific Contact

Influence of Ni and Nb thickness on low specific contact resistance and high-temperature reliability of ohmic contacts to 4H-SiC

2019 ◽  
Vol 58 (11) ◽  
pp. 116501 ◽  
Author(s):  
Vuong Van Cuong ◽  
Seiji Ishikawa ◽  
Tomonori Maeda ◽  
Hiroshi Sezaki ◽  
Satoshi Yasuno ◽  
...  
Keyword(s):  
High Temperature ◽  
Contact Resistance ◽  
Ohmic Contacts ◽  
Specific Contact Resistance ◽  
Specific Contact

High Temperature Characterization Of Ni, W And Al Contacts To 3C-Silicon Carbide Thin Films

1997 ◽  
Vol 483 ◽  
Author(s):  
C Jacob ◽  
P Pirouz ◽  
H-I Kuo ◽  
M Mehregany
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
Contact Resistance ◽  
Room Temperature ◽  
Specific Contact Resistance ◽  
Large Area ◽  
Fermi Level Pinning ◽  
Specific Contact ◽  
Current Availability ◽  
Sic Films

AbstractWith the current availability of large-area 3C-SiC films, it is imperative that stable high temperature contacts be developed for high power devices. By comparing the existing data in the literature, we demonstrate that the contact behavior on each of the different polytypes of SiC will vary significantly. In particular, we demonstrate this for 6H-SiC and 3C-SiC. The interface slope parameter, S, which is a measure of the Fermi-level pinning in each system varies between 0.4–0.5 on 6H-SiC, while it is 0.6 on 3C-SiC. This implies that the barrier heights of contacts to 3C-SiC will vary more significantly with the choice of metal than for 6H-SiC.Aluminum, nickel and tungsten were deposited on 3C-SiC films and their specific contact resistance measured using the circular TLM method. High temperature measurements (up to 400°C) were performed to determine the behavior of these contacts at operational temperatures. Aluminum was used primarily as a baseline for comparison since it melts at 660°C and cannot be used for very high temperature contacts. The specific contact resistance (ρc) for nickel at room temperature was 5 × 10−4 Ω-cm2, but increased with temperature to a value of 1.5 × 10−3 Ω-cm2 at 400°C. Tungsten had a higher room temperature × 10−3 Ω-cm2, which remained relatively constant with increasing temperature up to 400°C. This is related to the fact that there is hardly any reaction between tungsten and silicon carbide even up to 900°C, whereas nickel almost completely reacts with SiC by that temperature. Contact resistance measurements were also performed on samples that were annealed at 500°C.

Ni-Al-Ti Ohmic Contacts on Al Implanted 4H-SiC

2017 ◽  
Vol 897 ◽  
pp. 391-394 ◽  
Author(s):  
P. Fedeli ◽  
Maurizio Puzzanghera ◽  
Francesco Moscatelli ◽  
Renato Amaral Minamisawa ◽  
Giovanni Alfieri ◽  
...  
Keyword(s):  
High Temperature ◽  
Contact Resistance ◽  
Ohmic Contacts ◽  
Atomic Ratio ◽  
Specific Contact Resistance ◽  
Specific Contact ◽  
P Type

This study shows that an Al-Ti bilayer with an Al to Ti atomic ratio suitable forohmic contacts on p-type 4H-SiC can be covered by a Ni film during the high temperature alloying process, without altering the ohmic nature, while eliminating a detrimental contact morphology caused by the presence of molten Al-Si during alloying. On 1×1020 cm-3 Al-implanted 4H-SiC layer, the RT specific contact resistance of this Ni-Al-Ti contact measured by TLM-C method is (3 ± 1)×10-6 Ωcm2.

scholarly journals Comparison of ohmic contact formation of titanium and zirconium on boron doped diamond

MRS Advances ◽  
2018 ◽  
Vol 3 (33) ◽  
pp. 1931-1935
Author(s):  
V. Mortet ◽  
A. Taylor ◽  
M. Davydova ◽  
L. Fekete ◽  
Z. Vlčková Živcová ◽  
...  
Keyword(s):  
High Temperature ◽  
Contact Resistance ◽  
Ohmic Contact ◽  
Ohmic Contacts ◽  
Microwave Plasma ◽  
Specific Contact Resistance ◽  
High Temperature Annealing ◽  
Boron Doped Diamond ◽  
Boron Doped ◽  
Specific Contact

ABSTRACTWith a high affinity to carbon comparable to titanium and an electrically conductive carbide, zirconium has potential to form ohmic contact on boron doped diamond. In this work, formation of ohmic contacts on boron doped diamond using zirconium is studied in comparison to titanium. Boron doped diamond epitaxial layers have been grown by microwave plasma enhanced chemical vapour deposition with various B/C ratio. Circular Transmission Line Model structures were fabricated using standard micro-fabrication technologies. Specific contact resistance of fabricated contacts was determined for different boron concentrations and for various annealing temperatures. Ohmic contacts using zirconium are formed after annealing at 400 °C. Specific contact resistance steadily decreases with high temperature annealing down to a value of ca. 1 mΩ.cm2 after annealing at 700 °C for highly boron doped diamond. In comparison, titanium contact fabricated on highly doped diamond appears not stable under high temperature annealing.

Titanium Tungsten (TiW) for Ohmic contacts to n-and p-type 4H-SiC

2000 ◽  
Vol 640 ◽  
Author(s):  
S.-K. Lee ◽  
C.-M. Zetterling ◽  
M. Östling
Keyword(s):  
High Temperature ◽  
Contact Resistance ◽  
Ohmic Contacts ◽  
Specific Contact Resistance ◽  
Term Stability ◽  
Long Term Stability ◽  
Ohmic Behavior ◽  
Specific Contact ◽  
P Type

ABSTRACTIn the present work, we investigated sputtered titanium tungsten (TiW) contacts for Ohmic contacts to both n- and p-type 4H-SiC with long-term stability under high temperature (500°C).. Epitaxial layers with a doping concentration of 1.3×1019 and 6×1018 cm−3 were used. After high temperature annealing (>950°C) sputtered TiW contacts showed Ohmic behavior with good uniform distribution of the specific contact resistance. We obtained an average specific contact resistance (pc) of 4×10−5 Ωcm2 and 1.2 ∼ 1.7×10−4 Ωcm2 for p- and n-type, respectively from linear TLM measurement. We also found some variation of the specific contact resistance and the sheet resistance from our TLM measurement for p-type contacts. We will discuss this behavior with the measurement of SIMS. Long-term stability with a top-cap layer is also discussed

High Temperature Stable WSi2-Contacts on p-6H-Silicon Carbide

1999 ◽  
Vol 572 ◽  
Author(s):  
Frank Erler ◽  
Henry Romanus ◽  
Jörg K. N. Lindner ◽  
Lothar Spiess
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
Electrical Properties ◽  
Contact Resistance ◽  
Cross Section ◽  
Ohmic Contact ◽  
Argon Atmosphere ◽  
Specific Contact Resistance ◽  
Transmission Line Model ◽  
Specific Contact

ABSTRACTAmorphous tungsten-silicon layers were deposited by DC co-sputtering and subsequently annealed in an argon atmosphere up to 1325 K to form tetragonal crystalline WSi2. Al-implanted p-6H-SiC exhibits a small depletion area forming an ohmic contact with low specific contact resistance. A modified Circular Transmission Line Model (CTLM), introduced by Marlow & Das [1] and Reeves [2], was used to characterize the electrical properties of the prepared contacts in the range between 300 K and 650 K. Deviations between calculated fieldemission contact resistances and measured contact resistances (ρc=2·10−2 Ωcm2, T=650 K) could be explained by TEM-cross section investigations. These deviations are caused by inhomogeneous contact interfaces originating from technological difficulties during contact preparation.

Improvement of the Specific Contact Resistance on P-Type 4H-SiC by Using a Highly P-Typed Doped 4H-SiC Layer Selectively Grown by VLS Transport

2014 ◽  
Vol 806 ◽  
pp. 57-60
Author(s):  
Nicolas Thierry-Jebali ◽  
Arthur Vo-Ha ◽  
Davy Carole ◽  
Mihai Lazar ◽  
Gabriel Ferro ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Ohmic Contacts ◽  
Schottky Barrier Height ◽  
Annealing Temperature ◽  
Process Condition ◽  
Specific Contact Resistance ◽  
High Doping Level ◽  
Annealing Temperatures ◽  
Specific Contact ◽  
P Type

This work reports on the improvement of ohmic contacts made on heavily p-type doped 4H-SiC epitaxial layer selectively grown by Vapor-Liquid-Solid (VLS) transport. Even before any annealing process, the contact is ohmic. This behavior can be explained by the high doping level of the VLS layer (Al concentration > 1020 cm-3) as characterized by SIMS profiling. Upon variation of annealing temperatures, a minimum value of the Specific Contact Resistance (SCR) down to 1.3x10-6 Ω.cm2 has been obtained for both 500 °C and 800 °C annealing temperature. However, a large variation of the SCR was observed for a same process condition. This variation is mainly attributed to a variation of the Schottky Barrier Height.

Current Transport in Ti/Al/Ni/Au Ohmic Contacts to GaN and AlGaN

2007 ◽  
Vol 556-557 ◽  
pp. 1027-1030 ◽  
Author(s):  
Ferdinando Iucolano ◽  
Fabrizio Roccaforte ◽  
Filippo Giannazzo ◽  
A. Alberti ◽  
Vito Raineri
Keyword(s):  
Contact Resistance ◽  
Field Emission ◽  
Ohmic Contacts ◽  
Theoretical Models ◽  
Specific Contact Resistance ◽  
Strong Increase ◽  
Current Transport ◽  
Electrical Characteristics ◽  
Structural And Electrical Properties ◽  
Specific Contact

In this work, the structural and electrical properties of Ti/Al/Ni/Au contacts on n-type Gallium Nitride were studied. An ohmic behaviour was observed after annealing above 700°C. The structural analysis showed the formation of an interfacial TiN layer and different phases in the reacted layer (AlNi, AlAu4, Al2Au) upon annealing. The temperature dependence of the specific contact resistance demonstrated that the current transport occurs through thermoionic field emission in the contacts annealed at 600°C, and field emission after annealing at higher temperatures. By fitting the data with theoretical models, a reduction of the Schottky barrier from 1.21eV after annealing at 600°C to 0.81eV at 800°C was demonstrated, together with a strong increase of the carrier concentration at the interface. The reduction of the contact resistance upon annealing was discussed by correlating the structural and electrical characteristics of the contacts.

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