scholarly journals Development of a Robust Manufacturing Route for Molnupiravir, an Antiviral for the Treatment of COVID-19

2021 ◽  
Author(s):  
Patrick S. Fier ◽  
Yingju Xu ◽  
Marc Poirier ◽  
Gilmar Brito ◽  
Michelle Zheng ◽  
...  
Keyword(s):  
Robust Manufacturing

scholarly journals A knowledge-based control system for the robust manufacturing of deep drawn parts

2017 ◽  
Vol 207 ◽  
pp. 42-47 ◽  
Author(s):  
P. Fischer ◽  
D. Harsch ◽  
J. Heingärtner ◽  
Y. Renkci ◽  
P. Hora
Keyword(s):  
Control System ◽  
Knowledge Based ◽  
Robust Manufacturing

Building a robust manufacturing strategy

1998 ◽  
Vol 35 (1-2) ◽  
pp. 225-228 ◽  
Author(s):  
Rajesh Jugulum ◽  
Mustafa Sefik
Keyword(s):  
Manufacturing Strategy ◽  
Robust Manufacturing

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

2011 ◽  
Vol 2011 (1) ◽  
pp. 000341-000344 ◽  
Author(s):  
Cheryl Tulkoff ◽  
Greg Caswell
Keyword(s):  
Failure Analysis ◽  
New Technologies ◽  
High Reliability ◽  
Electronics Industry ◽  
Physics Of Failure ◽  
Bga Packages ◽  
Long Life ◽  
Robust Manufacturing

Leadless, near chip scale packages (LNCSP) like the quad flat pack no lead (QFN) are the fastest growing package types in the electronics industry today. Early LNCSPs were fairly straightforward components with small overall dimensions, a single outer row of leads and small lead counts. However, there is currently a proliferation of advanced LNCSP package styles that have started to approach BGA packages in terms of both size and number of connections. Some of the newer packages have 3 or more rows, pitches as fine as .35mm, lead counts exceeding 200, and dimensions exceeding 12 mm × 12 mm. While the advantages of these packages are well documented, concerns arise with both reliability and manufacturability in Pb-free environments. So, acceptance of these packages in long-life, severe-environment, high-reliability applications is somewhat limited. One of the most common drivers for reliability failures is the inappropriate adoption of new technologies like LNCSP. Since robust manufacturing and qualifications standards always lag behind implementation, users must carefully select and validate these components for suitability in their use environments and customer applications. Soldering, flexure, and cleanliness issues have driven many failures seen in production and in the field. All of these areas must be addressed early in the selection and validation processes. In this paper, we will review and discuss LNCSP related reliability concerns and challenges, and propose Physics-of- Failure (PoF) based approaches to allow the successful introduction and failure analysis of LNCSP components in electronics products.

Robuste Produktion im volatilen Umfeld/A Simulation-based Analysis to Implement Robustness against Disturbances – Robust Production in Volatile Environments

2020 ◽  
Vol 110 (04) ◽  
pp. 209-213
Author(s):  
Sebastian Stobrawa ◽  
Sven Wöllnitz ◽  
Marc-André Dittrich
Keyword(s):  
Material Flow ◽  
Manufacturing Systems ◽  
Manufacturing System ◽  
Flow Simulation ◽  
Economic Environment ◽  
Manufacturing Companies ◽  
Simulation Based ◽  
Robust Manufacturing ◽  
Measurement Approach

Unter den Bedingungen eines volatilen Umfelds wird es für Unternehmen heute schwieriger die Zielerreichung in der Produktion sicherzustellen. Heterogene Schwankungen im Verhalten der Elemente eines Produktionssystems erfordern die Fähigkeit, Planzustände stabil beibehalten zu können. Dieser Beitrag stellt einen Messansatz vor, der mithilfe der Materialflusssimulation diese Elemente einer Produktion hinsichtlich ihrer Robustheit bewertet. So lassen sich robuste Produktionssysteme ableiten.   It is becoming increasingly difficult for manufacturing companies to achieve their production targets in today’s volatile economic environment. Heterogeneous fluctuations in the behaviour of components of a manufacturing system require stable planning states. The following article presents a measurement approach which uses material flow simulation to evaluate components in manufacturing in terms of their robustness. Thus, robust manufacturing systems can be derived.

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