Structure Frustration Enables Thermal History-Dependent Responsive Behavior in Self-Healing Hydrogels

Preparation of konjac glucomannan–borax hydrogels with good self-healing property and pH-responsive behavior

Journal of Polymer Research ◽

10.1007/s10965-019-1702-z ◽

2019 ◽

Vol 26 (2) ◽

Cited By ~ 6

Author(s):

Cunzhen Song ◽

Yukai Lv ◽

Kaiyao Qian ◽

Yulong Chen ◽

Xin Qian

Keyword(s):

Konjac Glucomannan ◽

Self Healing ◽

Ph Responsive ◽

Healing Property ◽

Responsive Behavior

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Analytical electron microscopy of grain boundaries in Al-Cu metallizations

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100133059 ◽

1992 ◽

Vol 50 (2) ◽

pp. 1684-1685

Author(s):

J. R. Michael ◽

A. D. Romig ◽

D. R. Frear

Keyword(s):

Electron Microscopy ◽

Integrated Circuits ◽

Failure Mode ◽

Current Density ◽

Thermal History ◽

Analytical Electron Microscopy ◽

Cu Metallization ◽

Analytical Electron ◽

Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

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Autonomous self-healing polyisoprene elastomers with high modulus and good toughness based on the synergy of dynamic ionic crosslinks and highly disordered crystals

Polymer Chemistry ◽

10.1039/d0py01034k ◽

2020 ◽

Vol 11 (41) ◽

pp. 6549-6558

Author(s):

Yohei Miwa ◽

Mayu Yamada ◽

Yu Shinke ◽

Shoichi Kutsumizu

Keyword(s):

Mechanical Properties ◽

Room Temperature ◽

Self Healing ◽

High Modulus ◽

Disordered Crystals ◽

Ionic Crosslinks

We designed a novel polyisoprene elastomer with high mechanical properties and autonomous self-healing capability at room temperature facilitated by the coexistence of dynamic ionic crosslinks and crystalline components that slowly reassembled.

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