Facet-Selective Dissociation and Radical-Mediated Reaction of Dibenzotetrathiafulvalene Molecules on Low-Index Copper Surfaces

2022 ◽  
Author(s):  
Jun Zhang ◽  
Linwei Zhou ◽  
Pengcheng Chen ◽  
Bingkai Yuan ◽  
Zhihai Cheng ◽  
...  
Keyword(s):  
Copper Surfaces ◽  
Selective Dissociation

THE ADSORPTION SITE OF FORMATE (HCOO) ON COPPER SURFACES

1986 ◽  
Vol 47 (C8) ◽  
pp. C8-487-C8-490
Author(s):  
M. D. CRAPPER ◽  
C. E. RILEY ◽  
D. P. WOODRUFF
Keyword(s):  
Adsorption Site ◽  
Copper Surfaces

The Use of Ratio-Recording Interferometry for the Measurement of Infrared Emission Spectra: Applications to Oxide Films on Copper Surfaces

1975 ◽  
Vol 29 (6) ◽  
pp. 496-500 ◽  
Author(s):  
D. Kember ◽  
N. Sheppard
Keyword(s):  
Emission Spectra ◽  
Black Body ◽  
Infrared Emission ◽  
Thin Layers ◽  
Oxide Surface ◽  
Surface Layers ◽  
Selective Reflection ◽  
Copper Surfaces ◽  
Emission And Absorption Spectra ◽  
Direct Correspondence

Infrared emission spectra from metal samples with oxide surface layers are shown to be very advantageously studied using the spectrum-ratioing facility of a recording infrared interferometer. The emission from a given sample is ratioed against that from a black-body emitter at the same temperature so as to give emittance as a function of wavenumber directly. This method has very useful application to irregularly shaped metal emitters. In the absence of selective reflection there is a direct correspondence between emission and absorption spectra for thin layers of an emitting substance. However, the presence of selective reflection leads to reduced emission and to considerable differences in the appearance of “absorption” and emission spectra in regions of strong absorption. Emission spectra obtained from copper plates heated, above 150°C, for different periods in air are shown clearly to indicate the presence of cuprous, Cu(I), and cupric, Cu(II), oxides in the surface layer.

Initial adhesion suppression of biofilm-forming and copper-tolerant bacterium Variovorax sp. on laser microtextured copper surfaces

2021 ◽  
Vol 202 ◽  
pp. 111656
Author(s):  
Luis Caro-Lara ◽  
Esteban Ramos-Moore ◽  
Ignacio T. Vargas ◽  
Magdalena Walczak ◽  
Christian Fuentes ◽  
...  
Keyword(s):  
Copper Surfaces ◽  
Initial Adhesion ◽  
Copper Tolerant

Effect of Water Temperature, pH Value, and Film Thickness on the Wettability Behaviour of Copper Surfaces Coated with Copper Using EB-PVD Technique

2019 ◽  
Vol 60 ◽  
pp. 124-141 ◽  
Author(s):  
Naser Ali ◽  
Joao Amaral Teixeira ◽  
Abdulmajid Addali
Keyword(s):  
Surface Roughness ◽  
Contact Angle ◽  
Film Thickness ◽  
Water Temperature ◽  
Ph Value ◽  
Surface Wettability ◽  
Copper Surfaces ◽  
Force Microscopy ◽  
Atomic Force ◽  
Static Contact

This research investigates the effect of surface roughness, water temperature, and pH value on the wettability behaviour of copper surfaces. An electron beam physical vapour deposition technique was used to fabricate 25, 50, and 75 nm thin films of copper on the surface of copper substrates. Surface topographical analysis, of the uncoated and coated samples, was performed using an atomic force microscopy device to observe the changes in surface microstructure. A goniometer device was then employed to examine the surface wettability of the samples by obtaining the static contact angle between the liquid and the attached surface using the sessile drops technique. Waters of pH 4, 7, and 9 were employed as the contact angle testing fluids at a set of fixed temperatures that ranged from 20°C to 60°C. It was found that increasing the deposited film thickness reduces the surface roughness of the as-prepared copper surfaces and thus causing the surface wettability to diverge from its initial hydrophobic nature towards the hydrophilic behaviour region. A similar divergence behaviour was seen with the rise in temperature of water of pH 4, and 9. In contrast, the water of pH 7, when tested on the uncoated surface, ceased to reach a contact angle below 90o. It is believed that the observed changes in surface wettability behaviour is directly linked to the liquid temperature, pH value, surface roughness, along with the Hofmeister effect between the water and the surface in contact.

Effect of Surface Roughness on Pool Boiling Heat Transfer of Water on a Superhydrophilic Aluminum Surface

2017 ◽  
Vol 139 (10) ◽  
Author(s):  
Jinsub Kim ◽  
Seongchul Jun ◽  
Jungho Lee ◽  
Juan Godinez ◽  
Seung M. You
Keyword(s):  
Heat Transfer ◽  
Surface Roughness ◽  
Boiling Heat Transfer ◽  
Aluminum Surface ◽  
Transfer Coefficients ◽  
Copper Surfaces ◽  
Heat Transfer Coefficients ◽  
Superhydrophilic Surface ◽  
Aluminum Surfaces ◽  
Effect Of Surface

The effect of surface roughness on the pool boiling heat transfer of water was investigated on superhydrophilic aluminum surfaces. The formation of nanoscale protrusions on the aluminum surface was confirmed after immersing it in boiling water, which modified surface wettability to form a superhydrophilic surface. The effect of surface roughness was examined at different average roughness (Ra) values ranging from 0.11 to 2.93 μm. The boiling heat transfer coefficients increased with an increase in roughness owing to the increased number of cavities. However, the superhydrophilic aluminum surfaces exhibited degradation of the heat transfer coefficients when compared with copper surfaces owing to the flooding of promising cavities. The superhydrophilic aluminum surfaces exhibited a higher critical heat flux (CHF) than the copper surfaces. The CHF was 1650 kW/m2 for Ra = 0.11 μm, and it increased to 2150 kW/m2 for Ra = 0.35 μm. Surface roughness is considered to affect CHF as it improves the capillary wicking on the superhydrophilic surface. However, further increase in surface roughness above 0.35 μm did not augment the CHF, even at Ra = 2.93 μm. This upper limit of the CHF appears to result from the hydrodynamic limit on the superhydrophilic surface, because the roughest surface with Ra = 2.93 μm still showed a faster liquid spreading speed.

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