Electrostatic Deposition Kinetics of Colloidal Silver Nanoplates onto Optically and E-Beam Transparent Water-Insoluble Polycationic Films

Author(s):  
Pavel Malakhovsky ◽  
Ivan Reznikov ◽  
Yauhen Aniskevich ◽  
Dmitry Murausky ◽  
Mikhail Artemyev
2007 ◽  
Vol 992 ◽  
Author(s):  
Christos F. Karanikas ◽  
James J. Watkins

AbstractThe kinetics of the deposition of ruthenium thin films from the hydrogen assisted reduction of bis(2,2,6,6-tetramethyl-3,5-heptanedionato)(1,5-cyclooctadiene)ruthenium(II), [Ru(tmhd)2cod], in supercritical carbon dioxide was studied in order to develop a rate expression for the growth rate as well as to determine a mechanism for the process. The deposition temperature was varied from 240°C to 280°C and the apparent activation energy was 45.3 kJ/mol. Deposition rates up to 30 nm/min were attained. The deposition rate dependence on precursor concentrations between 0 and 0.2 wt. % was studied at 260°C with excess hydrogen and revealed first order deposition kinetics with respect to precursor at concentrations lower then 0.06 wt. % and zero order dependence at concentrations above 0.06 wt. %. The effect of reaction pressure on the growth rate was studied at a constant reaction temperature of 260°C and pressures between 159 bar to 200 bar and found to have no measurable effect on the growth rate.


2004 ◽  
Vol 812 ◽  
Author(s):  
Yinfeng Zong ◽  
James J. Watkins

AbstractThe kinetics of copper deposition by the hydrogen-assisted reduction of bis(2,2,7- trimethyloctane-3,5-dionato)copper in supercritical carbon dioxide was studied as a function of temperature and precursor concentration. The growth rate was found to be as high as 31.5 nm/min. Experiments between 220 °C and 270 °C indicated an apparent activation energy of 51.9 kJ/mol. The deposition kinetics were zero order with respect to precursor at 250 °C and 134 bar and precursor concentrations between 0.016 and 0.38 wt.% in CO2. Zero order kinetics over this large concentration interval likely contributes to the exceptional step coverage obtained from Cu depositions from supercritical fluids.


2004 ◽  
Vol 59 (8) ◽  
pp. 1183-1187 ◽  
Author(s):  
Caterina Carpanese ◽  
Barbara Crivelli ◽  
Massimo Caniatti

2019 ◽  
Vol 6 (9) ◽  
pp. 2712-2723 ◽  
Author(s):  
Ruixing Huang ◽  
Chengxue Ma ◽  
Qiang He ◽  
Jun Ma ◽  
Zhengsong Wu ◽  
...  

The cations decreased the deposition kinetics of different charged NPs onto silica with the decrease in the hydration degree of additive cations.


1995 ◽  
Vol 38 (1) ◽  
pp. 19-28
Author(s):  
J. Garrett ◽  
A. Glassford ◽  
J. Steakley

The American Society for Testing and Materials (ASTM) has published a new standard test method for characterizing time and temperature dependence of material outgassing kinetics and the deposition kinetics of outgassed species on surfaces at various temperatures. This new ASTM standard, E 1559,1 uses the quartz crystal microbalance (QCM) collection measurement approach. The test method was originally developed under a program sponsored by the U.S. Air Force Materials Laboratory to create a standard test method for obtaining outgassing and deposition kinetics data for spacecraft materials. Standardization by ASTM recognizes that the method has applications beyond aerospace. In particular, the method will provide data of use to the electronics, semiconductor, and high vacuum industries. This paper describes the ASTM E 1559 test method and presents some typical data. the paper also describes the Lockheed ASTM E 1559 test apparatus.


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