Fabrication of Submicrometer-Sized Gold Electrodes of Controlled Geometry for Scanning Electrochemical-Atomic Force Microscopy

2002 ◽  
Vol 74 (24) ◽  
pp. 6355-6363 ◽  
Author(s):  
Jeremy Abbou ◽  
Christophe Demaille ◽  
Michel Druet ◽  
Jacques Moiroux
Keyword(s):  
Atomic Force Microscopy ◽  
Gold Electrodes ◽  
Force Microscopy ◽  
Atomic Force

Atomic Force Microscopy Structural Characterization of Polyaniline Thin Film Sensors

1994 ◽  
Vol 338 ◽  
Author(s):  
Jack Y. Josefowicz ◽  
Frederick G. Yamagishi ◽  
Camille I. van Ast
Keyword(s):  
Atomic Force Microscopy ◽  
Response Time ◽  
Gold Electrodes ◽  
Lower Sensitivity ◽  
Force Microscopy ◽  
Thin Film Sensors ◽  
Atomic Force ◽  
Polymer Sensors ◽  
Modeling Analysis ◽  
Low Concentrations

ABSTRACTUsing Tapping Mode Atomic Force Microscopy (TMAFM), the surface structure was determinedfor polymer sensors which incorporated polyaniline (PAn) films that were deposited electrochemically across narrow insulating gaps between interdigitated gold electrodes. The sensitivity and response time for such sensors, which can be used for the detection of low levels of gases and low concentrations of impurities in liquid media critically dependon the quality and structure of the polymer film in the gap region between the gold electrodes. TMAFM images of the PAn films ranging in thickness between ≈1.5μtmand ≈5μm reveal that films approaching 5μm (typically used in such sensors) develop deep cracks at the edges and along the length of the Au electrodes. Thecracks, which appear to be a consequence of stress build-up in thick films, can lead to reliability problems and inferior sensor performance. Simple modeling analysis of cracked films indicates that they can lower sensitivity and increase response time. TMAFM images of sensors with thinner ≈2.5μm PAn films show no cracks as well as continuous PAn bridges across the gap between Au electrodes. Analyses of TMAFM images are presented and compared for thin and thick film PAn sensors.

Submicron Electrode Gaps Fabricated by Gold Electrodeposition at Interdigitated Electrodes

2014 ◽  
Vol 605 ◽  
pp. 107-110
Author(s):  
M.J.J. van Megen ◽  
W. Olthuis ◽  
A. van den Berg
Keyword(s):  
Atomic Force Microscopy ◽  
Gold Layer ◽  
Electrode Spacing ◽  
Gold Electrodes ◽  
Interdigitated Electrodes ◽  
Force Microscopy ◽  
Atomic Force ◽  
Gap Spacing

Electrodes with submicron gaps are desired for achieving high amplication redoxcycling sensors. In this contribution we report the use of electrodeposition of gold in order todecrease the inter-electrode spacing at interdigitated electrodes. Using this method submicronspacings can be obtained without expensive techniques such as e-beam lithography or focusedion beam milling. Initially, gold interdigitated electrodes with a nger spacing of 2.5 m wererealized by lift-o processing. Using a commercial gold sulphite bath (ECF64D) and 100 mscurrent pulses of -1.78 A, these gold electrodes were plated with an additional gold layer. Asa result, the inter- electrode spacing, as measured using atomic force microscopy and conven-tional microscopy, was reduced to 0.6 m. The achieved gap spacing is limited by electrodeimperfections resulting from the lift-o process. At these imperfections the electrodes becomeshorted. Additional experiments with wet etched electrodes are expected to yield smaller gapspacings

Electrostatic Forces on the Surface of Metals as Measured by Atomic Force Microscopy

2000 ◽  
Vol 10 (1-2) ◽  
pp. 15
Author(s):  
Eugene Sprague ◽  
Julio C. Palmaz ◽  
Cristina Simon ◽  
Aaron Watson
Keyword(s):  
Atomic Force Microscopy ◽  
Electrostatic Forces ◽  
Force Microscopy ◽  
Atomic Force
Sign in / Sign up

Export Citation Format

Share Document