1D Semiconducting Nanostructures for Flexible and Large-Area Electronics

Author(s):  
Dhayalan Shakthivel ◽  
Muhammad Ahmad ◽  
Mohammad R. Alenezi ◽  
Ravinder Dahiya ◽  
S. Ravi P. Silva
2014 ◽  
Vol 10 (8) ◽  
pp. 660-665 ◽  
Author(s):  
Cheng Sun ◽  
Arman Ahnood ◽  
Sungsik Lee ◽  
Nripan Mathews ◽  
Subodh Mhaisalkar ◽  
...  

MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 471-475 ◽  
Author(s):  
Marc Chason ◽  
Daniel R. Gamota ◽  
Paul W. Brazis ◽  
Krishna Kalyanasundaram ◽  
Jie Zhang ◽  
...  

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.


Author(s):  
Daniele Raiteri ◽  
Eugenio Cantatore ◽  
Arthur H.M. van Roermund

2018 ◽  
Vol 113 (7) ◽  
pp. 072108 ◽  
Author(s):  
N. Ghenzi ◽  
M. Rozenberg ◽  
L. Pietrobon ◽  
R. Llopis ◽  
R. Gay ◽  
...  

2010 ◽  
Vol 110 (1) ◽  
pp. 3-24 ◽  
Author(s):  
Ana Claudia Arias ◽  
J. Devin MacKenzie ◽  
Iain McCulloch ◽  
Jonathan Rivnay ◽  
Alberto Salleo

2015 ◽  
Vol 105 (22) ◽  
pp. 1-8
Author(s):  
Yao Yao ◽  
Shue-Ting Tung ◽  
Naveen Verma ◽  
Sigurd Wagner ◽  
James Sturm ◽  
...  

2002 ◽  
Vol 715 ◽  
Author(s):  
J.P. Lu ◽  
K. Van Schuylenbergh ◽  
J. Ho ◽  
Y. Wang ◽  
J. B. Boyce ◽  
...  

AbstractThe technology of large area electronics has made significant progress in recent years because of the fast maturing excimer laser annealing process. The new thin film transistors based on laser processed poly silicon provide unprecedented performance over the traditional thin film transistors using amorphous silicon. They open up the possibility of building flat panel displays and imagers with higher integration and performance. In this paper, we will review the progress of poly-Si thin film transistor technology with emphasis on imager applications. We also discuss the challenges of future improvement of flat panel imagers based on this technology.


2016 ◽  
Vol 2 (7) ◽  
pp. 1500489 ◽  
Author(s):  
Tobias Cramer ◽  
Allegra Sacchetti ◽  
Maria Teresa Lobato ◽  
Pedro Barquinha ◽  
Vincent Fischer ◽  
...  

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