Microstructural evolution and mechanical properties of CuW/CuCr interface with mixed powder interlayers by liquid diffusion bonding technique

Vacuum ◽  
2017 ◽  
Vol 137 ◽  
pp. 148-154 ◽  
Author(s):  
Zhe Xiao ◽  
Xiaohong Yang ◽  
Xuejian Li ◽  
Juntao Zou ◽  
Shuhua Liang
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