Microstructural evolution and mechanical properties of CuW/CuCr interface with mixed powder interlayers by liquid diffusion bonding technique
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2021 ◽
pp. 105736
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2018 ◽
Vol 73
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pp. 91-98
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2019 ◽
Vol 110
(7)
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pp. 664-671
2019 ◽
Vol 23
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pp. 101-106