scholarly journals Application of flash method in the measurements of interfacial thermal resistance in layered and particulate composite materials

2017 ◽  
Vol 654 ◽  
pp. 54-64 ◽  
Author(s):  
Karol Pietrak ◽  
Tomasz S. Wiśniewski ◽  
Michał Kubiś
Keyword(s):  
Composite Materials ◽  
Thermal Resistance ◽  
Particulate Composite ◽  
Interfacial Thermal Resistance ◽  
Flash Method

Enhanced Thermal Conductivity of Composite Materials by Filling Sheet and Fiber Under Effect of Filler Contact

2021 ◽  
Author(s):  
Xiao-jian Wang ◽  
Liang-Bi Wang
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Composite Materials ◽  
Thermal Resistance ◽  
Percolation Threshold ◽  
Filler Content ◽  
Interfacial Thermal Resistance ◽  
Combined Effects ◽  
Enhanced Thermal Conductivity ◽  
The Ideal

Abstract The most common non-granular fillers are sheet and fiber. When they are distributed along the heat flux direction, the thermal conductivity of composite increases greatly. Meanwhile, the filler contact also has large effect on the thermal conductivity. However, the effect of filler contact on the thermal conductivity of composite with directional fillers has not been investigated. In this paper, the combined effects of filler contact, content and orientation are investigated. The results show that the effect of filler orientation on the thermal conductivity is greater than filler contact in low filler content, and exact opposite in high filler content. The effect of filler contact on fibrous and sheet fillers is far greater than cube and sphere fillers. This rule is affected by the filler contact. The filler content of 8% is the ideal percolation threshold of composite with fibrous and sheet filler. It is lower than cube filler and previous reports. The space for thermal conductivity growth of composite with directional filler is still very large. The effect of interfacial thermal resistance should be considered in predicting the thermal conductivity of composite under high Rc (>10-4).

scholarly journals Heat Transfer at the Interface of Graphene Nanoribbons with Different Relative Orientations and Gaps

Energies ◽  
2019 ◽  
Vol 12 (5) ◽  
pp. 796 ◽  
Author(s):  
Shahin Mohammad Nejad ◽  
Masoud Bozorg Bigdeli ◽  
Rajat Srivastava ◽  
Matteo Fasano
Keyword(s):  
Composite Materials ◽  
Thermal Resistance ◽  
Interplanar Spacing ◽  
Graphene Nanoribbons ◽  
Angular Displacement ◽  
Filler Loading ◽  
Interfacial Thermal Resistance ◽  
Geometrical Parameters ◽  
Thermal Transfer ◽  
The Impact

Because of their high thermal conductivity, graphene nanoribbons (GNRs) can be employed as fillers to enhance the thermal transfer properties of composite materials, such as polymer-based ones. However, when the filler loading is higher than the geometric percolation threshold, the interfacial thermal resistance between adjacent GNRs may significantly limit the overall thermal transfer through a network of fillers. In this article, reverse non-equilibrium molecular dynamics is used to investigate the impact of the relative orientation (i.e., horizontal and vertical overlap, interplanar spacing and angular displacement) of couples of GNRs on their interfacial thermal resistance. Based on the simulation results, we propose an empirical correlation between the thermal resistance at the interface of adjacent GNRs and their main geometrical parameters, namely the normalized projected overlap and average interplanar spacing. The reported correlation can be beneficial for speeding up bottom-up approaches to the multiscale analysis of the thermal properties of composite materials, particularly when thermally conductive fillers create percolating pathways.

Investigation on the interfacial thermal resistance of partially overlapped bilayer graphene

2021 ◽  
Author(s):  
Bingcheng Wang ◽  
Qun Cao ◽  
Wei Shao ◽  
Zheng Cui
Keyword(s):  
Thermal Conductivity ◽  
Composite Materials ◽  
Thermal Resistance ◽  
Bilayer Graphene ◽  
High Thermal Conductivity ◽  
Interfacial Thermal Resistance ◽  
Filler Network

The graphene has been extensively applied in composite materials due to its high thermal conductivity, and the multi-layered graphene has great potentials in the construction of the continuous filler network...

Quantification of Thermal Resistance of Transient-Liquid-Phase Bonded Cu/Al/Cu Interfaces for Assembly of Cu-Based Microchannel Heat Exchangers

2013 ◽  
Vol 1 (3) ◽  
Author(s):  
Bin Lu ◽  
Ke Chen ◽  
W. J. Meng ◽  
Amar Karki ◽  
Rongying Jin
Keyword(s):  
Heat Transfer ◽  
Liquid Phase ◽  
Thermal Resistance ◽  
Heat Exchangers ◽  
Transient Liquid Phase ◽  
Bonding Interface ◽  
Interfacial Thermal Resistance ◽  
Flash Method ◽  
Bonding Layer ◽  
Tlp Bonding

Transient liquid phase (TLP) bonding of Cu structures with a thin elemental Al intermediate bonding layer is being used to assemble Cu-based, enclosed, microchannel heat exchangers (MHEs). The heterogeneous Cu/Al/Cu TLP bonding interface region, formed during the TLP bonding process, impacts heat transfer of the assembled MHE device. To evaluate the thermal resistance of TLP bonded Cu/Al/Cu interface regions, transient flash measurements were performed across bonding interface regions formed under various conditions, in combination with detailed structural examination and measurements of bulk mass density and specific heat. The flash method is shown to yield quantitative measurements of interfacial thermal resistance values. Our results provide guidance to developing bonding protocols for Cu-based MHEs with optimized heat transfer performance.

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