The curing kinetics and thermal properties of epoxy resins cured by aromatic diamine with hetero-cyclic side chain structure

2014 ◽  
Vol 595 ◽  
pp. 22-27 ◽  
Author(s):  
Xuhai Xiong ◽  
Rong Ren ◽  
Siyang Liu ◽  
Shaowei Lu ◽  
Ping Chen
2014 ◽  
Vol 22 (1) ◽  
pp. 1-12
Author(s):  
Mingming Yu ◽  
Zhengwei Zhou ◽  
Hang Lu ◽  
Aijun Li ◽  
Ruicheng Bai ◽  
...  

2012 ◽  
Vol 19 (4) ◽  
pp. 347-350 ◽  
Author(s):  
Heng Guo ◽  
Jiandong Zhang ◽  
Zhiran Chen ◽  
Junji Wei ◽  
Rui Zhao ◽  
...  

AbstractThis paper reports the preparation of the amine/epoxy blends with various amines such as 4,4′-diaminodiphenylsulfone (DDS), one nitrile side chain-containing diamine (BDB), and phthalonitrile-containing amine (APN). Differential scanning calorimetry (DSC), rheological analysis, and thermal gravimetric analysis (TGA) were used to evaluate the curing behaviors and thermal properties of amine/epoxy blends with the effect of functional nitrile groups of amines. Interestingly, an amine/epoxy blend exhibited double curing reactions. The cured epoxy copolymers exhibited high glass transition temperatures (>220°C) and excellent thermal stabilities having 5% weight loss temperature in the range of 375°C to 383°C.


1975 ◽  
Vol 250 (1) ◽  
pp. 226-230
Author(s):  
M F Holick ◽  
M Garabedian ◽  
H K Schnoes ◽  
H F DeLuca

2015 ◽  
Vol 6 (2) ◽  
pp. 1061-1074 ◽  
Author(s):  
Kai Pahnke ◽  
Josef Brandt ◽  
Ganna Gryn'ova ◽  
Peter Lindner ◽  
Ralf Schweins ◽  
...  

Entropic chain effects on dynamic bonding reactions are shown to enable the tuning of reaction equilibria not only by changing the mass of the reactants, but also by merely altering the building block side chain structure and thus the intrinsic stiffness. The findings enable a step change for the design of on-demand bonding systems and reversible ligation chemistry in general.


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