The measurement of thermal conductivity variation with temperature for Sn-20wt.% In based lead-free ternary solders

2013 ◽  
Vol 554 ◽  
pp. 63-70 ◽  
Author(s):  
Esra Öztürk ◽  
Sezen Aksöz ◽  
Kazım Keşlioğlu ◽  
Necmettin Maraşlı
Keyword(s):  
Thermal Conductivity ◽  
Lead Free ◽  
Conductivity Variation ◽  
Thermal Conductivity Variation

Thermal Conductivity Variation with Temperature for Lead-Free Ternary Eutectic Solders

2013 ◽  
Vol 42 (12) ◽  
pp. 3573-3581 ◽  
Author(s):  
Namık Aksöz ◽  
Esra Öztürk ◽  
Ümit Bayram ◽  
Sezen Aksöz ◽  
Selçuk Kervan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Ternary Eutectic ◽  
Lead Free ◽  
Conductivity Variation ◽  
Thermal Conductivity Variation

Numerical Simulation & Experimental Investigation of SMT Laser Microsoldering Thermal Process

1991 ◽  
Vol 226 ◽  
Author(s):  
Wang Chunqing ◽  
Qian Yiyu ◽  
Jiang Yihong
Keyword(s):  
Thermal Conductivity ◽  
Numerical Simulation ◽  
Experimental Investigation ◽  
Thermal Process ◽  
Light Wave ◽  
Light Reflection ◽  
Lead Wire ◽  
Wire Surface ◽  
Conductivity Variation ◽  
Thermal Conductivity Variation

AbstractIn this paper,a numerical simulation of thermal process in the SMT laser microsoldering joint has been developed, in which, the influence on thermal process of the factors such as the thermal conductivity variation of solder with temperature, light reflection coefficient of the lead wire surface, and heat exchange on the surface of SMT materials all have been considered. In order to carry this numerical calculation practice and prove it's results,the reflexive characteristic of light wave to the SMT materials has been gauged,and the dynamic temperature process of laser microjoint has been measured by a new experimental method which was invented by the authors.The results of numerical simulation have been borne out by the tests, and the influences of heating parameters on thermal process has been analysed in this paper.The conclusions will be advantageous to the further study of the microjoint quality control in the SMT laser microsoldering.

Multi-scale numerical prediction of flow-induced thermal conductivity variation in micro-injection molded heat sink

2016 ◽  
Vol 24 (3) ◽  
pp. 566-573
Author(s):  
杨灿 YANG Can ◽  
曹泽卫 CAO Ze-wei ◽  
尹晓红 YIN Xiao-hong ◽  
阚君武 KAN Jun-wu ◽  
程光明 CHENG Guang-ming ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Sink ◽  
Numerical Prediction ◽  
Multi Scale ◽  
Conductivity Variation ◽  
Injection Molded ◽  
Thermal Conductivity Variation

Impact of Thermodiffusion on Temperature Fields in Stationary Nanofluids

2007 ◽  
Author(s):  
Patricia E. Gharagozloo ◽  
Ken E. Goodson ◽  
John K. Eaton
Keyword(s):  
Thermal Conductivity ◽  
Enhancement Factor ◽  
Silicone Oil ◽  
Thermal Conductivity Enhancement ◽  
Temperature Fields ◽  
Coupled Transport ◽  
Conductivity Enhancement ◽  
Conductivity Variation ◽  
Potential Impact ◽  
Thermal Conductivity Variation

The research community has reported a large variety of at times contradictory thermal conductivity enhancements for nanofluids. Some of the differences may result from thermodiffusion, which is the coupled transport of heat and nanoparticles in a temperature gradient. Thermodiffusion can influence the apparent conductivity observed in a given experimental setup. This work explores the potential impact of thermodiffusion on the inconsistencies of the previous results and on the observed temperature dependence of the thermal conductivity enhancement. The thermal conductivity variation with temperature is captured using infrared microscopy. The thermal conductivity distribution varies significantly over the temperature range 27 – 73°C. This work also explores the potential impact of aggregation, gravitational separation, and thermodiffusion on the time-evolution of the thermal conductivity. For 1 percent by volume aluminum oxide in deionized water, this work finds a thermal conductivity enhancement of between 1 and 15 percent depending on temperature and time, which corresponds to an enhancement factor of between 1 and 15. For 0.2 percent by volume carbon nanotubes in silicone oil, this work finds a thermal conductivity enhancement of 8 percent with no dependence on temperature, which corresponds to an enhancement factor of 40.

scholarly journals Effects of Temperature Dependent Thermal Conductivity and Viscous Dissipation on Free Convective Flow along a Vertical Flat Plate with Asymptotic Solution

2017 ◽  
Vol 36 ◽  
pp. 33-46
Author(s):  
AKM Safiqul Islam ◽  
MA Alim ◽  
Md Rezaul Karim ◽  
ATM M Rahman
Keyword(s):  
Thermal Conductivity ◽  
Prandtl Number ◽  
Asymptotic Solution ◽  
Surface Temperature ◽  
Skin Friction ◽  
Viscous Dissipation ◽  
Temperature Profiles ◽  
Conductivity Variation ◽  
Variation Parameter ◽  
Thermal Conductivity Variation

This paper reports us the surface temperature distribution effects of free convective flow along a vertical flat plate with temperature dependent thermal conductivity and viscous dissipation with asymptotic solution. The governing equations with associated boundary conditions reduce to local non-similarity boundary layer equations for this phenomenon are converted to dimensionless forms using a suitable transformation. The transformed non-linear equations are then solved using the implicit finite difference method together with Keller-box technique. Numerical results of the velocity and temperature profiles, skin friction and surface temperature profiles for different values of the thermal conductivity variation parameter, the Prandtl number and the viscous dissipation parameters are presented graphically. Also we considered the asymptotic solution for the effect of the thermal conductivity variation parameter, the Prandtl number and the viscous dissipation parameters in skin friction and surface temperature profiles. Detailed discussion is given for the aforementioned parameters. A good similarity is found in small and large value solution with all value solution for the thermal conductivity variation parameter, the Prandtl number and the viscous dissipation parameter for skin friction and surface temperature. Divergence is found near one (1).GANIT J. Bangladesh Math. Soc.Vol. 36 (2016) 33-46

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