Study on curing kinetics of diallyl-bearing epoxy resin using sulfur as curing agent

2012 ◽  
Vol 538 ◽  
pp. 36-42 ◽  
Author(s):  
Guangpu Zhang ◽  
Jue Cheng ◽  
Ling Shi ◽  
Xin Lin ◽  
Junying Zhang
Keyword(s):  
Epoxy Resin ◽  
Curing Kinetics ◽  
Curing Agent ◽  
Kinetics Of

Curing Kinetics of Silicone Epoxy Resin Containing Fluorene

2014 ◽  
Vol 936 ◽  
pp. 28-33 ◽  
Author(s):  
Wei Xing Deng ◽  
Yuan Wei Zhong ◽  
Jie Qin ◽  
Xue Bing Huang ◽  
Jin Wen Peng
Keyword(s):  
Activation Energy ◽  
Differential Scanning Calorimetry ◽  
Ftir Spectroscopy ◽  
Epoxy Resin ◽  
1H Nmr ◽  
Chemical Structure ◽  
Curing Kinetics ◽  
Curing Agent ◽  
Scanning Calorimetry ◽  
Kinetics Of

A new epoxy resin based on dichlorosilane and 9,9-bis (4-hydroxyphenyl) fluorene was synthesized to produce a highly heat-resistant network. The chemical structure was characterized with FTIR spectroscopy and 1H-NMR. 4-4′-Diaminodiphenylsulfone (DDS) was used as the curing agent. The curing kinetics of different epoxy/DDS systems were investigated using non-isothermal differential scanning calorimetry (DSC). The results showed that the values of activation energy (E) were affected by the chemical structure of epoxy resin, and BPEBF exhibited lower curing reactivity towards DDS compared to E-51.

Curing kinetics of epoxy resin using epoxidized cardanol as diluent with/without fortifier

1988 ◽  
Vol 129 (2) ◽  
pp. 277-284 ◽  
Author(s):  
M.B. Patel ◽  
R.G. Patel ◽  
V.S. Patel
Keyword(s):  
Epoxy Resin ◽  
Curing Kinetics ◽  
Kinetics Of

Model-fitting and model-free nonisothermal curing kinetics of epoxy resin with a low-volatile five-armed starlike aliphatic polyamine

2011 ◽  
Vol 525 (1-2) ◽  
pp. 31-39 ◽  
Author(s):  
Jintao Wan ◽  
Zhi-Yang Bu ◽  
Cun-Jin Xu ◽  
Hong Fan ◽  
Bo-Geng Li
Keyword(s):  
Epoxy Resin ◽  
Model Fitting ◽  
Curing Kinetics ◽  
Model Free ◽  
Kinetics Of

Study on the Preparation of 2-Phenyl Imidazole Microcapsule and its Effect on Curing Epoxy Resin

2013 ◽  
Vol 690-693 ◽  
pp. 1649-1652
Author(s):  
Ai Jie Ma ◽  
Qiu Yu Zhang ◽  
You Qiang Shi
Keyword(s):  
Epoxy Resin ◽  
Raw Materials ◽  
Curing Kinetics ◽  
Curing Temperature ◽  
Curing Agent ◽  
Thermal Analyzer ◽  
Epoxy Resin System ◽  
Curing Kinetic ◽  
Resin Curing ◽  
Micro Morphology

In this paper, 2-phenyl imidazole (2-PZ) microcapsule-type curing agent of epoxy resin were prepared through solvent volatilization with 2-PZ and polymethyl acrylic glycidyl ester (PGMA) as the raw materials. The micro-morphology, shape and structure of the microcapsules were studied by scanning electronic microscope (SEM) and fourier transform infrared spectrum (FT-IR). The curing kinetics of microcapsule curing agent/epoxy resin E-44 curing system were studied using TGA/DSC simultaneous thermal analyzer. Results showed that the preparation method is simple and effective and the prepared 2-PZ microcapsules have smooth surfaces and monodisperse size. And the curing kinetic study of epoxy resin system suggested epoxy resin curing temperature was rising with the increase of heating rate.

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