Soft core based embedded systems in critical aerospace applications

2011 ◽  
Vol 57 (10) ◽  
pp. 886-895 ◽  
Author(s):  
Sergio Cuenca-Asensi ◽  
Antonio Martínez-Álvarez ◽  
Felipe Restrepo-Calle ◽  
Francisco R. Palomo ◽  
Hipólito Guzmán-Miranda ◽  
...  
Keyword(s):  
Embedded Systems ◽  
Soft Core ◽  
Aerospace Applications

Soft-Core Processors for Embedded Systems

2006 ◽  
Author(s):  
Jason G. Tong ◽  
Ian D. L. Anderson ◽  
Mohammed A. S. Khalid
Keyword(s):  
Embedded Systems ◽  
Soft Core

scholarly journals Performance Analysis Techniques for Multi-Soft-Core and Many-Soft-Core Systems

2012 ◽  
Vol 2012 ◽  
pp. 1-14
Author(s):  
David Castells-Rufas ◽  
Eduard Fernandez-Alonso ◽  
Jordi Carrabina
Keyword(s):  
Performance Analysis ◽  
Embedded Systems ◽  
Development Process ◽  
System Development ◽  
Soft Core ◽  
Parallel Applications ◽  
Architectural Support ◽  
Analysis Techniques ◽  
Resource Limitations ◽  
Interesting Solution

Multi-soft-core systems are a viable and interesting solution for embedded systems that need a particular tradeoff between performance, flexibility and development speed. As the growing capacity allows it, many-soft-cores are also expected to have relevance to future embedded systems. As a consequence, parallel programming methods and tools will be necessarily embraced as a part of the full system development process. Performance analysis is an important part of the development process for parallel applications. It is usually mandatory when you want to get a desired performance or to verify that the system is meeting some real-time constraints. One of the usual techniques used by the HPC community is the postmortem analysis of application traces. However, this is not easily transported to the embedded systems based on FPGA due to the resource limitations of the platforms. We propose several techniques and some hardware architectural support to be able to generate traces on multiprocessor systems based on FPGAs and use them to optimize the performance of the running applications.

Physical, Chemical, and Crystallographic Characterization of Anodic Coatings on High Strength Aluminum Base Alloys

1976 ◽  
Vol 34 ◽  
pp. 636-637
Author(s):  
R. E. Herfert ◽  
N. T. McDevitt
Keyword(s):  
Sulfuric Acid ◽  
Salt Spray ◽  
High Strength ◽  
Environmental Stability ◽  
Anodic Films ◽  
Sodium Dichromate ◽  
Corrosion Resistant ◽  
Aerospace Applications ◽  
Bond Strengths ◽  
Adhesive Bonded Joints

Durability of adhesive bonded joints in moisture and salt spray environments is essential to USAF aircraft. Structural bonding technology for aerospace applications has depended for many years on the preparation of aluminum surfaces by a sulfuric acid/sodium dichromate (FPL etch) treatment. Recently, specific thin film anodizing techniques, phosphoric acid, and chromic acid anodizing have been developed which not only provide good initial bond strengths but vastly improved environmental durability. These thin anodic films are in contrast to the commonly used thick anodic films such as the sulfuric acid or "hard" sulfuric acid anodic films which are highly corrosion resistant in themselves, but which do not provide good initial bond strengths, particularly in low temperature peel.The objective of this study was to determine the characteristics of anodic films on aluminum alloys that make them corrosion resistant. The chemical composition, physical morphology and structure, and mechanical properties of the thin oxide films were to be defined and correlated with the environmental stability of these surfaces in humidity and salt spray. It is anticipated that anodic film characteristics and corrosion resistance will vary with the anodizing processing conditions.

TEM study of boron additions to cobalt aluminide

1988 ◽  
Vol 46 ◽  
pp. 546-547
Author(s):  
Gerald B. Feldewerth
Keyword(s):  
High Temperature ◽  
Turbine Engines ◽  
Major Drawback ◽  
University Of Missouri ◽  
Specific Strength ◽  
Aerospace Applications ◽  
Wide Range ◽  
Ordered Alloys ◽  
The University ◽  
Very High

In recent years an increasing emphasis has been placed on the study of high temperature intermetallic compounds for possible aerospace applications. One group of interest is the B2 aiuminides. This group of intermetaliics has a very high melting temperature, good high temperature, and excellent specific strength. These qualities make it a candidate for applications such as turbine engines. The B2 aiuminides exist over a wide range of compositions and also have a large solubility for third element substitutional additions, which may allow alloying additions to overcome their major drawback, their brittle nature.One B2 aluminide currently being studied is cobalt aluminide. Optical microscopy of CoAl alloys produced at the University of Missouri-Rolla showed a dramatic decrease in the grain size which affects the yield strength and flow stress of long range ordered alloys, and a change in the grain shape with the addition of 0.5 % boron.

Deformation at interfaces of Ti-6Al-4V/SiC fiber composites

1992 ◽  
Vol 50 (1) ◽  
pp. 158-159
Author(s):  
Warren J. Moberly ◽  
Daniel B. Miracle ◽  
S. Krishnamurthy
Keyword(s):  
Thermal Stresses ◽  
Load Transfer ◽  
Coefficient Of Thermal Expansion ◽  
Hot Isostatic Pressing ◽  
Matrix Composites ◽  
Ongoing Research ◽  
Aerospace Applications ◽  
Sic Fiber ◽  
The Matrix ◽  
Intermetallic Matrix Composites

Titanium-aluminum alloy metal matrix composites (MMC) and Ti-Al intermetallic matrix composites (IMC), reinforced with continuous SCS6 SiC fibers are leading candidates for high temperature aerospace applications such as the National Aerospace Plane (NASP). The nature of deformation at fiber / matrix interfaces is characterized in this ongoing research. One major concern is the mismatch in coefficient of thermal expansion (CTE) between the Ti-based matrix and the SiC fiber. This can lead to thermal stresses upon cooling down from the temperature incurred during hot isostatic pressing (HIP), which are sufficient to cause yielding in the matrix, and/or lead to fatigue from the thermal cycling that will be incurred during application, A second concern is the load transfer, from fiber to matrix, that is required if/when fiber fracture occurs. In both cases the stresses in the matrix are most severe at the interlace.

TEM sample preparation of wear-tested room-temperature pulsed-laser-deposited thin films of MoS2 by ultramicrotomy

1993 ◽  
Vol 51 ◽  
pp. 1118-1119
Author(s):  
Pamela F. Lloyd ◽  
Scott D. Walck
Keyword(s):  
Thin Films ◽  
Sample Preparation ◽  
Room Temperature ◽  
High Vacuum ◽  
Pulsed Laser ◽  
Ultra High Vacuum ◽  
Wear Testing ◽  
Preparation Technique ◽  
Cross Sectional ◽  
Aerospace Applications

Pulsed laser deposition (PLD) is a novel technique for the deposition of tribological thin films. MoS2 is the archetypical solid lubricant material for aerospace applications. It provides a low coefficient of friction from cryogenic temperatures to about 350°C and can be used in ultra high vacuum environments. The TEM is ideally suited for studying the microstructural and tribo-chemical changes that occur during wear. The normal cross sectional TEM sample preparation method does not work well because the material’s lubricity causes the sandwich to separate. Walck et al. deposited MoS2 through a mesh mask which gave suitable results for as-deposited films, but the discontinuous nature of the film is unsuitable for wear-testing. To investigate wear-tested, room temperature (RT) PLD MoS2 films, the sample preparation technique of Heuer and Howitt was adapted.Two 300 run thick films were deposited on single crystal NaCl substrates. One was wear-tested on a ball-on-disk tribometer using a 30 gm load at 150 rpm for one minute, and subsequently coated with a heavy layer of evaporated gold.

Development of embedded systems to control toxic compounds in textile industries

2012 ◽  
Vol 1 (5) ◽  
pp. 115-117
Author(s):  
Jahnavi KRM Jahnavi KRM ◽  
◽  
Raghavendra Rao K ◽  
Padma Suvarna R
Keyword(s):  
Embedded Systems ◽  
Toxic Compounds ◽  
Textile Industries

Proposal and Evaluation of Mutual Exclusion Method using Lock-free Algorism for Embedded Systems using Multi-core Processor

2019 ◽  
Vol 139 (7) ◽  
pp. 802-811
Author(s):  
Kenta Fujimoto ◽  
Shingo Oidate ◽  
Yuhei Yabuta ◽  
Atsuyuki Takahashi ◽  
Takuya Yamasaki ◽  
...  
Keyword(s):  
Embedded Systems ◽  
Mutual Exclusion ◽  
Exclusion Method ◽  
Multi Core Processor

Towards Okinawa-style Robot-embedded Systems

2013 ◽  
Vol 133 (2) ◽  
pp. 111-115 ◽  
Author(s):  
Takashi Anezaki ◽  
Suriyon Tansuriyavong ◽  
Chikatoshi Yamada
Keyword(s):  
Embedded Systems
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