Inkjet printing of palladium catalyst patterns on polyimide film for electroless copper plating

2007 ◽  
Vol 123 (2) ◽  
pp. 840-846 ◽  
Author(s):  
Stephan Busato ◽  
Alberto Belloli ◽  
Paolo Ermanni
Keyword(s):  
Inkjet Printing ◽  
Palladium Catalyst ◽  
Polyimide Film ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Study of Palladium Catalyzation for Electroless Copper Plating on Polyimide Film

2013 ◽  
Vol 13 (1) ◽  
pp. 517-522 ◽  
Author(s):  
Bin Kim ◽  
Sang Hee Jung ◽  
Seung Wook Suh ◽  
Byung Ki Park
Keyword(s):  
Polyimide Film ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

Nano Palladium Catalyst Formation Assisted by Ultrasound for Electroless Copper Plating

2017 ◽  
Vol 9 (2) ◽  
pp. 118-122 ◽  
Author(s):  
Hong-Kee Lee ◽  
Chang-Myeon Lee ◽  
Jin-Young Hur ◽  
Seok-Bon Koo
Keyword(s):  
Palladium Catalyst ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Catalyst Formation

Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating

2016 ◽  
Vol 4 (43) ◽  
pp. 10240-10245 ◽  
Author(s):  
Jin-ju Chen ◽  
Yan-long Guo ◽  
Yan Wang ◽  
Jing Zhang ◽  
Huo-jun Li ◽  
...  
Keyword(s):  
Electroless Plating ◽  
Inkjet Printing ◽  
Copper Plating ◽  
Alumina Ceramics ◽  
Electroless Copper Plating ◽  
Efficient Approach ◽  
Electroless Copper

A convenient and efficient approach for selective metallization of alumina ceramics via inkjet printing followed by electroless plating was developed.

scholarly journals Formation of Palladium Catalyst Containing Polysilsesquioxane Thin Film for Electroless Copper Plating

2015 ◽  
Vol 18 (7) ◽  
pp. 479-485
Author(s):  
Sayuri Teshima ◽  
Kouichiro Murahashi ◽  
Kuniaki Otsuka ◽  
Koji Mitamura ◽  
Seiji Watase ◽  
...  
Keyword(s):  
Thin Film ◽  
Palladium Catalyst ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper

scholarly journals Enhancing the electrical properties of inkjet-printed silver ink by electrolyte sintering, photonic sintering, and electroless plating

2021 ◽  
Vol 53 (1) ◽  
pp. 119-126
Author(s):  
Yusuke Mukai ◽  
Minyoung Suh
Keyword(s):  
Electrical Properties ◽  
Inkjet Printing ◽  
High Performance ◽  
Electrical Performance ◽  
Wearable Electronics ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Silver Ink ◽  
Electroless Copper ◽  
Photonic Sintering

Conductive inkjet printing is an emerging rapid manufacturing technology in the field of smart clothing and wearable electronics. The current challenge in conductive inkjet printing includes upgrading of electrical performance of printed inks to the equivalent level to traditional conductors such as bulk silver and copper, especially for high-performance electronic applications such as flexible antennas and circuits. Post-treatments are commonly employed to enhance the electrical conduction of inkjet-printed tracks. This research discusses the effects of electrolyte sintering, photonic sintering and electroless copper plating on the DC electrical resistance and resistivity of inkjet-printed silver nanoparticles. From experimental results and measurements, it was found that all the post-treatment methods effectively improved the electrical properties of printed silver ink, but in different ways. The lowest resistance of 4.5 ? (in 0.1 mm ? 10 mm) and thickest (4.5 ?m) conductor were achieved by electroless copper plating, whereas the lowest resistivity (7.5?10-8 ??m) and thinnest (1.0 ?m) conductor were obtained by photonic sintering.

Electroless Copper Plating of Titanium Condenser Tubes for Biofouling Control

2016 ◽  
Vol 6 (1) ◽  
pp. 65-73
Author(s):  
Balakrishnan Anandkumar ◽  
Rani P. George ◽  
Alagarsamy Karthik ◽  
Dasnamoorthy Ramachandran ◽  
Uthandi Kamachi Mudali
Keyword(s):  
Copper Plating ◽  
Electroless Copper Plating ◽  
Electroless Copper ◽  
Biofouling Control

Novel fabrication of low-cost Ti–Cu alloy by electroless copper plating and vacuum sintering

Vacuum ◽  
2021 ◽  
pp. 110330
Author(s):  
Chunming Wang ◽  
Luming Zeng ◽  
Wucheng Ding ◽  
Tongxiang Liang
Keyword(s):  
Low Cost ◽  
Copper Plating ◽  
Vacuum Sintering ◽  
Electroless Copper Plating ◽  
Cu Alloy ◽  
Electroless Copper
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