A capacitive humidity sensor integrated with micro heater and ring oscillator circuit fabricated by CMOS–MEMS technique

2007 ◽  
Vol 122 (2) ◽  
pp. 375-380 ◽  
Author(s):  
Ching-Liang Dai
Keyword(s):  
Humidity Sensor ◽  
Ring Oscillator ◽  
Oscillator Circuit ◽  
Cmos Mems ◽  
Capacitive Humidity Sensor

scholarly journals Polypyrrole Porous Micro Humidity Sensor Integrated with a Ring Oscillator Circuit on Chip

Sensors ◽  
2010 ◽  
Vol 10 (11) ◽  
pp. 10095-10104 ◽  
Author(s):  
Ming-Zhi Yang ◽  
Ching-Liang Dai ◽  
De-Hao Lu
Keyword(s):  
Humidity Sensor ◽  
Ring Oscillator ◽  
Oscillator Circuit ◽  
On Chip

Development of a CMOS-MEMS RF-aerogel-based capacitive humidity sensor

2014 ◽  
Author(s):  
Vincent P. J. Chung ◽  
Jack K.-C. Liang ◽  
Chao-Lin Cheng ◽  
Ming-Chuen Yip ◽  
Weileun Fang
Keyword(s):  
Humidity Sensor ◽  
Cmos Mems ◽  
Capacitive Humidity Sensor

Resorcinol–formaldehyde aerogels for CMOS-MEMS capacitive humidity sensor

2015 ◽  
Vol 214 ◽  
pp. 181-188 ◽  
Author(s):  
Vincent P.J. Chung ◽  
Ming-Chuen Yip ◽  
Weileun Fang
Keyword(s):  
Humidity Sensor ◽  
Resorcinol Formaldehyde ◽  
Cmos Mems ◽  
Capacitive Humidity Sensor

CMOS-MEMS Capacitive Humidity Sensor

2010 ◽  
Vol 19 (1) ◽  
pp. 183-191 ◽  
Author(s):  
Nathan Lazarus ◽  
Sarah S. Bedair ◽  
Chiung-C. Lo ◽  
Gary K. Fedder
Keyword(s):  
Humidity Sensor ◽  
Cmos Mems ◽  
Capacitive Humidity Sensor

Backside FIB Device Modifications Through the BOX Layer of an SOI Device

2002 ◽  
Author(s):  
Jeffery P. Huynh ◽  
Joseph P. Shannon ◽  
Richard W. Johnson ◽  
Mike Santana ◽  
Thomas Y. Chu ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Oxide Layer ◽  
Cross Section ◽  
Test Structure ◽  
Ring Oscillator ◽  
Oscillator Circuit ◽  
Entire Process ◽  
Oscillator Frequency ◽  
Polysilicon Gate ◽  
Resistance Data

Abstract Modifications directly to a transistor’s source/drain and polysilicon gate through the backside of a SOI device were made. Contact resistance data was obtained by creating contacts through the buried oxide layer of a manufactured test structure. A ring oscillator circuit was modified and the shift in oscillator frequency was measured. Finally, cross section images of the FIB created contacts were presented in the paper to illustrate the entire process.

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