Stabilizing nanograins in metals with grain boundary relaxation

2020 ◽  
Vol 187 ◽  
pp. 345-349
Author(s):  
X. Zhou ◽  
X.Y. Li ◽  
K. Lu
Keyword(s):  
Grain Boundary ◽  
Boundary Relaxation

Grain boundary relaxation in fine-grained magnesium solid solutions

2011 ◽  
Vol 91 (32) ◽  
pp. 4158-4171 ◽  
Author(s):  
Hiroyuki Watanabe ◽  
Akira Owashi ◽  
Tokuteru Uesugi ◽  
Yorinobu Takigawa ◽  
Kenji Higashi
Keyword(s):  
Grain Boundary ◽  
Solid Solutions ◽  
Fine Grained ◽  
Boundary Relaxation

Influence of a weak pulsed magnetic field on grain-boundary relaxation in aluminum

1999 ◽  
Vol 41 (11) ◽  
pp. 1821-1823
Author(s):  
O. I. Datsko ◽  
V. I. Alekseenko ◽  
A. L. Brusova
Keyword(s):  
Magnetic Field ◽  
Grain Boundary ◽  
Pulsed Magnetic Field ◽  
Boundary Relaxation

Superplasticity and Grain Boundary Relaxation in High-Carbon Tool Steel

1987 ◽  
pp. 1343-1346
Author(s):  
Ch. Kortensky ◽  
N. Mitev ◽  
I. Spirov ◽  
N. Dyulgerov
Keyword(s):  
Grain Boundary ◽  
Tool Steel ◽  
High Carbon ◽  
Boundary Relaxation

scholarly journals Rapid heating induced ultrahigh stability of nanograined copper

2020 ◽  
Vol 6 (17) ◽  
pp. eaaz8003 ◽  
Author(s):  
X.Y. Li ◽  
X. Zhou ◽  
K. Lu
Keyword(s):  
Grain Boundary ◽  
Critical Size ◽  
Rapid Heating ◽  
Coarse Grained ◽  
Recrystallization Temperature ◽  
Mechanical Instability ◽  
Thermally Induced ◽  
Alternative Approach ◽  
Boundary Relaxation ◽  
Pure Cu

Inherent thermal and mechanical instability of nanograined materials bottlenecks their processing and technological applications. In addition to the traditional stabilization strategy, which is based on alloying, grain boundary relaxation was recently found to be effective in stabilizing nanograined pure metals. Grain boundary relaxation can be induced by deforming very fine nanograins below a critical size, typically several tens of nanometers. Here, we found that rapid heating may trigger intensive boundary relaxation of pure Cu nanograins with sizes up to submicrometers, a length scale with notable instability in metals. The rapidly heated Cu nanograins remain stable at temperatures as high as 0.6 Tm (melting point), even higher than the recrystallization temperature of deformed coarse-grained Cu. The thermally induced grain boundary relaxation originating from the generation of high-density nanotwins offers an alternative approach to stabilizing nanostructured materials.

scholarly journals Grain boundary relaxation in yellow gold bi-crystals

2015 ◽  
Vol 632 ◽  
pp. 43-49 ◽  
Author(s):  
Ann-Kathrin Maier ◽  
Daniele Mari ◽  
Iva Tkalcec ◽  
Robert Schaller
Keyword(s):  
Grain Boundary ◽  
Boundary Relaxation

Effect of Quenching on the Grain Boundary Relaxation in PM2000 ODS Alloy

2005 ◽  
Vol 22 (12) ◽  
pp. 3147-3150 ◽  
Author(s):  
Gao Zhan-Yong ◽  
Wu Jie ◽  
Han Fu-Sheng
Keyword(s):  
Grain Boundary ◽  
Boundary Relaxation ◽  
Ods Alloy

Mechanical Stress, Grain-boundary Relaxation, and Oxidation of Sputtered CuNi(Mn) Films

1999 ◽  
Vol 14 (4) ◽  
pp. 1286-1294 ◽  
Author(s):  
W. Brückner ◽  
W. Pitschke ◽  
S. Baunack ◽  
J. Thomas
Keyword(s):  
Grain Boundary ◽  
Microstructural Characterization ◽  
Excess Vacancy ◽  
X Ray Diffraction ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Boundary Relaxation ◽  
20 Nm ◽  
Atomic Rearrangement

This paper focuses on understanding stress development in CuNi42Mn1 thin films during annealing in Ar. In addition to stress-temperature measurements, resistance-temperature investigations and chemical and microstructural characterization by Auger electron spectroscopy, scanning and transmission electron microscopy, x-ray diffraction, and atomic force microscopy were also carried out. The films are polycrystalline with a grain size of 20 nm up to 450 °C. To explain the stress evolution above 120 °C, atomic rearrangement (excess-vacancy annihilation, grain-boundary relaxation, and shrinkage of grain-boundary voids) and oxidation were considered. Grain-boundary relaxation was found to be the dominating process up to 250–300 °C. A sharp transition from compressive to tensile stress between 300 and 380 °C is explained by the formation of a NiO surface layer due to reaction with the remaining oxygen in the Ar atmosphere. This oxidation is masking the inherent structural relaxation above 300 °C.

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