Shear fatigue cracking of twin boundary and grain boundary without dislocation impingement

2015 ◽  
Vol 100 ◽  
pp. 28-31 ◽  
Author(s):  
L.L. Li ◽  
Z.J. Zhang ◽  
P. Zhang ◽  
J.B. Yang ◽  
Z.F. Zhang
2020 ◽  
Vol 13 (10) ◽  
pp. 105501
Author(s):  
Kuan-Kan Hu ◽  
Kensaku Maeda ◽  
Keiji Shiga ◽  
Haruhiko Morito ◽  
Kozo Fujiwara

2006 ◽  
Vol 914 ◽  
Author(s):  
Hyo-Jong Lee ◽  
Heung Nam Han ◽  
Suk Hoon Kang ◽  
Jeong-Yun Sun ◽  
Kyu Hwan Oh

AbstractIn a crystallographic study of stress induced voiding of copper interconnect, the planar electron backscattered diffraction analysis showed that the void was initiated at the triple junction of the grain boundaries, not at the junction of the twin boundary and grain boundary. By using stepwise cross-sectional crystalline investigation for the void, it was possible to rebuild 3D crystalline structure near the void. From the stress calculation based on the measured crystalline structures, the hydrostatic stress was highly concentrated at the triple junction of the twin boundary and grain boundary, but experimentally, there was no voiding at that. The voiding in the copper interconnect may depend mainly on the boundary instability.


2018 ◽  
Vol 139 ◽  
pp. 141-154 ◽  
Author(s):  
R. Jiang ◽  
D. Proprentner ◽  
M. Callisti ◽  
B. Shollock ◽  
X.T. Hu ◽  
...  

2021 ◽  
pp. 1665-1673
Author(s):  
Shan Jingsong ◽  
Han Lujia ◽  
Guo Zhongyin ◽  
Li Feng

2018 ◽  
Vol 195 ◽  
pp. 69-73 ◽  
Author(s):  
Lihua Wang ◽  
Jiao Teng ◽  
Yu Wu ◽  
Xuechao Sha ◽  
Sisi Xiang ◽  
...  

2018 ◽  
Vol 55 (1) ◽  
pp. 21-25 ◽  
Author(s):  
N.V. Skiba

Abstract Stress-driven grain boundary (GB) migration in ultrafine-grained materials with nanotwinned structure is theoretically described. In the framework of the theoretical model, the stress-driven high-angle GB migration is accompanied by migration of twin boundaries which adjoin this GB. Energetic characteristics and critical stresses of the GB migration accompanied by the twin boundary migration are calculated.


2017 ◽  
Vol 31 (11) ◽  
pp. 1750080
Author(s):  
Kaimin Fan ◽  
Jing Tang ◽  
Li Yang ◽  
Yongqing Hu ◽  
Qingqiang Sun ◽  
...  

We have investigated the grain boundary energy of ([Formula: see text]) twin boundaries, the formation energies of hydrogen (H) and helium (He) defects in tetrahedral (T) and octahedral (O) interstitial sites at the ([Formula: see text]) twin boundary in hcp scandium (Sc) by first-principles calculations based on density functional theory. It is found that the formation energies of the tetrahedral and octahedral interstices H, and tetrahedral interstice He increase significantly towards the ([Formula: see text]) twin boundary plane, while the formation energy of the octahedral interstice He atom near the ([Formula: see text]) twin boundary plane decreases. To analyze these results, we present the electronic densities of states (DOSs) of H, He and their nearest-neighbor Sc (NN-Sc) atoms in several tetrahedral and octahedral configurations. We have also calculated the formation energies of He-vacancy clusters (He[Formula: see text]V) in the Sc grain boundary, which indicates the stabilities of He[Formula: see text]V clusters depend on the variations of the relaxed vacancy volume near the ([Formula: see text]) twin boundary plane.


1993 ◽  
Vol 319 ◽  
Author(s):  
Jenn-Yue Wang ◽  
A. H. King

AbstractVarious morphologies are observed where twins meet grain boundaries in YBa2Cu3O7−δ. Twins may be “correlated” at the boundary (i.e. twin boundaries from one grain may meet a twin boundary from the other grain in a quadruple junction) and the twins may be narrowed or “constricted” at the boundary. These effects are determined by the interfacial energy. We estimate the energy of the various interfaces by determining the dislocation arrays they contain, using the constrained coincidence site lattice (CCSL) model and Bollmann's O2-lattice formalism. Our approach indicates that there are significant changes in the energy of the interfaces and is thus able to explain the variety of observed morphologies.


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