Decomposition of ZrW 2 O 8 in Al matrix and the influence of heat treatment on ZrW 2 O 8 /Al–Si thermal expansion

2015 ◽  
Vol 96 ◽  
pp. 29-32 ◽  
Author(s):  
Gaohui Wu ◽  
Chang Zhou ◽  
Qiang Zhang ◽  
Risheng Pei
Keyword(s):  
Heat Treatment ◽  
Thermal Expansion ◽  
Al Matrix

The orientation relationships of nanobelt-like Si2Hf precipitates in an Al–Si–Mg–Hf alloy

2016 ◽  
Vol 49 (4) ◽  
pp. 1223-1230 ◽  
Author(s):  
Xueli Wang ◽  
Huilan Huang ◽  
Xinfu Gu ◽  
Yanjun Li ◽  
Zhihong Jia ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Heat Treatment ◽  
Coincident Site Lattice ◽  
Orthorhombic Structure ◽  
Orientation Relationships ◽  
Lattice Distribution ◽  
Site Lattice ◽  
Transmission Electron ◽  
Habit Planes ◽  
Al Matrix

The orientation relationships (ORs) between the Al matrix and Si2Hf precipitates with an orthorhombic structure in an Al–Si–Mg–Hf alloy after heat treatment at 833 K for 20 h were investigated by transmission electron microscopy and electron diffraction. Four ORs are identified as (100)Al||(010)p, (0\overline {1}1)Al||(101)pand [011]Al||[\overline {1}01]p; (11\overline {1})Al||(010)pand [011]Al||[\overline {1}01]p; (12\overline {1})Al||(010)p, (101)Al||(100)pand [1\overline {11}]Al||[001]p; (\overline {11}1)Al||(010)pand [112]Al||[\overline {1}01]p. The habit planes of these four ORs are rationalized by the fraction of good atomic matching sites at the interface. In addition, the formation of Si2Hf precipitates with a nanobelt-like morphology is interpreted on the basis of the near-coincident site lattice distribution.

Influence of Residual Stress on the Thermal Expansion Behavior of Electroformed Nickel Layers

2013 ◽  
Vol 662 ◽  
pp. 511-514
Author(s):  
Yi Chun Liu ◽  
Jia Min Zhang ◽  
Jian Hong Yi
Keyword(s):  
Heat Treatment ◽  
Residual Stress ◽  
Thermal Expansion ◽  
Theoretical Analysis ◽  
Subsequent Heat Treatment ◽  
Experimental Results ◽  
Thermal Expansion Behavior ◽  
Expansion Behavior ◽  
Electroformed Nickel ◽  
The Relationship

Nickel layers with tensile or pressure residual stress were prepared by electroforming technique from two kinds of electrolyte. Subsequent heat treatment was adopted to get the stress released. The coefficients of thermal expansion (CTEs) were measured with a thermal dilatometer and the relationship between residual stress and the measured CTEs was revealed both from experimental results and theoretical analysis.

Effects of Heat-Treatment Temperature on the Properties of Negative CTE Eucryptite Ceramics

2010 ◽  
Vol 105-106 ◽  
pp. 123-125 ◽  
Author(s):  
Yong Li ◽  
Qi Hong Wei ◽  
Ling Li ◽  
Chong Hai Wang ◽  
Xiao Li Zhang ◽  
...  
Keyword(s):  
Heat Treatment ◽  
Thermal Expansion ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Heat Treatment Temperature ◽  
Bending Strength ◽  
Sol Gel ◽  
Negative Thermal Expansion ◽  
Treatment Temperature ◽  
Heat Treated

In this paper, negative thermal expansion coefficient eucryptite powders were prepared by sol-gel method using silica-sol as starting material. The raw blocks were obtained by dry pressing process after the powder was synthesized, and then the raw blocks were heat-treated at 600º, 1150º, 1280º, 1380º, 1420º and 1450°C, respectively. Variations of density, porosity and thermal expansion coefficient at different heat treatment temperatures were investigated. Phase transformation and fracture surface morphology of eucryptite heat-treated at different temperatures, respectively, were observed by XRD and SEM. The results indicate that, with the increasing heat- treatment temperature, the grain size and the bending strength increased, porosity decreased, thermal expansion coefficient decreased continuously. Negative thermal expansion coefficient of -5.3162×10-6~-7.4413×10-6 (0~800°C) was obtained. But when the heat-treatment temperature was more than 1420°C, porosity began to increase, bending strength began to decrease, which were the symbols of over-burning, while the main crystal phase didn’t change.

Surface Modification of Diamonds in Diamond/Al-Matrix Composite

2008 ◽  
Vol 59 ◽  
pp. 125-130 ◽  
Author(s):  
C. Edtmaier ◽  
Ludger Weber ◽  
Reza Tavangar
Keyword(s):  
Electron Microscopy ◽  
Heat Treatment ◽  
Treatment Temperature ◽  
Pressure Infiltration ◽  
Argon Gas ◽  
Diamond Particles ◽  
Heat Treated ◽  
Modified Surface ◽  
Al Matrix Composite ◽  
Al Matrix

Fe- or Mn-powders were mixed with the diamonds and the mixtures were heat treated under different gas atmospheres like hydrogen or argon gas and at varying temperatures in order to roughen the surface of the diamond particles. Subsequently the reaction layers are removed by the addition of aqueous solutions of HCl. The modified surface structure after the etching process is investigated by electron microscopy showing increased roughening of the formerly flat faces of the diamond particles with increasing heat treatment temperature. After drying the diamonds, composites were prepared by gas pressure infiltration with pure Al. For treatments in the temperature range from 750 to 850°C the thermal conductivity can be improved by up to 20 percent compared to composites based on un-treated powders.

Thermal Expansion Behavior and Characteristic of SiCp/Al Composites

2011 ◽  
Vol 287-290 ◽  
pp. 658-661 ◽  
Author(s):  
Xian Liang Zhou ◽  
Duo Sheng Li ◽  
Ai Hua Zou ◽  
Xiao Zhen Hua ◽  
Zhi Guo Ye ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Size Range ◽  
Coefficient Of Thermal Expansion ◽  
Pure Aluminum ◽  
Annealing Process ◽  
Ceramic Mold ◽  
Range Space ◽  
Thermal Expansion Behavior ◽  
Expansion Behavior ◽  
Al Matrix

SiCp/Al composites were fabricated by ceramic mold freedom infiltration and pressureless infiltration, respectively. The microstructure and phases are analyzed by metallurgical microscope and coefficient of thermal expansion of SiCp/Al composites were tested by thermal dilatometer. The results show that SiCp/Al composites are compact and uniform. SiC particles were dispersed uniformly in Al matrix, and SiCp segregation was not found in composites. Under a certain SiCp size range, space between SiCp decreases with decreasing of SiCp size, and CTE of SiCp/Al composites also decreases with decreasing of particles size. Compared with CTE of composite with pure aluminum as matrix, CTE of composite with ZL101 as matrix is less. Under the annealing process, CTE of SiCp/Al composites with ZL101 as matrix is less than that with the solution and aging, which indicated that its dimensional stability of resisting to temperature fluctuation is better, and thermal expansion behavior and characteristic of SiCp/Al composites are also better.

Zn2+- Controlled Crystallization and Microstructure in K-Li-Mg-B-Si-Al-F Glass

MRS Advances ◽  
2018 ◽  
Vol 3 (60) ◽  
pp. 3525-3533 ◽  
Author(s):  
Mrinmoy Garai ◽  
Anoop K. Maurya ◽  
Shibayan Roy
Keyword(s):  
Heat Treatment ◽  
Thermal Expansion ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Ceramic ◽  
Vickers Microhardness ◽  
Glass Ceramics ◽  
Network Modifier ◽  
Base Glass ◽  
Controlled Crystallization

Abstract Text:The crystallization of (9-X) K2O-1Li2O-12MgO-10B2O3-40SiO2-16Al2O3-12MgF2-X PbO/BaO/ZnO (X =0/5) composition (wt.%) were studied by means of dilatometry, DSC, XRD, SEM and microhardness analysis. Density of base K-Li-Mg-B-Si-Al-F glass (2.59 g.cm–3) is found to be increased on addition of the network modifier oxides PbO, BaO and ZnO content. Addition of Pb2+, Ba2+ and Zn2+ furthermore increased the glass transition temperature (Tg.). A characteristic exothermic hump is found to be appeared in DSC thermograph at the temperature range 800-950°C; and that is ascribed to the formation of crystalline phase fluorophlogopite mica, KMg3(AlSi3O10)F2. Opaque glass-ceramics were prepared from K-Li-Mg-B-Si-Al-F glasses (with and without containing PbO, BaO and ZnO content) by controlled heat-treatment at 1000°C. Interlocked type microstructure combined of flake like fluorophlogopite mica crystals is obtained in ZnO-containing K-Li-Mg-B-Si-Al-F glass-ceramic; and such microstructural pattern is ascribed to cause large thermal-expansion (>11.5×10-6/K, 50-800°C).Vickers Microhardness of base glass-ceramic (5.12 GPa) is increased when contains ZnO (5.26 GPa). ZnO-containing boroaluminosilicate glass-ceramic is, hence, considered with potential interest as they can exhibit the microcrack resistivity in high temperature recycling operation (like SOFC).

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