A discrete dislocation dynamics modeling for thermal fatigue of preferred oriented copper via patterns
2010 ◽
Vol 63
(7)
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pp. 788-791
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2009 ◽
Vol 526
(1-2)
◽
pp. 235-243
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2013 ◽
Vol 75
◽
pp. 52-59
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2003 ◽
Vol 11
(4)
◽
pp. 609-625
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