scholarly journals Vibration Response Prediction of the Printed Circuit Boards Using Experimentally Validated Finite Element Model

2016 ◽  
Vol 144 ◽  
pp. 576-583 ◽  
Author(s):  
V.N. Somashekar ◽  
S. Harikrishnan ◽  
P.S.M. Aejaz Ahmed ◽  
D. Kamesh
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Printed Circuit Boards ◽  
Response Prediction ◽  
Element Model ◽  
Vibration Response ◽  
Circuit Boards ◽  
Printed Circuit

Vibration Analysis of Masonry Structures due to Blasting Construction of Mountain Tunnels

2012 ◽  
Vol 170-173 ◽  
pp. 3116-3120
Author(s):  
Tao Wang ◽  
Zhong Qiang Fang ◽  
Hao Li
Keyword(s):  
Finite Element ◽  
Finite Element Model ◽  
Vibration Analysis ◽  
Element Model ◽  
Vibration Response ◽  
Blasting Vibration ◽  
Masonry Structures ◽  
Safety Standard ◽  
Construction Quality ◽  
Mountain Tunnels

Blasting construction of Houyuntai Mountain tunnels has vibration influence on ground masonry structures. 3-D finite element model is established to analyze this problem which indicates the house’s vibration response velocity induced by blasting loads. According to this analysis, the structure range of removal and strengthening is assured based on the allowable safety standard of 0.02~0.025m/s of blasting vibration. They include that the houses in 20m range of both sides of horizontal tunnel axis should be removed; the security in 20~28m range is not good, as a result the houses should be removed or strengthened; and the security over 28m range is good for houses. Moreover, some factors such as construction quality can influence houses’ anti-vibration safety.

Study on Vibration and Damping of Printed Circuit Boards Treated with Partial Constrained Damping Layer

2014 ◽  
Vol 1049-1050 ◽  
pp. 590-594
Author(s):  
Xiao Dong Zhou ◽  
Chang Wu Xiong
Keyword(s):  
Printed Circuit Boards ◽  
Optimization Method ◽  
Vibration Response ◽  
Good Effect ◽  
Experimental Investigations ◽  
Constrained Layer Damping ◽  
Circuit Boards ◽  
Vibration System ◽  
Printed Circuit ◽  
Constrained Damping

Constrained damping layer (CDL) treatment has been an effective way to suppress vibration level of various structures. by introducing this method into the vibration control system of electronic equipments, this paper firstly discussed the dominant mechanism difference between free damping layer treatment and constrained damping layer treatment, Then base on the constrained layer damping layout optimization method in the vibration system of a rectangle thin board like PCB, a series of experimental investigations were presented on the vibration response of printed circuit boards treated with partial constrained damping layers. as a result, it proves the CDL treatment having good effect on vibration response control of PCBs.

Identification of printed circuit boards mechanical properties using response surface methods

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Mohammad Gharaibeh
Keyword(s):  
Finite Element ◽  
Response Surface ◽  
Material Properties ◽  
Printed Circuit Boards ◽  
Dynamic Testing ◽  
Mode Shapes ◽  
Fe Model ◽  
Circuit Boards ◽  
Content Type ◽  
Printed Circuit

Purpose This study aims to discuss the determination of the unknown in-plane mechanical material properties of printed circuit boards (PCBs) by correlating the results from dynamic testing and finite element (FE) models using the response surface method (RSM). Design/methodology/approach The first 10 resonant frequencies and vibratory mode shapes are measured using modal analysis with hammer testing experiment, and hence, systematically compared with finite element analysis (FEA) results. The RSM is consequently used to minimize the cumulative error between dynamic testing and FEA results by continuously modifying the FE model, to acquire material properties of PCBs. Findings Great agreement is shown when comparing FEA to measurements, the optimum in-plane material properties were identified, and hence, verified. Originality/value This paper used FEA and RSMs along with modal measurements to obtain in-plane material properties of PCBs. The methodology presented here can be easily generalized and repeated for different board designs and configurations.

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