scholarly journals The Impact of the Nature of the Electrode Material on SnO2 Thick Film Sensor Performance: Influence on Oxygen Adsorption

2012 ◽  
Vol 47 ◽  
pp. 514-517 ◽  
Author(s):  
S. Rank ◽  
S. Hafner ◽  
N. Barsan ◽  
U. Weimar
RSC Advances ◽  
2021 ◽  
Vol 11 (15) ◽  
pp. 8970-8985
Author(s):  
Robin Kunkel ◽  
Volkmar M. Schmidt ◽  
Carsten Cremers ◽  
Dominik Müller ◽  
Detlef Schmiedl ◽  
...  

Hydrovanilloin and polyvanillin were synthesized electrochemically investigating the impact of process parameters such as electrode material, charge and current density.


Circuit World ◽  
2014 ◽  
Vol 40 (1) ◽  
pp. 7-12 ◽  
Author(s):  
Wojciech Steplewski ◽  
Andrzej Dziedzic ◽  
Janusz Borecki ◽  
Grazyna Koziol ◽  
Tomasz Serzysko

Purpose – The purpose of this paper is to investigate the influence of parameters of embedded resistive elements manufacturing process as well as the influence of environmental factors on their electrical resistance. The investigations were made in comparison to the similar constructions of discrete chip resistors assembled to standard printed circuit boards (PCBs). Design/methodology/approach – The investigations were based on the thin-film resistors made of NiP alloy, thick-film resistors made of carbon or carbon-silver inks as well as chip resistors in 0402 and 0603 packages. The polymer thick-film resistive films were screen-printed on the several types finishing materials of contact terminations such as copper, silver, and gold. To determine the sensitivity of embedded resistors versus standard assembled chip resistors on environmental exposure, the climatic chamber was used. The measurements of resistance were carried out periodically during the tests, and after the exposure cycles. Findings – The results show that the change of electrical resistance of embedded resistors, in dependence of construction and base material, is different and mainly not exceed the range of 3 per cent. The achieved results in reference to thin-film resistors are comparable with results for standard chip resistors. However, the results that were obtained for thick-film resistors with Ag and Ni/Au contacts are similar. It was not found the big differences between resistors with and without conformal coating. Research limitations/implications – The studies show that embedded resistors can be used interchangeably with chip resistors. It allows to save the area on the surface of PCB, occupied by these passive elements, for assembly of active elements (ICs) and thus enable to miniaturization of electronic devices. But embedding of passive elements into PCB requires to tackle the effect of each forming process steps on the operational properties. Originality/value – The technique of passive elements embedding into PCB is generally known; however, there are no detailed reports on the impact of individual process steps and environmental conditions on the stability of their electrical resistance. The studies allow to understand the importance of each factor process and the mechanisms of operational properties changes depending on the used materials.


Author(s):  
Vinayak R. Bagul ◽  
Ganesh R. Bhagure ◽  
Satish Arvind Ahire ◽  
Arun Vitthal Patil ◽  
Vishnu Ashok Adole ◽  
...  

2019 ◽  
Vol 37 (1) ◽  
pp. 80-87 ◽  
Author(s):  
Yanping Chen ◽  
Dandan Wang ◽  
Hongwei Qin ◽  
Heng Zhang ◽  
Zhongli Zhang ◽  
...  

2006 ◽  
Vol 915 ◽  
Author(s):  
Alexey Tomchenko ◽  
Brent Marquis

AbstractIn this presentation, we discuss the development of nanostructured sensor materials based on nanoparticulate metal-oxide suspensions deposited onto MEMS μHPs by microprinting. The preparation of the suspensions is described; the precise control over the thickness of the films through the composition of the metal-oxide suspensions is demonstrated. The procedure of microprinting is described. The deposited films are evaluated as chemical sensors. The sensor performance of the microsensors – sensitivity, stability, speed of operation, and selectivity – is compared with that of analogous traditional thick-film sensors.


Author(s):  
D. N. Chavan ◽  
R. H. Bari ◽  
G. E. Patil ◽  
D. D. Kajale ◽  
V. B. Gaikwad ◽  
...  
Keyword(s):  

2016 ◽  
Vol 33 (8) ◽  
pp. 1569-1582 ◽  
Author(s):  
Adam L. Houston ◽  
Roger J. Laurence ◽  
Tevis W. Nichols ◽  
Sean Waugh ◽  
Brian Argrow ◽  
...  

AbstractResults are presented from an intercomparison of temperature, humidity, and wind velocity sensors of the Tempest unmanned aircraft system (UAS) and the National Severe Storms Laboratory (NSSL) mobile mesonet (NSSL-MM). Contemporaneous evaluation of sensor performance was facilitated by mounting the Tempest wing with attached sensors to the NSSL-MM instrument rack such that the Tempest and NSSL-MM sensors could collect observations within a nearly identical airstream. This intercomparison was complemented by wind tunnel simulations designed to evaluate the impact of the mobile mesonet vehicle on the observed wind velocity.The intercomparison revealed strong correspondence between the temperature and relative humidity (RH) data collected by the Tempest and the NSSL-MM with differences generally within sensor accuracies. Larger RH differences were noted in the presence of heavy precipitation; however, despite the exposure of the Tempest temperature and humidity sensor to the airstream, there was no evidence of wet bulbing within precipitation. Wind tunnel simulations revealed that the simulated winds at the location of the NSSL-MM wind monitor were ~4% larger than the expected winds due to the acceleration of the flow over the vehicle. Simulated vertical velocity exceeded 1 m s−1 for tunnel inlet speeds typical of a vehicle moving at highway speeds. However, the theoretical noncosine reduction in winds that should result from the impact of vertical velocity on the laterally mounted wind monitor was found to be negligible across the simulations. Comparison of the simulated and observed results indicates a close correspondence, provided the crosswind component of the flow is small.


2019 ◽  
Vol 50 (5) ◽  
pp. 616-634 ◽  
Author(s):  
Rafiu K Raji ◽  
Xuhong Miao ◽  
Shu Zhang ◽  
Yutian Li ◽  
Ailan Wan ◽  
...  

While many of the factors influencing strain sensor properties have been explained in literature, other very important parameters that influence actual design performance of sensors remain obscure. This paper investigates the impact of conductive profile and area design including post fabric treatments such as dyeing and washing on sensor performance. 1 × 1 mock rib was the fabric structure of choice, and silver-plaited nylon was the conductive yarn used in knitting all the samples. Six main polygonal shapes including ellipse, diamond shape, corrugated rectangular shape, rectangular horse shoe, rectangular dough roller shape, and plain rectangular shape were designed and knitted. Plain rectangular profile has been found to deliver the best results characterized by noiseless signals, highest gauge factor, and good result repeatability. The analysis of results also reveals a positive linear correlation between conductive path and initial electrical resistance of a sensor. The inverse is true for the relation between the conductive width values and their corresponding initial resistances. Higher conductive widths led to low initial resistance, and values less than 20 Ω for a sensor could lead to inferior sensor sensitivity. High conductive paths produced high initial resistances, and values within the range of 40–120 Ω could deliver higher sensitivity. This study thus concludes that the optimum aspect ratio range for conductive area to deliver satisfactory sensitivity results is approximately between 24:1 and 77:1 cm. Laundry and dyeing have also been found to result in reduced sensor dimensions, resistance, and sensitivity levels.


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