scholarly journals Preparation and Characterization of Pd-Ag Alloy Membranes via Simultaneous Plating by Continuous Addition of Ag to the Electroless Plating Solution

2012 ◽  
Vol 44 ◽  
pp. 1002-1004
Author(s):  
D.A. Pacheco Tanaka ◽  
E. Fernández ◽  
J. Zúñiga ◽  
M. Etxeberria ◽  
S. Miguel ◽  
...  
Keyword(s):  
Electroless Plating ◽  
Plating Solution

Preparation and characterization of aluminum coatings via electroless plating onto nickel nanowires using ionic liquid plating solution

2018 ◽  
Vol 207 ◽  
pp. 303-308 ◽  
Author(s):  
Shannon Poges ◽  
Jing Jin ◽  
Curtis Guild ◽  
Wei-Na Li ◽  
Michael Birnkrant ◽  
...  
Keyword(s):  
Ionic Liquid ◽  
Electroless Plating ◽  
Aluminum Coatings ◽  
Nickel Nanowires ◽  
Plating Solution

Evaluation and characterization of Pd-Ag composite membrane fabricated by surfactant induced electroless plating (SIEP) for hydrogen separation

2019 ◽  
Vol 54 (13) ◽  
pp. 2084-2097 ◽  
Author(s):  
M. M. Rahman ◽  
M. S. Islam ◽  
M. A. Rahman ◽  
H. Tun ◽  
V. Deshmane ◽  
...  
Keyword(s):  
Composite Membrane ◽  
Electroless Plating ◽  
Hydrogen Separation

Electroless plating of gold on GaAs for fast characterization of thin epitaxial layers

1978 ◽  
Vol 55 (1) ◽  
pp. 25-33 ◽  
Author(s):  
G.P. Donzelli ◽  
G. Guarini ◽  
F. Vidimari
Keyword(s):  
Electroless Plating ◽  
Epitaxial Layers

Formation and Structural Characterization of Electroless Ni-B-P Ternary Alloy Coatings

2014 ◽  
Vol 592-594 ◽  
pp. 385-390 ◽  
Author(s):  
P.G. Venkatakrishnan ◽  
S.S. Mohamed Nazirudeen ◽  
T.S.N. Sankara Narayanan
Keyword(s):  
Electroless Plating ◽  
Morphological Characteristics ◽  
Reducing Agents ◽  
Sodium Hypophosphite ◽  
Electron Microscopic ◽  
Plating Bath ◽  
Peak Broadening ◽  
Chloride Hexahydrate ◽  
Electroless Ni

The aim of the present investigation is to study the formation of electroless Ni-B-P alloy coatings and structural and morphological characterization of various coatings with different boron and phosphorous content. An alkaline plating bath with nickel chloride hexahydrate as the source of nickel ions and sodium borohydride and sodium hypophosphite as reducing agents were used for the formation of electroless Ni-B-P alloy coatings. The influence of changes in the concentrations of the reducing agents in the electroless plating bath on the chemical composition, structural and morphological characteristics of the coatings were studied. Scanning electron microscopic studies revealed that the surface morphology of Ni-B-P alloy coatings changed from corn cob-like structure to cauliflower-like structure with increasing borohydride concentration in electroless plating bath, whereas increase in hypophosphite concentration favoured sideway growth, thereby decreased the surface roughness of the Ni-B-P alloy coatings. The peak broadening in the X-Ray Diffraction profiles indicates the large reduction in the crystallite size of the electroless Ni-B-P alloy coatings with increasing boron content in the coating (i.e. for higher borohydride concentration in the plating bath).

Fabrication and characterization of a thin film capacitor using Al anodizing and Ni electroless plating

2010 ◽  
Vol 63 (3) ◽  
pp. 269-272 ◽  
Author(s):  
Joo-Hee Jang ◽  
Woo-Sung Choi ◽  
Chang-Hyoung Lee ◽  
Geun-Hee Jeong ◽  
Nam-Jeong Kim ◽  
...  
Keyword(s):  
Thin Film ◽  
Electroless Plating ◽  
Film Capacitor ◽  
Thin Film Capacitor ◽  
Fabrication And Characterization

Preparation and characterization of inorganic and organic coatings on AZ91D magnesium alloy with electroless plating pretreatment

2011 ◽  
Vol 62 (9) ◽  
pp. 841-847 ◽  
Author(s):  
S. Y. Zhang ◽  
Q. Li ◽  
X. K. Yang ◽  
H. X. Zhang ◽  
S. Y. Wang ◽  
...  
Keyword(s):  
Magnesium Alloy ◽  
Electroless Plating ◽  
Organic Coatings ◽  
Az91d Magnesium Alloy ◽  
Inorganic And Organic

Characterization of sputtered tungsten nitride film and its application to Cu electroless plating

2008 ◽  
Vol 85 (2) ◽  
pp. 395-400 ◽  
Author(s):  
Zenglin Wang ◽  
Zonghuai Liu ◽  
Zupei Yang ◽  
Shoso Shingubara
Keyword(s):  
Electroless Plating ◽  
Nitride Film ◽  
Tungsten Nitride
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