scholarly journals Visualization of high-speed fracture phenomena of glass container for effective glass recycling technology development

2011 ◽  
Vol 10 ◽  
pp. 2472-2477
Author(s):  
H. Sakamoto ◽  
Y. Ohbuch ◽  
H. Kuramae ◽  
Y. Nakamura ◽  
E. Nakamachi ◽  
...  
Keyword(s):  
High Speed ◽  
Technology Development ◽  
Glass Container ◽  
Recycling Technology ◽  
Glass Recycling

Observation of High Speed Glass Bottle Fracture Behaviors by Underwater Shockwave

2012 ◽  
Vol 586 ◽  
pp. 151-155
Author(s):  
Kosuke Nagata ◽  
Hidetoshi Sakamoto ◽  
Yoshifumi Ohbuchi ◽  
Hiroyuki Kuramae ◽  
Eiji Nakamachi
Keyword(s):  
High Speed ◽  
Fracture Process ◽  
Glass Bottle ◽  
Explosive Energy ◽  
Washing Process ◽  
Fracture Behaviors ◽  
Glass Bottles ◽  
Glass Recycling

This paper described new effective glass bottle fracture process for glass recycling by underwater shockwave. The high-speed fracture behaviors of glass bottles by explosive energy were discussed. In the proposed technique, the washing process can be skipped because the bottle crushing process execute in water. As a result, the recycling cost can be decreased. In order to clarify the behaviors of glass bottle fracture, the bottle was painted by 5 colors. The crushing experiment was executed under four explosive conditions. The influence of various explosive conditions on the cullet sizes were calcified by using painted bottle.

SiC High Temperature Electronics for Next Generation Aircraft Controls Systems

1996 ◽  
Author(s):  
John F. Perkins ◽  
Richard H. Hopkins ◽  
Charles D. Brandt ◽  
Anant K. Agarwal ◽  
Suresh Seshadri ◽  
...  
Keyword(s):  
High Temperature ◽  
High Speed ◽  
Technology Development ◽  
Temperature Tolerance ◽  
Oxide Semiconductor ◽  
Power Device ◽  
Next Generation ◽  
Power Devices ◽  
Basic Work ◽  
Aircraft Controls

Several organizations, including Westinghouse, CREE, and ATM, as well as researchers in Japan and Europe, are working to develop SiC power devices for reliable, high power and high temperature environments in military, industrial, utility, and automotive applications. Other organizations, such as NASA Lewis and several universities, are also doing important basic work on basic SiC technology development. It has been recognized for two decades that the superior properties of SiC lead to range of devices with higher power, greater temperature tolerance, and significantly more radiation hardness than silicon or GaAs. This combination of superior thermal and electrical properties results in SiC devices that can operate at up to ten times the power density of Si devices for a given volume. Recent research has focused on the development of vertical metal oxide semiconductor field effect transistor (VMOSFET) power device technology, and complementary high speed, temperature-tolerant rectifier-diodes for power applications. We are also evaluating applications for field control thyristors (FCT) and MOS turn-off thyristors (MTO). The technical issues to be resolved for these devices are also common to other power device structures. The present paper reviews the relative benefits of various power devices structures, with emphasis on how the special properties of SiC enhance the desirability of specific device configurations as compared to the Si-based versions of these devices. Progress in SiC material quality and recent power device research will be reviewed, and the potential for SiC-based devices to operate at much higher temperatures than Si-based devices, or with enhanced reliability at higher temperatures will be stressed. We have already demonstrated 1000V breakdown, current densities of 1 kA/cm2, and measurements up to 400°C in small diodes. The extension of this work will enable the implementation of highly distributed aircraft power control systems, as well as actuator and signal conditioning electronics for next generation engine sensors, by permitting electronic circuits, sensors and smart actuators to be mounted on or at the engine.

New Approaches for Improved Efficiency and Flexibility in Process Chains of Press Hardening

2015 ◽  
Author(s):  
Dirk Landgrebe ◽  
Julia Schönherr ◽  
Norbert Pierschel ◽  
Stefan Polster ◽  
Andre Mosel ◽  
...  
Keyword(s):  
High Speed ◽  
Technology Development ◽  
Lightweight Design ◽  
High Strength ◽  
Press Hardening ◽  
High Speed Impact ◽  
Contact Heating ◽  
Process Chains ◽  
Impact Cutting ◽  
Significant Research

In the last decade, press hardening has become a fully established technology in both science and industry for the production of ultra-high-strength structural components, especially in the automotive industry. Beside the improvement of car performance such as safety and lightweight design, the production process is also one focus of trends in technology development in the field of press hardening. This paper presents an overview about alternative approaches for optimized process chains of press hardening, also including pre- and post-processing in addition to the actual forming and quenching process. Investigations on direct contact heating technology show new prospects regarding fast and flexible austenitization of blanks at compact device dimensions. By applying high speed impact cutting (HSIC) for trimming of press hardened parts, an alternative technology is available to substitute the slow and energy-intensive laser trimming in today’s press hardening lines. Combined with stroke-to-stroke control based on measuring of process-relevant parameters, a readjustment of the production line is possible in order to produce each part with individual, optimal process parameters to realize zero defect production of property-graded press hardened components with constant high part quality. Significant research in the field of press hardening was carried out at Fraunhofer Institute for Machine Tools and Forming Technology IWU, in the hot forming model process chain which enables the running of experiments under conditions similar to industrial scales. All practical tests were prepared by design of experiments and assisted by thermo-mechanical FE simulations.

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