scholarly journals Experimental characterization of short fatigue crack kinetics in an austeno-ferritic duplex steel

2011 ◽  
Vol 10 ◽  
pp. 1491-1496 ◽  
Author(s):  
I. Alvarez-Armas ◽  
H. Knobbe ◽  
M.C. Marinelli ◽  
M. Balbi ◽  
S. Hereñú ◽  
...  
Keyword(s):  
Fatigue Crack ◽  
Experimental Characterization ◽  
Short Fatigue Crack ◽  
Duplex Steel

scholarly journals Erratum to: Experimental Characterization of Fatigue Crack Tip Processes

JOM ◽  
1985 ◽  
Vol 37 (4) ◽  
pp. 77-77
Author(s):  
J. Lankford ◽  
G. R. Levarant
Keyword(s):  
Fatigue Crack ◽  
Crack Tip ◽  
Experimental Characterization

Fatigue Behaviour of Full Scale Flat Stiffened Aeronautic Panels

2014 ◽  
Vol 627 ◽  
pp. 97-100 ◽  
Author(s):  
Raffaele Sepe ◽  
Enrico Armentani ◽  
Giuseppe Lamanna ◽  
Francesco Caputo
Keyword(s):  
Fatigue Crack ◽  
Fatigue Behaviour ◽  
Full Scale ◽  
Stiffened Panel ◽  
Experimental Characterization ◽  
Flat Panel ◽  
Fatigue Crack Growth Life ◽  
Chemical Milling ◽  
Fatigue Crack Propagation Life

This paper concerns the experimental characterization of static and fatigue strength of a flat panel stiffened by bonded pad made of aluminum alloy. The panels were full scale and tested under both static and fatigue loads, applied by means of an in house designed and built multi-axial static and fatigue machine. The fatigue crack propagation life of the stiffened panel has been compared to that of a simple flat panel and to that of a flat panel with chemical milling pad-up, getting that the fatigue crack growth life can be significantly improved.

Experimental Characterization of Fatigue Crack Tip Processes

JOM ◽  
1985 ◽  
Vol 37 (1) ◽  
pp. 54-57 ◽  
Author(s):  
J. Lankford ◽  
G. R. Leverant
Keyword(s):  
Fatigue Crack ◽  
Crack Tip ◽  
Experimental Characterization

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

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