Propargyl recombination: estimation of the high temperature, low pressure rate constant from flame measurements

2005 ◽  
Vol 30 (1) ◽  
pp. 1023-1031 ◽  
Author(s):  
Christian L. Rasmussen ◽  
Martin S. Skjøth-Rasmussen ◽  
Anker D. Jensen ◽  
Peter Glarborg
Keyword(s):  
High Temperature ◽  
Rate Constant ◽  
Low Pressure

scholarly journals The rate constant of the reaction NCN + H2 and its role in NCN and NO modeling in low pressure CH4/O2/N2-flames

2015 ◽  
Vol 17 (24) ◽  
pp. 15876-15886 ◽  
Author(s):  
Nancy Faßheber ◽  
Nathalie Lamoureux ◽  
Gernot Friedrichs
Keyword(s):  
High Temperature ◽  
Rate Constant ◽  
Low Pressure ◽  
Temperature Rate ◽  
First Time

The high temperature rate constant of the so-far neglected reaction NCN + H2 has been measured for the first time and its influence on NOx flame modeling has been evaluated by implementation into the GDFkin3.0_NCN mechanism.

Low-Pressure, High-Temperature Oxidation of Tungsten

JOM ◽  
1961 ◽  
Vol 13 (7) ◽  
pp. 490-493 ◽  
Author(s):  
R. A. Perkins ◽  
D. D. Crooks
Keyword(s):  
High Temperature ◽  
High Temperature Oxidation ◽  
Low Pressure ◽  
Temperature Oxidation

High temperature tribological behaviors of in-situ formed TiAl-TiB2 composites in low pressure oxygen

2021 ◽  
pp. 1-9
Author(s):  
Long Wang ◽  
Dongsheng Yang ◽  
Jiao Chen ◽  
Hui Tan ◽  
Shengyu Zhu ◽  
...  
Keyword(s):  
High Temperature ◽  
Low Pressure ◽  
Tribological Behaviors ◽  
Pressure Oxygen

A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization

2019 ◽  
Vol 2019 (1) ◽  
pp. 000387-000392 ◽  
Author(s):  
Sri Krishna Bhogaraju ◽  
Omid Mokhtari ◽  
Jacopo Pascucci ◽  
Fosca Conti ◽  
Hiren R Kotadia ◽  
...  
Keyword(s):  
High Temperature ◽  
Low Cost ◽  
Surface Modifications ◽  
Low Pressure ◽  
Bonding Pressure ◽  
High Tendency ◽  
Promising Alternative ◽  
Die Attach ◽  
Bandgap Semiconductors ◽  
Surface Modified

Abstract High temperature power electronics based on wide-bandgap semiconductors have prominent applications, such as automotive, aircrafts, space exploration, oil/gas extraction, electricity distribution. Die-attach bonding process is an essential process in the realization of high temperature power devices. Here Cu offers to be a promising alternative to Ag, especially because of thermal and mechanical properties on par with Ag and a cost advantage by being a factor 100 cheaper than Ag. With the aim to achieve a low-pressure Cu sintering process, a low cost wet chemical etching process is developed to selectively etch Zn from brass to create nano-porous surface modifications to enhance sinterability, enabling sintering with low bonding pressure of 1MPa and at temperatures below 300°C. However, high tendency of Cu to oxidize poses a major challenge in realizing stable interconnects. For this purpose, in this contribution, we present the use of polyethylene-glycol 600 as reducing binder in the formulation of the Cu sintering paste. Finally, we propose a multi-pronged approach based on three crucial factors: surface-modified substrates, nanostructured surface modifications on micro-scale Cu-alloy particles and use of a reducing binder in the Cu particle paste.

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