Curing behavior and properties of high biosourced epoxy resin blends based on a triepoxy monomer and a tricarboxylic acid hardener from 10-undecenoic acid

2020 ◽  
Vol 81 ◽  
pp. 106208 ◽  
Author(s):  
Juan P. Espinosa ◽  
Vivina Hanazumi ◽  
Pablo M. Stefani ◽  
Roxana A. Ruseckaite
Keyword(s):  
Epoxy Resin ◽  
Tricarboxylic Acid ◽  
Curing Behavior ◽  
Undecenoic Acid

Novel phosphorus-containing imidazolium as hardener for epoxy resin aiming at controllable latent curing behavior and flame retardancy

2020 ◽  
Vol 184 ◽  
pp. 107673 ◽  
Author(s):  
Ying-Jun Xu ◽  
Xiao-Hui Shi ◽  
Jia-Hui Lu ◽  
Min Qi ◽  
De-Ming Guo ◽  
...  
Keyword(s):  
Epoxy Resin ◽  
Flame Retardancy ◽  
Curing Behavior ◽  
Phosphorus Containing

Curing Behavior of Epoxy Resin Using Controllable Curing Agents Based on Nickel Complexes

2006 ◽  
Vol 291 (2) ◽  
pp. 181-193 ◽  
Author(s):  
Abdollah Omrani ◽  
Mousa Ghaemy ◽  
Abbas A. Rostami
Keyword(s):  
Epoxy Resin ◽  
Nickel Complexes ◽  
Curing Behavior ◽  
Curing Agents

Curing Behavior of an Epoxy Resin with Hardener Formulations Composed of MDI-phenol Adduct and Diethylenetriamine

Polymer Korea ◽  
2018 ◽  
Vol 42 (1) ◽  
pp. 1-7 ◽  
Author(s):  
Daejung Kim ◽  
Dai-Soo Lee ◽  
Youn-Sik Lee
Keyword(s):  
Epoxy Resin ◽  
Curing Behavior

Curing behavior of dicyandiamide/epoxy resin system using different accelerators

2013 ◽  
Vol 22 (8) ◽  
pp. 591-598 ◽  
Author(s):  
Mehran Hayaty ◽  
Hengameh Honarkar ◽  
Mohammad Hosain Beheshty
Keyword(s):  
Epoxy Resin ◽  
Resin System ◽  
Curing Behavior ◽  
Epoxy Resin System

scholarly journals Synthesis, Thermal Properties and Curing Kinetics of Hyperbranched BPA/PEG Epoxy Resin

Polymers ◽  
2019 ◽  
Vol 11 (10) ◽  
pp. 1545 ◽  
Author(s):  
Tossapol Boonlert-uthai ◽  
Chavakorn Samthong ◽  
Anongnat Somwangthanaroj
Keyword(s):  
Activation Energy ◽  
Thermal Properties ◽  
Epoxy Resin ◽  
Epoxy Group ◽  
Dendritic Structure ◽  
Curing Kinetics ◽  
Degree Of Branching ◽  
Curing Behavior ◽  
Branching Point ◽  
High Degree

The hyperbranched epoxy resins (HBE) composed of bisphenol A (BPA) and polyethylene glycol (PEG) as reactants and pentaerythritol as branching point were successfully synthesized via A2 + B4 polycondensation reaction at various BPA/PEG ratios. The 13C NMR spectra revealed that the synthesized HBE mainly had a dendritic structure as confirmed by the high degree of branching (DB). The addition of PEG in the resin enhanced degree of branching (DB) (from 0.82 to 0.90), epoxy equivalent weight (EEW) (from 697 g eq−1 to 468 g eq−1) as well as curing reaction. Adding 5–10 wt.% PEG in the resin decreased the onset and peak curing temperatures and glass transition temperature; however, adding 15 wt.% PEG in the resin have increased these thermal properties due to the lowest EEW. The curing kinetics were evaluated by fitting the experimental data of the curing behavior of all resins with the Šesták–Berggren equation. The activation energy increased with the increase of PEG in the resins due to HBE’s steric hindrance, whereas the activation energy of HBE15P decreased due to a large amount of equivalent active epoxy group per mass sample. The curing behavior and thermal properties of obtained hyperbranched BPA/PEG epoxy resin would be suitable for using in electronics application.

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