Effect of selective localization on dielectric properties of boron nitride nanofiller filled linear low density polyethylene (LLDPE)/silicone rubber (SR) blends

2016 ◽  
Vol 56 ◽  
pp. 131-139 ◽  
Author(s):  
I.N. Hidayah ◽  
M. Mariatti ◽  
H. Ismail ◽  
M. Kamarol
Keyword(s):  
Dielectric Properties ◽  
Boron Nitride ◽  
Silicone Rubber ◽  
Low Density Polyethylene ◽  
Low Density ◽  
Linear Low Density Polyethylene ◽  
Selective Localization

Linear low-density polyethylene/silicone rubber nanocomposites

2017 ◽  
Vol 50 (1) ◽  
pp. 36-57 ◽  
Author(s):  
Nurul Hidayah ◽  
Mariatti Mustapha ◽  
Hanafi Ismail ◽  
Mohamad Kamarol
Keyword(s):  
Silicone Rubber ◽  
Performance Optimization ◽  
Small Variation ◽  
Volume Resistivity ◽  
Dielectric Strength ◽  
Low Density Polyethylene ◽  
Low Density ◽  
Linear Low Density Polyethylene ◽  
Content Type ◽  
The Relationship

This study determines the applicability of nanofillers (silica, boron nitride, and zinc oxide) in linear low-density polyethylene (LLDPE)/silicone rubber (SR) insulation compounds. Design of experiment is adopted to model the relationship between the properties (permittivity, loss tangent, dielectric strength, and volume resistivity) and factors (SR content, type of nanofiller, and nanofiller loading) for performance optimization. It is observed that SR content and type of nanofiller significantly influence the electrical properties of LLDPE/SR nanocomposites. Nanofiller loading, however, causes a small variation in the properties of the nanocomposites except for dielectric strength. From the optimization, it is found that the optimum formulation composition is 10 wt% of SR and 2 vol% of nanoboron nitride.

scholarly journals Boron Nitride-Filled Linear Low-Density Polyethylene for Enhanced Thermal Transport: Continuous Extrusion of Micro-Textured Films

Polymers ◽  
2021 ◽  
Vol 13 (19) ◽  
pp. 3393
Author(s):  
Özgün Güzdemir ◽  
Sagar Kanhere ◽  
Victor Bermudez ◽  
Amod A. Ogale
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Surface Area ◽  
Thermal Transport ◽  
Polymer Materials ◽  
Low Density Polyethylene ◽  
Packaging Materials ◽  
Low Density ◽  
Linear Low Density Polyethylene ◽  
Continuous Extrusion

With shrinking size of electronic devices, increasing performance and accompanying heat dissipation, there is a need for efficient removal of this heat through packaging materials. Polymer materials are attractive packaging materials given their low density and electrical insulating properties, but they lack sufficient thermal conductivity that inhibits heat transfer rate. Hexagonal boron nitride (BN) possesses excellent thermal conductivity and is also electrically insulating, therefore BN-filled polymer composites were investigated in this study. Results showed successful continuous extrusion of BN-filled linear low-density polyethylene through micro-textured dies that is a scalable manufacturing process. Through-thickness thermal conductivity measurements established that 30 vol% BN content led to an over 500% increase in thermal conductivity over that of pure polymer. Textured film surface provided about a 50% increase in surface area when compared with non-textured films. This combination of increased surface area and enhanced thermal conductivity of BN-filled textured films indicates their potential application for improved convective thermal transport.

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