Improvement in thermal conductivity of paraffin by adding high aspect-ratio carbon-based nano-fillers

2013 ◽  
Vol 377 (19-20) ◽  
pp. 1358-1361 ◽  
Author(s):  
Hasan Babaei ◽  
Pawel Keblinski ◽  
J.M. Khodadadi
Keyword(s):  
Thermal Conductivity ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Carbon Based

scholarly journals Mechanically Improved and Multifunctional CFRP Enabled by Resins with High Concentrations Epoxy-Functionalized Fluorographene Fillers

2021 ◽  
Author(s):  
Junhua Wei
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Elastic Modulus ◽  
Carbon Fiber ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Reinforcing Particles ◽  
Thermoset Resin ◽  
High Concentrations ◽  
Carbon Based

To meet the maximum potential of the mechanical properties of carbon fiber reinforced plastics (CFRP), stress transfer between the carbon fibers through the polymer matrix must be improved. A recent promising approach reportedly used reinforcing particles as fillers dispersed in the resin. Carbon based fillers are an excellent candidate for such reinforcing particles due to their intrinsically high mechanical properties, structure and chemical nature similar to carbon fiber and high aspect ratio. They have shown great potential in increasing the strength, elastic modulus and other mechanical properties of interest of CFRPs. However, a percolation threshold of ~1% of the carbon-based particle concentration in the base resin has generally been reported, beyond which the mechanical properties deteriorate due to particle agglomeration. As a result, the potential for further increase of the mechanical properties of CFRPs with carbon-based fillers is limited. We report a significant increase in the strength and elastic modulus of CFRPs, achieved with a novel reinforced thermoset resin that contains high loadings of epoxy-reacted fluorographene (ERFG) fillers. We found that the improvement in mechanical performance of CFRPs was correlated with increase in ERFG loading in the resin. Using a novel thermoset resin containing 10 wt% ERFG filler, CFRPs fabricated by wet layup technique with twill weaves showed a 19.6% and 17.7% increase in the elastic modulus and tensile strength respectively. In addition, because of graphene’s high thermal conductivity and high aspect ratio, the novel resin enhanced CFRPs possessed 59.3% higher through-plane thermal conductivity and an 81-fold reduction in the hydrogen permeability. The results of this study demonstrate that high loadings of functionalized particles dispersed in the resin is a viable path towards fabrication of improved, high-performance CFRP parts and systems.

Effects of Variable Viscosity and Thermal Conductivity of CuO-Water Nanofluid on Heat Transfer Enhancement in Natural Convection: Mathematical Model and Simulation

2010 ◽  
Vol 132 (5) ◽  
Author(s):  
Eiyad Abu-Nada
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Nusselt Number ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Average Nusselt Number ◽  
Volume Fraction ◽  
Variable Viscosity ◽  
Cylinder Surface ◽  
Transfer Enhancement

Heat transfer enhancement in horizontal annuli using variable thermal conductivity and variable viscosity of CuO-water nanofluid is investigated numerically. The base case of simulation used thermal conductivity and viscosity data that consider temperature property dependence and nanoparticle size. It was observed that for Ra≥104, the average Nusselt number was deteriorated by increasing the volume fraction of nanoparticles. However, for Ra=103, the average Nusselt number enhancement depends on aspect ratio of the annulus as well as volume fraction of nanoparticles. Also, for Ra=103, the average Nusselt number was less sensitive to volume fraction of nanoparticles at high aspect ratio and the average Nusselt number increased by increasing the volume fraction of nanoaprticles for aspect ratios ≤0.4. For Ra≥104, the Nusselt number was deteriorated everywhere around the cylinder surface especially at high aspect ratio. However, this reduction is only restricted to certain regions around the cylinder surface for Ra=103. For Ra≥104, the Maxwell–Garnett and the Chon et al. conductivity models demonstrated similar results. But, there was a deviation in the prediction at Ra=103 and this deviation becomes more significant at high volume fraction of nanoparticles. The Nguyen et al. data and the Brinkman model give completely different predictions for Ra≥104, where the difference in prediction of the Nusselt number reached 50%. However, this difference was less than 10% at Ra=103.

Cross-Linked Carbon Nanotube Heat Spreader

2014 ◽  
Vol 1752 ◽  
pp. 131-136
Author(s):  
Gregory A. Konesky
Keyword(s):  
Thermal Conductivity ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Ion Beam ◽  
Healing Process ◽  
High Surface ◽  
High Surface Area ◽  
Self Healing ◽  
Spreading Effect ◽  
Heat Spreaders

ABSTRACTAmong the exceptional properties of isolated individual carbon nanotubes (CNTs), exceptional thermal conductivity along their axis has been demonstrated, However they have also shown poor thermal transfer between adjacent CNTs. Thick bundles of aligned CNTs have been used as heat pipes, but the thermal input and output power densities are the same, providing no heat spreading effect. We demonstrate the use of energetic argon ion beams to join overlapping CNTs in a thin film to form an interpenetrating network with an isotropic thermal conductivity of 2150 W/m K. Such thin films may be used as heat spreaders to enlarge the thermal footprint of laser diodes and CPU chips, for example, for enhanced cooling. At higher ion energies and fluence, the CNTs appear to collapse and reform, aligned parallel to the ion beam axis, and form dense high aspect ratio tapered structures. The high surface area of these structures lends themselves to applications in energy storage, for example. We consider the mechanisms of energetic ion interaction with CNTs and junction formation of two overlapping CNTs during the subsequent self-healing process, as well as the formation of high aspect ratio structures under more extreme conditions

Engineering the coefficient of thermal expansion and thermal conductivity of polymers filled with high aspect ratio silica nanofibers

2014 ◽  
Vol 58 ◽  
pp. 228-234 ◽  
Author(s):  
Liyun Ren ◽  
Kamyar Pashayi ◽  
Hafez Raeisi Fard ◽  
Shiva Prasad Kotha ◽  
Theodorian Borca-Tasciuc ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Coefficient Of Thermal Expansion ◽  
Silica Nanofibers

A Titanium Based Flat Heat Pipe

2008 ◽  
Author(s):  
Changsong Ding ◽  
Gaurav Soni ◽  
Payam Bozorgi ◽  
Brian Piorek ◽  
Carl D. Meinhart ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Aspect Ratio ◽  
Heat Pipe ◽  
Carrying Capacity ◽  
High Aspect Ratio ◽  
Capillary Flow ◽  
Titanium Substrate ◽  
Heat Pipes ◽  
Working Fluid ◽  
Wick Structure

We are developing innovative heat pipes based on Nano-Structured Titania (NST) with a potential for high heat carrying capacity and high thermal conductivity. These heat pipes have a flat geometry as opposed to a cylindrical geometry found in conventional heat pipes. The flatness will enable a good contact with microprocessor chips and thus reduce the thermal contact resistance. We refer to it as a Thermal Ground Plane (TGP) because of its flat and thin geometry. It will provide the ability to cool the future generations of power intensive microprocessor chips and circuit boards in an efficient way. It also brings the potential to function in high temperature (>150°C) fields because of its high yield strength and compatibility [1]. The TGP is fabricated with Titanium. It adopts the recently developed high aspect ratio Ti processing techniques [2] and laser packaging techniques. The three main components of the TGP are 1) a fine wick structure based on arrays of high aspect ratio Ti pillars and hair like structures of Nano-Structured Titania (NST), 2) A shallow Ti cavity welded onto the wick structure and 3) the working fluid, water, sealed between the cavity and the wick. The heat carrying capacity and the thermal conductivity of a heat pipe are generally determined by the speed of capillary flow of the working fluid through its wick. The TGP wick has the potential to generate high flow rates and to meet the growing challenges faced by electronics cooling community. The TGP wick structure, developed by etching high aspect ratio pillars in a titanium substrate and growing nano scale hairs on the surface of the pillars, is super hydrophilic and capable of wicking water at velocities ∼ 10−2 m/s over distances of several centimeters. The thermal conductivity of the current TGP device was measured to be k = 350 W/m·K. The completed TGP device has the potential of attaining a higher conductivity by improving the wicking material and of carrying higher power density. Washburn equation [3] for dynamics of capillary flow has been employed to explain the results of our experiments. The experiment shows a good agreement with Washburn equation.

Sign in / Sign up

Export Citation Format

Share Document