Erratum to: “The penetrable-sphere fluid in the high-temperature, high-density limit” [Phys. Lett. A 323 (2004) 427]

2012 ◽  
Vol 376 (33) ◽  
pp. 2274-2275 ◽  
Author(s):  
Luis Acedo ◽  
Andrés Santos
Keyword(s):  
High Temperature ◽  
High Density ◽  
Density Limit

scholarly journals The penetrable-sphere fluid in the high-temperature, high-density limit

2004 ◽  
Vol 323 (5-6) ◽  
pp. 427-433 ◽  
Author(s):  
Luis Acedo ◽  
Andrés Santos
Keyword(s):  
High Temperature ◽  
High Density ◽  
Density Limit

Impact of Metal Pad Etch-Induced Plasma Damage on Dynamic Retention Time Degradation during High Temperature Stress in High Density DRAM Technology

2005 ◽  
Author(s):  
D-J Kim ◽  
I-G Kim ◽  
J-Y Noh ◽  
H-J Lee ◽  
S-H Park ◽  
...  
Keyword(s):  
High Temperature ◽  
Temperature Stress ◽  
Retention Time ◽  
High Temperature Stress ◽  
High Density ◽  
Cell Junction ◽  
Antenna Effect ◽  
Plasma Damage ◽  
Root Cause ◽  
Wafer Processing

Abstract As DRAM technology extends into 12-inch diameter wafer processing, plasma-induced wafer charging is a serious problem in DRAM volume manufacture. There are currently no comprehensive reports on the potential impact of plasma damage on high density DRAM reliability. In this paper, the possible effects of floating potential at the source/drain junction of cell transistor during high-field charge injection are reported, and regarded as high-priority issues to further understand charging damage during the metal pad etching. The degradation of block edge dynamic retention time during high temperature stress, not consistent with typical reliability degradation model, is analyzed. Additionally, in order to meet the satisfactory reliability level in volume manufacture of high density DRAM technology, the paper provides the guidelines with respect to plasma damage. Unlike conventional model as gate antenna effect, the cell junction damage by the exposure of dummy BL pad to plasma, was revealed as root cause.

scholarly journals High-density Néel-type magnetic skyrmion phase stabilized at high temperature

2020 ◽  
Vol 12 (1) ◽  
Author(s):  
Hee Young Kwon ◽  
Kyung Mee Song ◽  
Juyoung Jeong ◽  
Ah-Yeon Lee ◽  
Seung-Young Park ◽  
...  
Keyword(s):  
High Temperature ◽  
High Density ◽  
Low Density ◽  
Memory Devices ◽  
Magnetic Multilayer ◽  
Multilayer Systems ◽  
Micromagnetic Simulations ◽  
Transmission Electron ◽  
Ultrahigh Density ◽  
Lorentz Transmission Electron Microscopy

AbstractThe discovery of a thermally stable, high-density magnetic skyrmion phase is a key prerequisite for realizing practical skyrmionic memory devices. In contrast to the typical low-density Néel-type skyrmions observed in technologically viable multilayer systems, with Lorentz transmission electron microscopy, we report the discovery of a high-density homochiral Néel-type skyrmion phase in magnetic multilayer structures that is stable at high temperatures up to 733 K (≈460 °C). Micromagnetic simulations reveal that a high-density skyrmion phase can be stabilized at high temperature by deliberately tuning the magnetic anisotropy, magnetic field, and temperature. The existence of the high-density skyrmion phase in a magnetic multilayer system raises the possibility of incorporating chiral Néel-type skyrmions in ultrahigh-density spin memory devices. Moreover, the existence of this phase at high temperature shows its thermal stability, demonstrating the potential for skyrmion devices operating in thermally challenging modern electronic chips.

Manufacturability Study for Etching High-Density BST/Pt Capacitors

2000 ◽  
Vol 655 ◽  
Author(s):  
Jay Hwang
Keyword(s):  
High Temperature ◽  
Etch Rate ◽  
Control Process ◽  
High Density ◽  
Wafer Surface ◽  
Plasma Chamber ◽  
Reactive Plasma ◽  
Pt Electrodes ◽  
Profile Control

AbstractProfile control, process repeatability and productivity concerns in etching Pt electrodes are reviewed specifically for application in fabricating high-density BST/Pt capacitors. The approach of using a high temperature cathode in a high-density reactive plasma chamber has produced a repeatable >85° Pt profile, stable etch rate and low particle results over a 500-wafer marathon test. A “corrosion-like” BST defect can be prevented by adding a post etch treatment to remove any corrosive residue from the wafer surface. A feasible manufacturing solution for etching BST/Pt capacitors for future high-density DRAM application is demonstrated.

The Feasibility for Potassium-Based Phosphate Brines To Serve as High-Density Solid-Free Well-Completion Fluids in High-Temperature/High-Pressure Formations

SPE Journal ◽  
2018 ◽  
Vol 24 (05) ◽  
pp. 2033-2046 ◽  
Author(s):  
Hu Jia ◽  
Yao–Xi Hu ◽  
Shan–Jie Zhao ◽  
Jin–Zhou Zhao
Keyword(s):  
High Pressure ◽  
High Temperature ◽  
Oil And Gas ◽  
Pressure Coefficient ◽  
High Density ◽  
Well Drilling ◽  
Well Completion ◽  
Oil And Gas Resources ◽  
Completion Fluids ◽  
High Temperature High Pressure

Summary Many oil and gas resources in deep–sea environments worldwide are often located in high–temperature/high–pressure (HT/HP) and low–permeability reservoirs. The reservoir–pressure coefficient usually exceeds 1.6, with formation temperature greater than 180°C. Challenges are faced for well drilling and completion in these HT/HP reservoirs. A solid–free well–completion fluid with safety density greater than 1.8 g/cm3 and excellent thermal endurance is strongly needed in the industry. Because of high cost and/or corrosion and toxicity problems, the application of available solid–free well–completion fluids such as cesium formate brines, bromine brines, and zinc brines is limited in some cases. In this paper, novel potassium–based phosphate well–completion fluids were developed. Results show that the fluid can reach the maximum density of 1.815 g/cm3 at room temperature, which makes a breakthrough on the density limit of normal potassium–based phosphate brine. The corrosion rate of N80 steel after the interaction with the target phosphate brine at a high temperature of 180°C is approximately 0.1853 mm/a, and the regained–permeability recovery of the treated sand core can reach up to 86.51%. Scanning–electron–microscope (SEM) pictures also support the corrosion–evaluation results. The phosphate brine shows favorable compatibility with the formation water. The biological toxicity–determination result reveals that it is only slightly toxic and is environmentally acceptable. In addition, phosphate brine is highly effective in inhibiting the performance of clay minerals. The cost of phosphate brine is approximately 44 to 66% less than that of conventional cesium formate, bromine brine, and zinc brine. This study suggests that the phosphate brine can serve as an alternative high–density solid–free well–completion fluid during well drilling and completion in HT/HP reservoirs.

scholarly journals Correlation energy of two electrons in the high-density limit

2009 ◽  
Vol 131 (24) ◽  
pp. 241101 ◽  
Author(s):  
Pierre-François Loos ◽  
Peter M. W. Gill
Keyword(s):  
Correlation Energy ◽  
High Density ◽  
Density Limit

scholarly journals Ising model in the high density limit

1974 ◽  
Vol 36 (4) ◽  
pp. 255-262 ◽  
Author(s):  
Colin J. Thompson
Keyword(s):  
Ising Model ◽  
High Density ◽  
Density Limit

Anomalous reflection properties in high density limit fibril shaped PIC-J aggregates in microcavity structure

2011 ◽  
Vol 8 (2) ◽  
pp. 595-597 ◽  
Author(s):  
Yuki Obara ◽  
Keita Saitoh ◽  
Masaru Oda ◽  
Toshiro Tani
Keyword(s):  
High Density ◽  
Density Limit ◽  
Anomalous Reflection ◽  
J Aggregates
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