scholarly journals Superconductivity in Ag implanted Au thin film

2021 ◽  
Vol 601 ◽  
pp. 412607
Author(s):  
Manas Kumar Dalai ◽  
Braj Bhusan Singh ◽  
Salila Kumar Sethy ◽  
Satyaprakash Sahoo ◽  
Subhankar Bedanta
Keyword(s):  
Thin Film ◽  
Au Thin Film

scholarly journals A Wedge-Shaped Au Thin Film: Integrating Multiple Surface Plasmon Resonance Sensors in a Single Chip and Enhancing the Figure of Merit

2021 ◽  
Vol 3 ◽  
Author(s):  
Hiromasa Shimizu ◽  
Takahiro Ogura ◽  
Takumi Maeda ◽  
Shogo Suzuki
Keyword(s):  
Thin Film ◽  
Surface Plasmon Resonance ◽  
Surface Plasmon ◽  
Plasmon Resonance ◽  
Figure Of Merit ◽  
Refractive Index Change ◽  
Electron Beam Evaporation ◽  
Attenuated Total Reflection ◽  
Single Chip ◽  
Au Thin Film

We show here the design, fabrication, and characterization of a wedge-shaped Au thin film with an enhanced figure of merit (FOM). This is achieved by using a reflectivity change in an attenuated total reflection (ATR) setup by slightly modulating the wavenumber of the surface plasmon polariton by means of the varying thickness of the Au thin film. The wedge-shaped Au thin film is equivalent to multiple surface plasmon resonance (SPR) transducers integrated in a single chip and was fabricated by an electron-beam evaporation process with the position of the shutter controlled during the deposition. The FOM, defined as the difference between the maximum and minimum values of the normalized reflectivity change (ΔR/R) divided by the corresponding difference of the incident angles, was 8.0-times larger than that based on the reflectivity R. Also, we demonstrated that the wedge-shaped Au thin film was able to detect ethanol gas at a concentration of 0.2%, corresponding to a refractive index change of 2 × 10−5, without any surface functionalization. Since the sensing signal can be obtained with a single image from the wedge-shaped Au thin film without precise thickness control of the metal thickness, no other materials or modulation equipment is necessary, and the sensing chip can be employed in simple and highly sensitive systems.

scholarly journals Gold Nanofilm-Coated Porous Silicon as Surface-Enhanced Raman Scattering Substrate

2019 ◽  
Vol 9 (22) ◽  
pp. 4806 ◽  
Author(s):  
Ibrahim Khalil ◽  
Chia-Man Chou ◽  
Kun-Lin Tsai ◽  
Steven Hsu ◽  
Wageeh A. Yehye ◽  
...  
Keyword(s):  
Thin Film ◽  
Porous Silicon ◽  
Raman Scattering ◽  
Film Thickness ◽  
Sers Substrate ◽  
Au Film ◽  
Surface Enhanced ◽  
Surface Enhanced Raman ◽  
Enhanced Raman Scattering ◽  
Au Thin Film

Metallic film-coated porous silicon (PSi) has been reported as a lucrative surface-enhanced Raman scattering (SERS) substrate. The solution-based fabrication process is facile and easy; however, it requires additional reducing agent and extra chemical treatment, as well as hinders the suitability as a reproducible SERS substrate due to irregular hot spot generation via irregular deposition of metallic nanocrystallites. To address this issue, we report a unique one-step electronic beam (e-beam) physical vapor deposition (PVD) method to fabricate a consistent layer of gold (Au) nanofilm on PSi. Moreover, to achieve the best output as a SERS substrate, PSi prepared by electrochemical etching was used as template to generate an Au layer of irregular surface, offering the surface roughness feature of the PSi–Au thin film. Furthermore, to investigate the etching role and Au film thickness, Au-nanocrystallites of varying thickness (5, 7, and 10 nm) showing discrete surface morphology were characterized and evaluated for SERS effect using Rhodamine 6G (R6G). The SERS signal of R6G adsorbed on PSi–Au thin film showed a marked enhancement, around three-fold enhancement factor (EF), than the Si–Au thin film. The optimal SERS output was obtained for PSi–Au substrate of 7 nm Au film thickness. This study thus indicates that the SERS enhancement relies on the Au film thickness and the roughness feature of the PSi–Au substrate.

Investigation of dead-layer thickness in SrRuO3/Ba0.5Sr0.5TiO3/Au thin-film capacitors

2001 ◽  
Vol 78 (12) ◽  
pp. 1724-1726 ◽  
Author(s):  
L. J. Sinnamon ◽  
R. M. Bowman ◽  
J. M. Gregg
Keyword(s):  
Thin Film ◽  
Layer Thickness ◽  
Dead Layer ◽  
Thin Film Capacitors ◽  
Dead Layer Thickness ◽  
Au Thin Film

Dynamic Soft Templating of Monolithic Au Thin Film Electrodeposited from Bicontinuous Microemulsion

2020 ◽  
Vol MA2020-02 (17) ◽  
pp. 1485-1485
Author(s):  
Shunsuke Shiba ◽  
Shoei Hirabayashi ◽  
Osamu Niwa ◽  
Dai Kato ◽  
Masashi Kunitake ◽  
...  
Keyword(s):  
Thin Film ◽  
Bicontinuous Microemulsion ◽  
Soft Templating ◽  
Au Thin Film

Hardness Determination of Au Thin Film by Nanoindentation Technique: A Comparative Study on Various Characterizing Methods

2007 ◽  
Author(s):  
Xiangyang Zhou ◽  
Zhuangde Jiang ◽  
Hairong Wang
Keyword(s):  
Thin Film ◽  
Image Method ◽  
Metallic Thin Films ◽  
Constant Modulus ◽  
Sem Image ◽  
Pile Up ◽  
Traditional Area ◽  
Hard Substrates ◽  
Au Thin Film

The purpose of this paper is to find a reliable method for determining the hardnesses of soft metallic thin films on hard substrates. Based on the nanoindention experimental data for a 504 nm Au thin film deposited on glass substrate system, several possible methods are applied and the results come from them are compared. The results reveal that the Oliver-Pharr method is strongly influenced by the material pile-up behavior and substrate effect that leads to an erroneously overestimated hardness. However, the methods based on traditional area calculations by SEM image, work of indentation principles during the indentation cycle and constant modulus assumption calculations all can effectively avoid the effect of pile-up and minimize that of substrate. Among three, the results from indentation method are obviously much higher than those from other two. Hence we argue that the results by SEM image method and constant modulus assumption calculations are more reasonable.

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