Study of barrier layer capacitance effect in lead free Ba0.95Sr0.05(Fe0.5Nb0.5)O3–BaZr0.1Ti0.9O3 ceramics

Colossal internal barrier layer capacitance effect in polycrystalline copper (II) oxide

Applied Physics Letters ◽

10.1063/1.2834854 ◽

2008 ◽

Vol 92 (2) ◽

pp. 022905 ◽

Cited By ~ 48

Author(s):

Sudipta Sarkar ◽

Pradip Kumar Jana ◽

B. K. Chaudhuri

Keyword(s):

Barrier Layer ◽

Polycrystalline Copper ◽

Internal Barrier ◽

Capacitance Effect

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Effective suppression of electromigration-induced Cu dissolution by using Ag as a barrier layer in lead-free solder joints

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2013.02.053 ◽

2013 ◽

Vol 564 ◽

pp. 35-41 ◽

Cited By ~ 12

Author(s):

Chao-hong Wang ◽

Han-ting Shen ◽

Wei-han Lai

Keyword(s):

Barrier Layer ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Effective Suppression ◽

Free Solder ◽

Cu Dissolution

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Internal Barrier Layer Capacitance Effect in Hexagonal Perovskite Ba4YMn3O11.5Ceramics

Chemistry of Materials ◽

10.1021/cm0612752 ◽

2006 ◽

Vol 18 (21) ◽

pp. 5130-5136 ◽

Cited By ~ 29

Author(s):

Xiaojun Kuang ◽

Craig Bridges ◽

Mathieu Allix ◽

John B. Claridge ◽

Helen Hughes ◽

...

Keyword(s):

Barrier Layer ◽

Internal Barrier ◽

Capacitance Effect

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Study of under bump metallisation barrier layer for lead‐free solder

Soldering & Surface Mount Technology ◽

10.1108/09540910310479521 ◽

2003 ◽

Vol 15 (2) ◽

pp. 46-52 ◽

Cited By ~ 17

Author(s):

K.C. Chan ◽

Z.W. Zhong ◽

K.W. Ong

Keyword(s):

Barrier Layer ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

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Deposited emulsion particles in the pores of aluminum oxide film

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100109392 ◽

1978 ◽

Vol 36 (1) ◽

pp. 450-451

Author(s):

Michio Ashida ◽

Yasukiyo Ueda

Keyword(s):

Oxide Film ◽

Acid Solution ◽

Barrier Layer ◽

Colloidal Particles ◽

Oxalic Acid Solution ◽

Anodic Oxide ◽

Anodic Oxide Film ◽

Carbon Replica ◽

Sectioning Method ◽

Thin Sectioning

An anodic oxide film is formed on aluminum in an acidic elecrolyte during anodizing. The structure of the oxide film was observed directly by carbon replica method(l) and ultra-thin sectioning method(2). The oxide film consists of barrier layer and porous layer constructed with fine hexagonal cellular structure. The diameter of micro pores and the thickness of barrier layer depend on the applying voltage and electrolyte. Because the dimension of the pore corresponds to that of colloidal particles, many metals deposit in the pores. When the oxide film is treated as anode in emulsion of polyelectrolyte, the emulsion particles migrate onto the film and deposit on it. We investigated the behavior of the emulsion particles during electrodeposition.Aluminum foils (99.3%) were anodized in either 0.25M oxalic acid solution at 30°C or 3M sulfuric acid solution at 20°C. After washing with distilled water, the oxide films used as anode were coated with emulsion particles by applying voltage of 200V and then they were cured at 190°C for 30 minutes.

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