An application of gold diffusion for defect investigation in silicon

2009 ◽  
Vol 404 (23-24) ◽  
pp. 4681-4684 ◽  
Author(s):  
O.V. Feklisova ◽  
E.B. Yakimov
Keyword(s):  
Gold Diffusion ◽  
Defect Investigation

Assessment of the Performance and Defect Investigation of PV Modules after Accelerated Ageing Tests

2013 ◽  
Vol 1 ◽  
pp. 866-872 ◽  
Author(s):  
J.A. Tsanakas ◽  
M. Karoglou ◽  
E.T. Delegou ◽  
P.N. Botsaris ◽  
A. Bakolas ◽  
...  
Keyword(s):  
Accelerated Ageing ◽  
Pv Modules ◽  
Defect Investigation

Comments on “gold diffusion and bulk vacancy generation in silicon”, by J. L. Lambert

1971 ◽  
Vol 5 (3) ◽  
pp. K213-K215
Author(s):  
F. A. Huntley ◽  
A. F. W. Willoughby
Keyword(s):  
Vacancy Generation ◽  
Gold Diffusion

Light-enhanced gold diffusion in silicon

1974 ◽  
Vol 25 (2) ◽  
pp. K133-K136 ◽  
Author(s):  
P. Z. Borukhovich ◽  
A. E. Kiv ◽  
V. I. Kimarskii ◽  
A. I. Koifman ◽  
O. R. Niyazova
Keyword(s):  
Gold Diffusion

Crystal Defect Investigation in PVT-Grown ZnSe Under Different Seeding Conditions and Growth Configurations Using Synchrotron X-Ray Topography

2021 ◽  
Vol MA2021-02 (32) ◽  
pp. 951-951
Author(s):  
Qianyu Cheng ◽  
Zeyu Chen ◽  
Hongyu Peng ◽  
Yafei Liu ◽  
Shanshan Hu ◽  
...  
Keyword(s):  
Crystal Defect ◽  
X Ray ◽  
Defect Investigation

Defect Investigation of Plastically Deformed Al 5454 Wrought Alloy Using PADBS and Electrical Measurements

2008 ◽  
Vol 278 ◽  
pp. 1-10 ◽  
Author(s):  
M. Abdel-Rahman ◽  
N.A. Kamel ◽  
Yahia A. Lotfy ◽  
Emad A. Badawi ◽  
M.A. Abdel-Rahman
Keyword(s):  
Positron Annihilation ◽  
Materials Science ◽  
Diagnostic Techniques ◽  
Electrical Measurements ◽  
Nondestructive Technique ◽  
Dislocation Densities ◽  
Trapping Model ◽  
Wrought Aluminum Alloys ◽  
Wrought Aluminum ◽  
Defect Investigation

Positron Annihilation Doppler Broadening Spectroscopy (PADPS) is a nondestructive technique used in materials science. Electrical measurements are one of the oldest techniques also used in materials science. This paper aims to discuss the availability of using both PADPS and electrical measurements as diagnostic techniques to detect defects in a set of plastically deformed 5454 wrought aluminum alloys. The results of the positron annihilation measurements and the electrical measurements were analyzed in terms of the two-state trapping model. This model can be used to investigate both the defect and dislocation densities of the samples under investigation. Results obtained by both nuclear and electrical techniques have been reported.

Stem-Stebic Technique for Defect Investigation in Semiconductor Photovoltaic Materials

1991 ◽  
pp. 529-532
Author(s):  
M. Garozzo ◽  
A. Parretta ◽  
M. Vittori ◽  
A. Camanzi ◽  
P. Alessandrini
Keyword(s):  
Photovoltaic Materials ◽  
Defect Investigation

Rugged ICs against Corrosion, Shock plus Hotter Temperatures

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000343-000348 ◽  
Author(s):  
James J. Wang
Keyword(s):  
Liquid Crystal Display ◽  
Low Cost ◽  
High Volume ◽  
Operating Life ◽  
Gold Plating ◽  
Package Design ◽  
Display Driver ◽  
Ball Bonding ◽  
Engineering Effort ◽  
Gold Diffusion

More applications need microcontrollers to operate at higher temperatures. ICs must survive faster corrosion rate and higher stresses. Improving wire bonding, mold compound or package design requires engineering effort, long evaluation and cost. Because packages are already optimized, further optimization often does not yield the needed improvements. Without changing either chip design or the packaging, one can achieve high temperature reliability by protecting ICs with a gold, over passivation metal (OPM). Low cost CMOS liquid crystal display driver ICs are plated with gold bumps at high volume. Similar gold plating process can be quickly and cheaply implemented over all microcontrollers. Between ICs to the electroplated gold OPM is a barrier metal that slows gold diffusion into aluminum and thereby increases operating life before Au-Al intermetallic wire bond failure. Reliability is improved 6x to 94x under different test conditions. Ball bonding to gold pads are 10% to 40% stronger than onto aluminum pads. Furthermore, gold-gold mono-metallic bonds are ductile and can withstand stresses of extreme package reliability tests consisting of: AATC, MSL1 preconditioning, autoclave and then 190C HTB for 1000 hours. Ductile bonds can strain under mechanical stress and shock. Gold is resistant against corrosion such that packaged ICs survive reliability tests causing mold compound delamination and then moisture ingress from autoclave.

Sign in / Sign up

Export Citation Format

Share Document